The post mentioned vertical cell and the impact, power leakage. etc
Chinese semiconductor industry
- Thread starter Hendrik_2000
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they had to invent new etch tools and new metrology methods to address these issues, so they're not that easy to tackle. That's why going from planar to 3D NAND took decades of development (1987-2007).
and yes there is indeed a bias where "anything China does is simple, anything China doesn't do is the most complex, difficult, artistic, blah blah blah" thing. Space was considered the hardest, then when China started doing well in space, space became easy and routine in rhetoric (not in reality).
Latest from havok：
On September 18, 2021, the company launched a new generation of large-field-of-view high-resolution advanced packaging lithography machine. The new lithography machine launched this time is mainly used in the field of high-density heterogeneous integration. It has the characteristics of high resolution, high overlay accuracy and large exposure field of view. It can help wafer-level advanced packaging companies realize multi-chip high-density interconnection The application of packaging technology meets the application requirements of heterogeneous integration and ultra-large chip packaging size. At the same time, it will help packaging and testing manufacturers to improve their process level and develop new processes. In the field of packaging and testing, they will jointly make more contributions to the development of China's integrated circuit industry. . At present, the company has reached a sales agreement with a number of customers for a new generation of advanced packaging lithography machines. On February 7, 2022, the company held a delivery ceremony for the first 2.5D\3D advanced packaging lithography machine.
On November 27, 2021, the company held the company's second extraordinary general meeting of shareholders in 2021 on the "Proposal on Shanghai Microelectronics Equipment (Group) Co., Ltd.'s capital increase and share expansion, employee stock ownership plan and employee stock ownership plan (draft)" , "Proposal on Replacing the Company's Supervisor" and "Proposal on the Company's Sale of Fixed Assets to Shanghai Modern Advanced Ultra-precision Manufacturing Center Co., Ltd." The company intends to implement an employee stock ownership plan, and the funds raised from employees this time will not exceed RMB 800 million.
The 02 project established an overall expert group in 2008. The lithography unit is composed of 6 expert members. Shanghai Microelectronics is responsible for the research and development of the front-end lithography machine and packaging lithography machine. At present, the packaging lithography machine has been successfully developed, and Mass production has already accounted for more than 80% of the domestic market. The 2.5D\3D advanced packaging lithography machine launched in 2021 has received a large number of global orders, and the production and delivery tasks in 2022 and 2023 are heavy. The ArF90nm front-end lithography machine has also been mass-produced and delivered.
The 28nm immersion front-end lithography machine is the last critical task of the 02 special project. In June 2021, the overall technical plan and initial sample of the 28nm immersion front-end lithography machine of Shanghai Microelectronics has passed the expert review of the 02 special project. Shanghai Microelectronics has actually completed all the lithography machine research and development tasks of the 02 project. At present, the main problem is the complete delivery of prototypes. From the perspective of production methods, ASML outsources all subsystems, Nikon and Canon do it themselves, and Shanghai Microelectronics is in the middle, outsourcing parts and making subsystems themselves. .
In order to complete the research and development tasks of 28nm, SMEE has a special business department responsible for it, with a team of about 600 people. The exposure system of the core technical link was also led by SMEE at the beginning. After that, the country handed over the exposure system of 28nm to Changchun Institute of Optics Responsible, SMEE can better focus on the manufacturing of the whole machine. Since the 28nm immersion lithography machine can be used to manufacture 14nm process chips, the conditions of multiple exposures can also forcefully manufacture 7nm process chips, but the cost-effectiveness is not high.
Therefore, it uses the highest-end exposure system, and the technical requirements have reached the optical limit; the Changchun Institute of Optics and Mechanics did not complete the 28nm exposure system until 2020, with continuous testing and adjustments in the middle. Due to technical problems with the supplier of the lithography machine base, the time window for delivery of the prototype in 2021 was missed.
According to the latest news from the company, all the previous technical problems have been solved. Although the epidemic has delayed some time, the company is very confident in the delivery of the prototype of the 28nm immersion front-end lithography machine within this year.
On September 18, 2021, the company launched a new generation of large-field-of-view high-resolution advanced packaging lithography machine. The new lithography machine launched this time is mainly used in the field of high-density heterogeneous integration. It has the characteristics of high resolution, high overlay accuracy and large exposure field of view. It can help wafer-level advanced packaging companies realize multi-chip high-density interconnection The application of packaging technology meets the application requirements of heterogeneous integration and ultra-large chip packaging size. At the same time, it will help packaging and testing manufacturers to improve their process level and develop new processes. In the field of packaging and testing, they will jointly make more contributions to the development of China's integrated circuit industry. . At present, the company has reached a sales agreement with a number of customers for a new generation of advanced packaging lithography machines. On February 7, 2022, the company held a delivery ceremony for the first 2.5D\3D advanced packaging lithography machine.
On November 27, 2021, the company held the company's second extraordinary general meeting of shareholders in 2021 on the "Proposal on Shanghai Microelectronics Equipment (Group) Co., Ltd.'s capital increase and share expansion, employee stock ownership plan and employee stock ownership plan (draft)" , "Proposal on Replacing the Company's Supervisor" and "Proposal on the Company's Sale of Fixed Assets to Shanghai Modern Advanced Ultra-precision Manufacturing Center Co., Ltd." The company intends to implement an employee stock ownership plan, and the funds raised from employees this time will not exceed RMB 800 million.
The 02 project established an overall expert group in 2008. The lithography unit is composed of 6 expert members. Shanghai Microelectronics is responsible for the research and development of the front-end lithography machine and packaging lithography machine. At present, the packaging lithography machine has been successfully developed, and Mass production has already accounted for more than 80% of the domestic market. The 2.5D\3D advanced packaging lithography machine launched in 2021 has received a large number of global orders, and the production and delivery tasks in 2022 and 2023 are heavy. The ArF90nm front-end lithography machine has also been mass-produced and delivered.
The 28nm immersion front-end lithography machine is the last critical task of the 02 special project. In June 2021, the overall technical plan and initial sample of the 28nm immersion front-end lithography machine of Shanghai Microelectronics has passed the expert review of the 02 special project. Shanghai Microelectronics has actually completed all the lithography machine research and development tasks of the 02 project. At present, the main problem is the complete delivery of prototypes. From the perspective of production methods, ASML outsources all subsystems, Nikon and Canon do it themselves, and Shanghai Microelectronics is in the middle, outsourcing parts and making subsystems themselves. .
In order to complete the research and development tasks of 28nm, SMEE has a special business department responsible for it, with a team of about 600 people. The exposure system of the core technical link was also led by SMEE at the beginning. After that, the country handed over the exposure system of 28nm to Changchun Institute of Optics Responsible, SMEE can better focus on the manufacturing of the whole machine. Since the 28nm immersion lithography machine can be used to manufacture 14nm process chips, the conditions of multiple exposures can also forcefully manufacture 7nm process chips, but the cost-effectiveness is not high.
Therefore, it uses the highest-end exposure system, and the technical requirements have reached the optical limit; the Changchun Institute of Optics and Mechanics did not complete the 28nm exposure system until 2020, with continuous testing and adjustments in the middle. Due to technical problems with the supplier of the lithography machine base, the time window for delivery of the prototype in 2021 was missed.
According to the latest news from the company, all the previous technical problems have been solved. Although the epidemic has delayed some time, the company is very confident in the delivery of the prototype of the 28nm immersion front-end lithography machine within this year.
Shenzhen Nashe Intelligent Equipment Co., Ltd.
Shenzhen Nashe Intelligent Equipment Co., Ltd. (hereinafter referred to as "Nashe Intelligent") was established in October 2018 and is located in the Pioneering Park for Overseas Students in Guangming District, Shenzhen. With the vision of becoming a global leader in advanced material manufacturing equipment and the mission of improving China's advanced material manufacturing capabilities, the company is committed to the research and development, production, sales and application of advanced material manufacturing equipment such as third-generation semiconductors and graphene .In 2020, the company was evaluated as a "National High-tech Enterprise" with high growth potential. In addition, the company's third-generation semiconductor silicon carbide high-temperature chemical vapor deposition epitaxy equipment technology was listed on the "Science and Technology China" Pioneering Technology List; "Best Compound Semiconductor Device Technology Development Award" from Circuit Industry Association.
Gudeng supplies reticle SMIF pods, wafer FOUPs, etc, but they do not supply masks/reticles itself.
this is something that could be easily replaced by an domestic alternative.
I think bashing SMEE is counterproductive, some type of SME is usually codevelop with the foundries and if foundries prefer to buy and collaborate with ASML instead of SMEE then SMEE time and effort would have been better spend in codeveloping machines for industries that want to work with them. This immersion lithography machine is taking some time from SMEE other research projects, like LED lithography, Direct writing and imprint lithography. They are taking a big risk because they are new cohort of new lithography machines for packaging that are coming to the market from local and foreign companies.
A few years ago this machine was only capable of 20WPH now they are reaching 40WPH totally maskless and looks like they are not going to stop there.
This too
The ArF90nm front-end lithography machine has also been mass-produced and delivered.
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