Come on. We can access EUV systems through IMEC. SMIC and CXMT had done so in the years past. If someone really want to work on EUV reticle process flow, they do have access to the system.
Regardless if explanation/excuse you gave if valid, this still means it will take more time for China to produce wafers with EUV long after the domestic EUV scanners become available.
I respect your expertise and would not presume to educate you the multilayer mirrors.
I however, had been in charge of the R&D, integration, and production of litho/process that involved qualification/optimization of scanners for production. And the point I am making is there's still ways to go to reach domestic EUV industrialization after assembling all the "primary components" together. There's more to it than just having the hardware integrated.
Take for example, Nikon also have immersion system that uses the same Cymer/Gigaphoton lasers, have good hardwares, and even could match ASML specification under test conditions. So why does ASML have 90% of immersion market share while Nikon ships less than 10 systems per year? Like I said before, the devil is in the details beyond the hardware. So even if SMEE could come up with scanners that could match ASML's tool specification, they will most likely to be simply close to where Nikon is relative to ASML. Same logic applies to integrated domestic EUV system relative to ASML's HVM systems.
IF you make the list you made it.