I think you should read back on maybe the past 100 pages of this thread to gain an understanding. I really don't appreciate newbies coming in and not putting the effort to read what everyone else has already posted.
Chinese semiconductor industry
- Thread starter Hendrik_2000
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I have been following this thread for months before my account was approved. I am not asking for comprehensive information regarding all of China's SME capability, I only want to know if there is well-sourced information on the state of SMIC's finfet production, and if so then what it is.
If you actually followed this thread, you would know that SMIC at minimum is producing CPUs for Loongson and Phytium in the 12/14nm node. Both of these chip designers are still getting all the deliveries they need from SMIC with no report of slow down.
The full year 2022 report is coming out later this month and that may shed light of more details. We also have an insider (probably more than 1) on this thread who has said 7nm is ongoing.
UPH is as high as 720K, Plaisun releases XBonder Pro, a revolutionary Mini/Micro LED mass transfer device
After five years of research and development, Plaisun Intelligent has launched a new generation of Mini/Micro LED mass transfer equipment XBonder Pro, the highest UPH can reach 720K, whether it is compared with the traditional swing arm die-bonding solution, or the Stamp (Stamp), which is mainly promoted by international manufacturers. Seal)-type mass transfer scheme or laser-type mass transfer scheme, both have subversive cost advantages in terms of technology, equipment investment, plant construction, and production costs (power consumption, gas consumption, and clean room):
1. The world's leading spinner technology: the traditional die bonder is in Pick&Place mode, and XBonder Pro adopts flip-chip COB spinner technology;
2. Ultra-high speed: The production speed (UPH) of the traditional high-speed die bonder is not higher than 40K, and the maximum production speed of XBonder Pro reaches 720K;
3. High precision: According to the size of the chip and the size of the pitch, the mounting accuracy is controlled within ±15μm, and the highest accuracy reaches ±5μm;
4. Full-size chip support: support chip size 10μm~800μm, covering the full chip size from MicroLED to MiniLED;
5. Full support for backlight direct display: According to the size of the chip, the chip spacing can be as small as 10 μm, supporting the direct display printing requirements of various RGB modes;
6. Small footprint and low energy consumption: Under the same UPH production capacity, the floor space, power consumption, and gas consumption are less than 15% of traditional die bonders;
7. Support large substrates: XBonder Max is specially designed for large-size substrates, and can support substrates up to 500x600;
8. The process is simple: there is no need for the chip arrangement process, and the pieces are directly printed on the traditional sorting, which avoids the bottleneck of the massive transfer of laser or Stamp on the chip arrangement, and greatly reduces equipment investment, land occupation and energy consumption.
- I think the biggest different between 28nm and 14nm is the process and not necessary the tools, at lot of tools used in a 28nm process can be used in a 14nm process.
-I wont say few tools, a lot of Chinese domestic toolmakers have equipment rated for 14nm or less, not counting new equipment that is coming online like the new kingsemi ArFi track tool and AMEC new tungsten deposition tool.
-I have seen companies in China the produce consumable and parts for foreign equipment, also companies that specilize in repairing this kind tools, a growing industry in China now days.
People forget that a lot of the supply chain for the foreign tools are actually in China lol. Just because an American company put together the tools doesn’t mean the parts are all made in America.
Do we know what yield percentage SMIC's 14nm and 12nm process have?
yield is proprietary information for any fab. Samsung got in trouble for letting their fake numbers leak.
Public yield numbers are just marketing lol. Real yield is always going to be dependent on the design. More complex chip architectures=lower yield.
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