Havok disclosed a lot details. damn interesting
On September 18, 2021, the company launched a new generation of large-field-of-view high-resolution advanced packaging lithography machine. The new lithography machine launched this time is mainly used in the field of high-density heterogeneous integration. It has the characteristics of high resolution, high overlay accuracy and large exposure field of view. It can help wafer-level advanced packaging companies realize multi-chip high-density interconnection The application of packaging technology meets the application requirements of heterogeneous integration and ultra-large chip packaging size. At the same time, it will help packaging and testing manufacturers to improve their process level and develop new processes. In the field of packaging and testing, they will jointly make more contributions to the development of China's integrated circuit industry. . At present, the company has reached a sales agreement with a number of customers for a new generation of advanced packaging lithography machines. On February 7, 2022, the company held a delivery ceremony for the first 2.5D\3D advanced packaging lithography machine.
On November 27, 2021, the company held the company's second extraordinary general meeting of shareholders in 2021 on the "Proposal on Shanghai Microelectronics Equipment (Group) Co., Ltd.'s capital increase and share expansion, employee stock ownership plan and employee stock ownership plan (draft)" , "Proposal on Replacing the Company's Supervisor" and "Proposal on the Company's Sale of Fixed Assets to Shanghai Modern Advanced Ultra-precision Manufacturing Center Co., Ltd." The company intends to implement an employee stock ownership plan, and the funds raised from employees this time will not exceed RMB 800 million.
The 02 project established an overall expert group in 2008. The lithography unit is composed of 6 expert members. Shanghai Microelectronics is responsible for the research and development of the front-end lithography machine and packaging lithography machine. At present, the packaging lithography machine has been successfully developed, and Mass production has already accounted for more than 80% of the domestic market. The 2.5D\3D advanced packaging lithography machine launched in 2021 has received a large number of global orders, and the production and delivery tasks in 2022 and 2023 are heavy. The ArF90nm front-end lithography machine has also been mass-produced and delivered.
The 28nm immersion front-end lithography machine is the last critical task of the 02 special project. In June 2021, the overall technical plan and initial sample of the 28nm immersion front-end lithography machine of Shanghai Microelectronics has passed the expert review of the 02 special project. Shanghai Microelectronics has actually completed all the lithography machine research and development tasks of the 02 project. At present, the main problem is the complete delivery of prototypes. From the perspective of production methods, ASML outsources all subsystems, Nikon and Canon do it themselves, and Shanghai Microelectronics is in the middle, outsourcing parts and making subsystems themselves. .
In order to complete the research and development tasks of 28nm, SMEE has a special business department responsible for it, with a team of about 600 people. The exposure system of the core technical link was also led by SMEE at the beginning. After that, the country handed over the exposure system of 28nm to Changchun Institute of Optics Responsible, SMEE can better focus on the manufacturing of the whole machine. Since the 28nm immersion lithography machine can be used to manufacture 14nm process chips, the conditions of multiple exposures can also forcefully manufacture 7nm process chips, but the cost-effectiveness is not high.
Therefore, it uses the highest-end exposure system, and the technical requirements have reached the optical limit; the Changchun Institute of Optics and Mechanics did not complete the 28nm exposure system until 2020, with continuous testing and adjustments in the middle. Due to technical problems with the supplier of the lithography machine base, the time window for delivery of the prototype in 2021 was missed.
According to the latest news from the company, all the previous technical problems have been solved. Although the epidemic has delayed some time, the company is very confident in the delivery of the prototype of the 28nm immersion front-end lithography machine within this year.
as @tphuang mentioned, once you achieve success in 28nm DUVi. advance variants will come very quick.
so SMEE finally done it.
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