Moore's Law is approaching its limit, and China Aerospace Corporation is the first to introduce SOP microsystem packaging architecture
China Aerospace Science and Technology Co., Ltd.
China Aerospace Science and Technology Co., Ltd. 2022-09-16 05:51 Posted on Anhui
From the manufacture of the first transistor by Bell Labs in the United States in 1947 , to the birth of the lithography process in 1960 , to the proposal of Moore's Law in 1964 , the integrated circuit has spawned and promoted technological innovation and industry change since its birth . Today , it is playing a very important role in all walks of life and has become the cornerstone of the modern information society.
Under the influence of Moore's Law , the integrated circuit industry has developed rapidly . In recent years, advanced technology has evolved to 3nm and 2nm. The practice of increasing transistor density to improve performance has encountered a bottleneck, and Moore's Law has begun to slow down or even stagnate.
Where will integrated circuits go in the post-Moore era ?
Recently , at the 2022 World Semiconductor Conference , Mao Junfa, academician of the Chinese Academy of Sciences and president of Shenzhen University, put forward the view of "from integrated circuits to
integrated systems " . He believes that as Moore's Law faces extreme challenges and the turning point is approaching, he clearly stated that "the past 60 years have been a In the era of circuits, the next 60 years will be the era of integrated systems.”
He said that integrated circuits (chips) are only the means, and microelectronic systems are the ends. The integrated system carries out integrated design and production from the perspective of the system, and integrates various chips, sensors, components, antennas, interconnects, etc. on a substrate to form a system with expected functions. All chips and components are structurally composed As a whole, it makes the system high density, miniaturization, strong function, low power consumption, low cost, high reliability, easy design and easy production.
This kind of thinking can further improve the design efficiency and comprehensive performance of the system, reduce the cost of the system, increase its reliability, and reduce the requirements for chip design and equipment.
Therefore, the integrated system is a new way for the development of the complex microelectronic system integration technology .
Coincidentally , Hefei Zhonghangcheng Electronic Technology Co. , Ltd. launched the chip module SOP integrated system packaging technology , which coincides with the thinking of Academician Mao Junfa .
The core team of AVIC has more than 20 years of experience in high -reliability chip packaging and shell manufacturing process , related material application and collaborative design . Taking the system as the design object , emphasizing the integration of circuit design and integrated manufacturing , while achieving complex cavity structure and high strength, it also takes into account chip heat dissipation, high-density lead feedthrough and more functional integration requirements, and is technically compatible with metal enclosures with ceramic envelope. It has been used in transmission , sensing , power devices , microwave components , optoelectronic modules and other products , and is widely used in power , electronics , military , communications , medical and other industries .
In fact , as a new type of microsystem package architecture technology , it has become the focus of the industry , under Section 9906(d) of the US National Defense Authorization Act ( NDAA ) , the National Advanced Packaging Manufacturing Program is authorized to strengthen advanced packaging in the US ecosystem In early August , the United States released the " Chip and Science Act of 2022 " , which will allocate $ 2.5 billion for advanced packaging manufacturing programs in fiscal year 2022 .
The company's team focuses on providing high-reliability multi-chip module packaging structure solutions for global system-in-package customers. The previous products are mainly based on Japan's Kyocera and Germany's SCHOTT. They have independently and completely mastered the advanced manufacturing technology of HTCC high temperature ceramics . Based on the understanding of the core technology chain of the chip industry , the team took the lead in proposing and implementing the SOP micro- system integrated packaging architecture in the industry , realizing the optimal combination of materials , processes , design , cost and other dimensions . In the next step , the company will take SOP micro - system integrated packaging technology as a breakthrough to provide customers with complete chip module packaging products and services , drive China's semiconductor industry to change lanes and overtake , and contribute to the development of China's integrated circuit industry .