too young, too naive...
Chinese semiconductor industry
- Thread starter Hendrik_2000
- Start date
- Status
Martijn Rasser is a Senior Fellow and Director of the Technology and National Security Program at CNAS.
Prior to joining CNAS, Rasser served as a senior intelligence officer and analyst at the Central Intelligence Agency, where he worked on foreign emerging technologies, technology innovation, and weapons research and development. He also served as a senior advisor in the Office of the Secretary of Defense, special advisor to a senior military commander in the Middle East, chief counterterrorism liaison to a U.S. military unit in Iraq, and vice chairman of a National Intelligence Council working group.
Upon leaving government service, Rasser was chief of staff at Muddy Waters Capital, an investment research firm. More recently, Rasser was director of analysis at Kyndi, a venture-backed AI startup in Silicon Valley.
His commentary and research have appeared in leading publications including Foreign Policy, Lawfare, San Francisco Chronicle, Politico, and Scientific American, and he is regularly quoted in outlets such as Axios, Bloomberg, Financial Times, Fortune, The New York Times, Nikkei Asia, South China Morning Post, Straits Times, Sydney Morning Herald, The Wall Street Journal, and WIRED. He has made media appearances on BBC, CNBC, and Fox News, among others. Rasser received his BA in anthropology from Bates College and his MA in security studies from Georgetown University.
The man looked like he's aged very fast based on that picture @CarlZha posted on Twitter. He must be under tremendous stress coming up with such brilliant ideas. Last post on this person since it's way out of topic on this thread. My apologies.
Recently, Suzhou Keyang Semiconductor Co., Ltd. completed a financing of over 500 million yuan. This round of financing was led by SMIC and Linxin Capital. At the same time, there were well-known investment institutions such as Zhenjiang State Control, Caitong Innovation, and CDH Investment. Local Suzhou Capital such as Zhongxin Capital, Zhidao, Gusu Talent Phase II (Suzhou Asset Management), Kangli Junzhuo (Clivia Capital), Yuelin Venture Capital (Suzhou Fund), Huanxiu Lake No. 1 (High-speed Railway New City Direct Investment), Soochow Venture Capital Waiting for full participation, Longju Capital will continue to increase its size. The proceeds of this round of financing will be used for the continuous investment in the construction, continuous expansion, operation and research and development of related technical products of Keyyang Semiconductor’s advanced packaging project.
Mr. Li Yongzhi, chairman and CEO of Keyang Semiconductor, said: "We are very honored to be unanimously recognized by leading industrial capital, well-known investment institutions and the most influential funds in Suzhou. Through this round of capital increase, Keyang has further optimized its equity The structure has strengthened the financial strength, and at the same time, fully stimulated and released the enthusiasm and creativity of the team, laying a solid foundation for Keyang to further deepen the field of advanced packaging.
Keyang is a local company that has grown organically under the close cooperation of the market, customers and teams. It has been focusing on the field of advanced packaging based on TSV technology for nearly 10 years, and has been providing professional and high-quality services to top customers in the industry. One of the three professional TSV manufacturers in the world. Under the new equity structure, the company will continue to uphold the core values of "integrity, innovation, quality, and customers", focus on the world, actively deploy new technologies and new markets, create irreplaceable value for the industry, and provide customers with better and more comprehensive services. Excellent service, create a bigger stage for the team, and bring continuous and stable returns to shareholders! "
The successful completion of this financing not only reflects the capital market's recognition of Keyyang Semiconductor's value, but also injects stronger impetus into the development of the company. In the future, driven by technological innovation, the company will continue to increase product research and development and market investment, further integrate upstream and downstream resources in the industrial chain, and promote 12-inch TSV car-gauge line and high-end car-gauge CIS packaging, Saw, Baw, F-bar and other full-scale A series of filter packaging and testing, and other 3D packaging methods, form a sensor and radio frequency characteristic packaging and testing industry layout, actively cooperate with partners such as upstream and downstream industries, professional investment institutions, etc. make a contribution!
About Keyang
Suzhou Keyang Semiconductor Co., Ltd., a high-tech enterprise specializing in wafer-level packaging and testing services, currently has a registered capital of 455.05 million yuan. It began preparations in 2013 and officially mass-produced in 2014. At present, the total investment is nearly 1 billion yuan, and the total area covers About 70 acres. Focusing on the R&D and mass production of advanced packaging and testing technologies, it has 8-inch and 12-inch wafer-level packaging product lines, with various packaging capabilities such as TSV, WLCSP, and Bumping, with an annual output of 3 billion chips. CIS sensor and 5G filter chip products can be widely used in automotive electronics, industry, 5G communication and IoT and other fields. There are "National Postdoctoral Research Workstation", "Jiangsu Enterprise Technology Center", "Jiangsu Advanced Wafer-Level Chip Packaging Engineering Center" and "Jiangsu Advanced Semiconductor Packaging and Testing Engineering Technology Research Center". Specialized and new small and medium-sized enterprises in Jiangsu Province, demonstration intelligent workshops in Jiangsu Province, four-star cloud-based enterprises in Jiangsu Province, and top 20 integrated circuits in Suzhou. 174 patents have been applied for, 25 invention patents and 72 utility model patents have been authorized, and 14 registered trademarks.
Mr. Li Yongzhi, chairman and CEO of Keyang Semiconductor, said: "We are very honored to be unanimously recognized by leading industrial capital, well-known investment institutions and the most influential funds in Suzhou. Through this round of capital increase, Keyang has further optimized its equity The structure has strengthened the financial strength, and at the same time, fully stimulated and released the enthusiasm and creativity of the team, laying a solid foundation for Keyang to further deepen the field of advanced packaging.
Keyang is a local company that has grown organically under the close cooperation of the market, customers and teams. It has been focusing on the field of advanced packaging based on TSV technology for nearly 10 years, and has been providing professional and high-quality services to top customers in the industry. One of the three professional TSV manufacturers in the world. Under the new equity structure, the company will continue to uphold the core values of "integrity, innovation, quality, and customers", focus on the world, actively deploy new technologies and new markets, create irreplaceable value for the industry, and provide customers with better and more comprehensive services. Excellent service, create a bigger stage for the team, and bring continuous and stable returns to shareholders! "
The successful completion of this financing not only reflects the capital market's recognition of Keyyang Semiconductor's value, but also injects stronger impetus into the development of the company. In the future, driven by technological innovation, the company will continue to increase product research and development and market investment, further integrate upstream and downstream resources in the industrial chain, and promote 12-inch TSV car-gauge line and high-end car-gauge CIS packaging, Saw, Baw, F-bar and other full-scale A series of filter packaging and testing, and other 3D packaging methods, form a sensor and radio frequency characteristic packaging and testing industry layout, actively cooperate with partners such as upstream and downstream industries, professional investment institutions, etc. make a contribution!
About Keyang
Suzhou Keyang Semiconductor Co., Ltd., a high-tech enterprise specializing in wafer-level packaging and testing services, currently has a registered capital of 455.05 million yuan. It began preparations in 2013 and officially mass-produced in 2014. At present, the total investment is nearly 1 billion yuan, and the total area covers About 70 acres. Focusing on the R&D and mass production of advanced packaging and testing technologies, it has 8-inch and 12-inch wafer-level packaging product lines, with various packaging capabilities such as TSV, WLCSP, and Bumping, with an annual output of 3 billion chips. CIS sensor and 5G filter chip products can be widely used in automotive electronics, industry, 5G communication and IoT and other fields. There are "National Postdoctoral Research Workstation", "Jiangsu Enterprise Technology Center", "Jiangsu Advanced Wafer-Level Chip Packaging Engineering Center" and "Jiangsu Advanced Semiconductor Packaging and Testing Engineering Technology Research Center". Specialized and new small and medium-sized enterprises in Jiangsu Province, demonstration intelligent workshops in Jiangsu Province, four-star cloud-based enterprises in Jiangsu Province, and top 20 integrated circuits in Suzhou. 174 patents have been applied for, 25 invention patents and 72 utility model patents have been authorized, and 14 registered trademarks.
What about parts of the supply chain and servicing that's outside of China and potentially in Europe or Japan?
I'm sure China could figure out how to service their foreign tools inventory all on their own, eventually. That doesn't really suggest that China is capable of fixing all major issues (related to its foreign tools) on its own today.
Interesting conversation in one of Havok thread. AMEC 60:1 is capable to do 200++ layers NAND.
: 60:1可以生产128以上的
60:1 can produce above 128
: 长存200+层的颗粒用60:1能搞定吗？需要100:1以上？
Can 200+ layers be done with 60:1? Need more than 100:1?
: 主流工艺都是双堆栈蚀刻，就是蚀刻两次，lam 100:1的是想做蚀刻一次。
The mainstream process is double-stack etching, that is, etching twice, and the lam 100:1 is to do etching once
: 60:1可以生产128以上的
60:1 can produce above 128
: 长存200+层的颗粒用60:1能搞定吗？需要100:1以上？
Can 200+ layers be done with 60:1? Need more than 100:1?
: 主流工艺都是双堆栈蚀刻，就是蚀刻两次，lam 100:1的是想做蚀刻一次。
The mainstream process is double-stack etching, that is, etching twice, and the lam 100:1 is to do etching once
The instrument assembly is unique. The parts are not.
I wonder how the narrative and geopolitical situation will change once China does get EUV and catches up or surpasses Taiwan in leading edge node? I think mainstream media and even high ranking policy makers in Washington are obsessed with the idea that China will never ever catch up with Taiwan in leading edge nodes, and if they do, that's just due to American technology helping them and all that they need to do is put in some export controls and set them back another 2 years, forever. That and China only wants Taiwan for their semiconductor industry, and not say the issues with having a American naval and airbase off your coast.
The moment that a domestic EUV machine fabs a 2nm transistor, that narrative will completely change.
The moment that a domestic EUV machine fabs a 2nm transistor, that narrative will completely change.
- Status