Chinese semiconductor industry
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Espressif ESP32-P4 – A 400 MHz general-purpose dual-core RISC-V microcontroller
Espressif ESP32-P4 is a general-purpose dual-core RISC-V microcontroller clocked at up to 400 MHz with AI instructions extension, numerous I/Os, and security features.It also happens to be the first microcontroller from Espressif Systems without wireless connectivity, and as such, it should probably be seen as an alternative to STM32F7/H7 or NXP i.RT Arm Cortex-M7 microcontrollers/crossover processors, and likely offered at a significantly lower cost. It should also offer lower power consumption than other ESP32 chips thanks in part to a third RISC-V core clocked at 40 MHz that can keep the system running while the other two high-performance cores are down.
ESP32 is awesome. But it should be fabbed at SMIC.
I think this confirms what we suspect. China is taking a large share of the neon gas market and Russia likely has a pretty big share too. The Koreans apparently have some local firms here. But this is definitely a good time for them to try moving up the supply chain into taking great share of the excimer laser gas market.
https://korea.postsen.com/trends/119438/Normalization-of-neon-gas-prices…-less-than-20--of-the-peak.html
https://korea.postsen.com/trends/119438/Normalization-of-neon-gas-prices…-less-than-20--of-the-peak.html
Shengmei Shanghai: PECVD of various films will be launched this year, and will be verified on the client side
Jiweiwang news, recently, Shengmei Shanghai said in an agency survey that our PECVD can cover storage and logic customers, and this year we will launch PECVD of various films and verify it on the client side. Some core components of PECVD come from overseas supply chains.
Shengmei Shanghai pointed out that some processes of PECVD take a long time, and some processes take a short time. We will design the number of chambers according to the specific process length of PECVD. Some films require many layers to be thicker, which takes a long time and requires more chambers. , the single layer is thinner, the time required is shorter, and the cavity is less. What we mainly do is to optimize the cost performance and meet the requirements of the client at the same time. The two jointly determine the cavity configuration. To add, the company's equipment will be used for most of the PECVD processes in the future.
Shengmei Shanghai said that it hopes to cooperate with multiple equipment and multiple customers this year, to verify the process in parallel, and to see the progress of cooperation with customers. If the cooperation goes well, I hope to cover 30% to 50%, and then continue to develop.
Regarding which components are more difficult to achieve localization, Shengmei Shanghai said that it is mainly some valves, such as vacuum valves, vacuum pumps, etc. These companies are also doing some work. In addition, the manipulator is also an important part. At present, this part is made by a core supplier in South Korea. In the future, the company will continue to develop and pursue diversification, and strive to have its own characteristics. Several companies are invited to do the core manipulators, and the commonly used manipulators can choose suppliers openly.
Regarding the localization of PECVD equipment, Shengmei Shanghai pointed out that at present, some imported parts are used, and domestic parts suppliers are also developing, and some domestic parts will gradually be tried. It will also be replaced with domestic products, but this requires a process. For those whose requirements are not too high, you can try to use domestic components. When domestic components are not fully capable of meeting the requirements, you will give priority to using imported ones.
According to Shengmei Shanghai, the equipment target corresponds to global customers, including domestic ones. At this stage, this device must be a domestic customer. In South Korea, the company has some R&D and production in South Korea, and the company has a history with Hynix. The company also hopes to enter its core process line as soon as possible by relying on differentiated technologies, but there is no guarantee that it will do so next year. In fact, customers all over the world need the best technology. If the company's differentiated solutions can interest customers, there is hope. At this stage, the company already has a patented layout and design background, and hopes to be recognized by international customers and enter international customers for verification as soon as possible.
This SMEE 90nm lithography machine is not from the same 600 series that they still show on .
This is a new platform, possibly the 800 series, because it has the U-precision double stage.
Our new hero Havoc says this is already in mass production, although there is no info anywhere on how many machines have been delivered, when and to which customers.
This is the new SMEE platform from where the new Arf and Arfi machines are being developed.
BTW the picture seems to show an exibithion. It would be interesting to know which exibithion is and when took place.
It seems that most people here follow lithography with greater expertise than I do. What is holding back SMEE from fully exploring the potential of their ArF/KrF instruments and using ArF for 65 nm or KrF for 90 nm?
From my understanding, at these nodes there need to be some tricks such as OPC, which is software I believe, and for the mask, not the lithography instrument itself. Is there anything hardware related that might be holding SMEE back?
If I had to take a guess it just makes no business sense, since a finer resolution machine can probably scan a coarser resolution pattern.
In 2019，Before cjdby shutdown，havok mentioned about their new machine will be shown on ShangHai International Import Expo
Huafeng Technology, a manufacturer of advanced packaging and placement equipment, completed a B2 round of financing of nearly 50 million US dollars
According to news from Jiwei.com, recently, Huafeng Technology completed a B2 round of financing of nearly 50 million US dollars, and the financing funds will be mainly used for factory investment, marketing and R & D investment. Investors in this round include Tongchuang Weiye, Chengchuang Capital, Hillhouse Capital, and Shangqi Capital. Previously, Huafeng Technology had received investment from Bank of China International, Yuanhe Puhua, INTEL and other institutions. At the beginning of the year, it reached a long-term cooperation supply plan with ASE for the next three years.It is reported that Huafeng Technology is a high-end equipment manufacturer focusing on the field of advanced packaging equipment, covering the entire line of advanced packaging technology, providing various solutions for wafer-level packaging, panel-level packaging, flip-chip packaging, SIP system-level packaging and stacked packaging. Mounter equipment related to packaging technology. In addition, Huafeng Technology cuts into the field of wafer-level packaging, flip-chip and other fields and cutting-edge Panel packaging technology, providing hybrid bonding packaging equipment and panel-level packaging.
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