Chinese semiconductor industry

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latenlazy

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the problem is that Lam has an entire ecosystem based around complementary etch and deposition products, while AMEC needs to work with 3rd party deposition suppliers like NAURA who have their own etch tools.
Yeah I imagine for now the workflow integration for all these different products is probably one of the biggest headache with Chinese substitutes. That could take a few years to hash out. But hey beggars can’t be choosers XD (and also this is probably something that will benefit from national level coordination)
 

tphuang

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no restriction on Chinese equipment. Only problem is no Chinese equipment could support the advanced nodes that Samsung and Hynix need to migrate to.

Chinese equipment are not even qualified nor used for D20…and leading DRAM node is already at D1b (separated by D1x/1y/1z/1a nodes….4 nodes). JHICC is able to rely on domestic equipment but they are producing something more akin to D25 DRAM at the moment.
Maybe they can work harder and get themselves qualified for D20 first. From reading these stuff in the past year, I get the sense that qualifying etching tools is a shorter process than lithography machines or photoresists.

The gap in 3D NAND is smaller. YMTC is working hard to qualify Chinese equipment for 128L 3D NAND, leading edge node ramping now is ~232L (only two nodes ahead of the node we are trying to ramp with Chinese equipment).

Domestic equipment readiness is not able to support Samsung and Hynix’s immediate fab expansion or technology roadmap needs.
to be fair, most leading companies are just producing 128 layer and no one has really started high volume production of 232 layers yet.

Nice ARM its IP monopoly is too big...
View attachment 109790
ARM is doing a great job of driving people away.

Love seeing the destruction job that softbank is doing to it. That should encourage greater push to RISC-V

Yeah I imagine for now the workflow integration for all these different products is probably one of the biggest headache with Chinese substitutes. That could take a few years to hash out. But hey beggars can’t be choosers XD (and also this is probably something that will benefit from national level coordination)

I really sympathize Chinese fabs in this area. I had to do my own "validation" of Chinese equipments last year for my company. Let's just say I almost gave up and wanted to return those equipment due to how much time it was wasting me. But now, those equipment are working fine in our office and we paid a lot less than Japanese ones.

That's why I say I know it will be painful, but has to be done.
 

tphuang

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looks like SK hasn't started yet
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SK hynix plans to begin the mass production of the 238-layer NAND in the first half of 2023.
Samsung apparently just started production of 236 layers in Nov.

Most of the production is still in 128 layers. I really don't see any problems with expanding 128 layer production.
 

hvpc

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Politics and nationalism aside, our industry lost a great pioneer and visionary today.

R.I.P. Gordon Moore!!

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SIA Mourns the Loss of Gordon Moore​

Friday, Mar 24, 2023, 9:46pm
by Semiconductor Industry Association


WASHINGTON—The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer on the passing of Gordon Moore.
“SIA mourns the loss of one of the greatest pioneers and innovators in history, Gordon Moore. His iconic vision, embodied by Moore’s Law, helped propel chip technology to new heights and inspire countless innovations that have changed the world forever and for the better. His passing marks the end of an era, but his legacy will live for all time.”
 
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tokenanalyst

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In-situ non-destructive removal of tin particles by low-energy plasma for imitation of EUV optical mirrors self-cleaning.​


Abstract​

In this study, the feasibility was explored of realizing in-situ and non-destructive self-cleaning of the multilayers mirror (MLM) by utilizing hydrogen plasma at low input power (<10 W). The hydrogen plasma generated by the electrode at low power was comprehensively diagnosed using the Langmuir probe and the retarding field ion energy analyzer (RFEA). Meanwhile, the ion concentration ratios and atomic density in hydrogen plasma were calculated by constructing a zero-dimensional plasma chemical model. These experimental results show that the plasma distribution at 1 W is more uniform than that at 10 W, and the peak ion energy at 1 W is lower than 22 eV. Cleaning rates of 0.3–0.75 nm min−1 are achieved to remove discontinuous tin particles at different powers. According to the experiment and calculation results, the chemical etching of ions (breaking the Sn–Sn bond) occurred at 1 W. The etching yield is 0.23–0.87 Sn/ion for 10–40 eV. The analysis of surface morphology and cross-sectional morphology shows that the removal of tin particles is realized by top-down cleaning with hydrogen plasma at low power. This study is of great significance for understanding the detailed mechanism of MLM self-discharge cleaning tin pollutants at low power. It has made a comprehensive calculation and diagnosis of plasma parameters.

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siegecrossbow

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Politics and nationalism aside, our industry lost a great pioneer and visionary today.

R.I.P. Gordon Moore!!

Please, Log in or Register to view URLs content!



SIA Mourns the Loss of Gordon Moore​

Friday, Mar 24, 2023, 9:46pm
by Semiconductor Industry Association


WASHINGTON—The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer on the passing of Gordon Moore.
“SIA mourns the loss of one of the greatest pioneers and innovators in history, Gordon Moore. His iconic vision, embodied by Moore’s Law, helped propel chip technology to new heights and inspire countless innovations that have changed the world forever and for the better. His passing marks the end of an era, but his legacy will live for all time.”
It comes as a shock when one of the pillar stones of your profession has passed away.
 

hvpc

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4Q22 Foundry ranking

F56EC0BB-D5F4-40E1-842C-B8160B652125.jpeg

Chinese foundries lost marketshare in 4Q22 relative to 3Q22. Based on their 1Q23 guidance, we may see their marketshare continue to decrease. Hopefully domestic demand picks up in latter part of 2023 as SMIC and Huahong revenue source is predominantly domestic.
 
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hvpc

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4Q22 DRAM ranking:

1679824192649.png

The entire DRAM market revenue decreased in excess of 32% Q/Q in 4Q22.

DRAM market is expected to continue the downward spiral in 1Q23.

CXMT revenue is included in the “Others” line item and is probably close to what Nanya pulled in. It’s unclear to me why it’s not listed separately (instead of lumped into the “Others” category).
 
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