Chinese semiconductor industry

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tokenanalyst

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Evolution Semiconductor completed the A-round financing of nearly 100 million yuan, and is a fourth-generation semiconductor material company

Evolution Semiconductor (Shenzhen) Co., Ltd. (hereinafter referred to as "Evolution Semiconductor") completed a round of financing of nearly 100 million yuan, led by Zhonghe Automobile Fund and Tongchuang Weiye, Guofa Venture Capital, Shenzhen High-tech Investment , Zheshang Venture Capital, Thai Finance Capital and other well-known investment institutions followed suit, and the old shareholder Vertex Investment firmly added. This round of financing will be mainly used for continuous R&D investment and team expansion.
Founded in 2021, Evolution Semiconductor is a compound semiconductor substrate company featuring the world's first iridium-free process to prepare gallium oxide, an ultra-wide bandgap material. It focuses on the new generation of semiconductor materials represented by innovative technology to prepare gallium oxide. The team proposed the concept and process route of "iridium-free process" for the first time in the industry, and has developed a variety of "iridium-free" preparation processes .
According to the news from Zhonghe Club, Evolution Semiconductor has signed an investment cooperation agreement with Hefei High-tech Zone. Quality epitaxy and high-performance chip development environment, develop and sell a new generation of semiconductor customized epitaxial wafers and devices.

 

tokenanalyst

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Jingce Electronics (300567): Sign an important order! The inflection point of heavy-duty detection and measurement equipment has reached​

On April 14, Jingce Electronics announced the signing of a major contract. Shanghai Jingce (semiconductor equipment) signed a new order for multiple testing and measurement equipment, with a total amount of about 120 million yuan; Changzhou Jingce (new energy equipment) signed a new set The total amount of orders for warehousing and logistics systems is about 180 million yuan.

  The precision measurement technology is domestically leading, and the advantages of multi-product card slots are obvious. In the field of thin film thickness detection equipment, the company's product layout is comprehensive, covering dielectric and metal thin films. The test equipment has also obtained batch orders from domestic first-line customers; OCD equipment precision test is also one of the few domestic manufacturers with a layout. It is currently in the lead, has passed the verification of many first-line customers, and has obtained a small number of orders. In addition, the company's high-barrier bright-field optical defect detection equipment has obtained breakthrough orders, has core card position advantages in China, and is expected to expand to more customers in the future. The remaining reserved products are currently in the process of research and development, certification and expansion.

  Shenzhen Jingjiwei is planned to be established, and the expansion of core customers is expected to accelerate. The company's holding subsidiary Shanghai Jingji Micro plans to invest 150 million yuan, and Wuhan Jingce will invest 90 million yuan to jointly invest in the establishment of a grandson company Shenzhen Jingji Micro in Shenzhen with its own funds. Shenzhen has gathered more than one important domestic wafer production line. The establishment of Shenzhen Jingji Micro is expected to accelerate the promotion of high-end bright field equipment in the core client and the technical iteration of bright field products to more advanced processes.



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tokenanalyst

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Xinyuan Micro (KingSemi) (688037): The performance in 2022 is in line with the express report, which fully covers the front glue development​


  report Xinyuan Micro disclosed the 2022 annual report. In 2022, the company achieved revenue of 1.385 billion yuan, YoY+67.12%, and achieved a net profit of 200 million yuan attributable to the parent, YoY+158.77%, in line with the previous performance report .

  Development Trend

  The company's 2022 photolithography process coating and developing equipment (gluing/developing machine) revenue is 757 million yuan, YoY+49.55%, gross profit margin 34.65%, YoY-3.26ppt; single-chip wet equipment (cleaning machine, glue machine, wet etching machine) revenue of 550 million yuan, YoY+89.91%, gross profit margin of 39.17%, YoY+3.72ppt; other equipment revenue of 53 million yuan, YoY+202.09%, gross profit margin of 69.79%, YoY+14.76ppt .

  In the field of pre-adhesive coating and development, the company has achieved full coverage of domestic 28nm and above process node equipment. In 2022, offline, I-line, and KrF machines have been sold in batches. In 4Q22, the first immersion-type high-capacity coating and developing machine will be launched Successfully achieved acceptance at a well-known domestic customer. On December 18, the company officially released the ArFi glue-coated developing equipment and the third-generation front track FT300 III (6 layers, 36 cavities); in the field of front cleaning, the brushing machine produced by the company has It has become the baseline (standard configuration) product of domestic SMIC, Shanghai Huali, Qingdao Xinen and other mainstream fabs, and its market share continues to increase. At the same time, the research and development of chemical cleaning machines is progressing smoothly; In addition to maintaining cooperation with customers, it has also successfully imported various equipment to domestic emerging packaging forces such as Shenghe Jingwei, Changdian Shaoxing, and Shanghai Yibu; in the field of small size, the company's products have already been used in compounds such as Sanan Integration, HC Semitek, and Qianzhao Optoelectronics. , MEMS, LED customer main production equipment. In addition, the company is actively deploying new products such as temporary bonding/debonding, among which the temporary bonding machine has entered the customer verification stage.

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hvpc

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its real. this is a future plan of Hua Hong Group. most probably for 15th five year plan(2025-2030). after localization of complete set of domestic tools and lithography machine serial production.
Again, this Huahong group fab info is from before 2020. The fab capacity status on this chart reflects status as of 2020. Fab5, Fab6 are pretty much full and Fab7 will be full by the end of 2023. So info on this chart is clearly old and not very relevant to reflect latest situation.

target nodes listed here are hence merely Huahong’s target back in 2020 or earlier. Much has changed since two then. They were not able to turn their ambition of 16nm capability into reality as of today. And with much strangling from the U.S. side, they will not be hitting their old pre-2020 goals of 16nm HVM capability any time soon.

in summary, this chart is NOT a future plan from 2023. This is a “future plan” of Huahong circa ~CY2020.
 
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