AMEC 2021 fundamentals:
In terms of CCP dielectric etching, the company still lacks in two aspects. One is Damascus etching, which is for logic circuits. In this regard, foreign equipment companies occupy a monopoly position.
But the company has developed the RIE of XD, and will announce the name of the product in the future, and will soon complete the development and enter the market. The preliminary demo results are very good.
Another shortcoming of the company in the past is the etching of extremely high aspect ratio, especially 3D memory. The company is intensively developing it. It is now called YDRIE. The official name will be announced in the future. It is currently under development and has a very good performance. It will take about a year Coming soon to the market.
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One of the most difficult processes for etching machines in the field of chip processing is etching with a high aspect ratio, from 3:1 aspect ratio to 5:1, 7:1, 10:1... now 60:1 , but also to 90:1, the company has made a technological breakthrough in the development of an etching machine with a very high aspect ratio, so the company can open a very deep space of 60:1.