- I think the biggest different between 28nm and 14nm is the process and not necessary the tools
28nm is planar,14nm is FinFET. Big difference
- I think the biggest different between 28nm and 14nm is the process and not necessary the tools
Lol This made me laugh so hard. I don't know why.“I was totally shocked,” says a Chinese economist of the fdprs imposed in October, “It goes against everything I was told: free trade, a rules-based order, open competition.” ■
Because it's just absurd, it same as anonymous intelligence agent says x about China to the press.Lol This made me laugh so hard. I don't know why.
So Shengmei already supports sub 28nm process for cleaning equipment, electroplating equipment and copper polishing equipment据悉,高速铜电镀技术已被应用于的Ultra ECP ap电镀设备,该设备可执行许多关键的晶圆级封装电镀工艺,包括铜凸块和高密度扇出(HDFO)工艺,并借助专门设计,实现快速均匀的电镀。该设备在铜、镍、锡银和金电镀过程中表现十分亮眼。盛美致力于为全球3D先进封装客户提供电镀工艺的全套解决方案。目前,盛美上海电镀设备产业化成果颇丰,已被多家客户用于其先进的晶圆级封装工艺中。据悉,在半导体清洗设备、半导体电镀设备和半导体抛铜设备方面,盛美上海已经支持到了28nm及以下工艺
looks like it also entered the Sic substrate cleaning business for the first time. That's good given the increased production here值得一提的是,盛美上海的碳化硅衬底清洗设备业务近期取得了新进展。据该公司披露,其首次获得Ultra C SiC碳化硅衬底清洗设备的采购订单,该平台还可配置其自研的SAPS清洗技术,在不损伤硅片的前提下实
Do I ever said that this people are really overpaid? Who ever pay this dude to come with this crap is getting robbed, it will better off to take the money burn it and with the ash fertilize a tree because at least something productive will come out it.