Chinese semiconductor industry
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Chipletz Designs Smart Substrate Products with Chip and Semiconductor Metis Tools
Jiweinet September 21 news, the domestic EDA industry leader Chipletz recently confirmed that Chipletz, a substrate design start-up company developing advanced packaging technology, has used Chipletz’s Metis electromagnetic field simulation EDA for Chipletz’s upcoming Smart Substrate™ product design, enabling heterogeneous integration of multi-chip packaging.
"The slowing Moore's Law and the pursuit of high-performance computing are ushering in the era of advanced packaging, which will surely bring urgent demand for EDA solutions for simulation of advanced packaging like chips and semiconductors," commented Bryan Black, CEO of Chipletz. And Semiconductor and its Metis electromagnetic field simulation tools provide industry-unprecedented performance advantages in simulation efficiency and memory consumption, helping us successfully address the unique challenges of signal and power integrity analysis."
"Chipletz's Smart Substrate™ products will be a powerful addition to the development engineer's toolkit for 2.5D/3DIC advanced packaging," said Dr. Ling Feng, CEO of Chip and Semiconductor. Heterogeneous integration of multiple different chips from suppliers, which is especially important for AI workloads, immersive consumer experiences, and high-performance computing markets. Chip and Semiconductor is excited to play a role in the delivery of this advanced packaging technology.”
Chip and Semiconductor Metis is a fast electromagnetic field simulation tool aimed at advanced package simulation, which provides easy integration with chip design tools and package design tools to meet the stringent requirements for capacity, accuracy and throughput in advanced package design . The three-dimensional full-wave high-precision electromagnetic simulation engine MoM Solver embedded in Metis can cover the simulation frequency of DC-THz. It provides unprecedented performance under the application precision requirements of high-speed and high-frequency in heterogeneous integration, and can perfectly support nanometer to centimeter. High-level cross-scale simulation, enabling co-simulation of bare die, interposer, and package for advanced package designs.
the prophecy
This might be a problem in a couple of years. It seems like the Chinese automakers really haven't learnt their lesson. Does seem like Nvidia Thor is going to be a huge bump incapability over Orin (256 TOPS). I'm actually not sure you need 2000 TOPS of performance really. But that's where things are at. It's up to Chinese chip designers to match this. Journey 5 was at 128 TOPS. So, Journey 6 imo needs to hit 1000 TOPS to really be competitive.
Of course, we know BYD is designing it's own chip. I'm sure Huawei will have something also. Keep in mind that this is a growing market. A complicated soc like this might be a few thousand dollars. Imo, just another industry that SMIC will need to support.
Of course, we know BYD is designing it's own chip. I'm sure Huawei will have something also. Keep in mind that this is a growing market. A complicated soc like this might be a few thousand dollars. Imo, just another industry that SMIC will need to support.
The latter part is great. It shows how much the Russian/Ukraine conflict has turned China into dominant position in the noble gas market.
Xiaomi invests in Rongpai Semiconductor, and the automotive industry chain is getting bigger and bigger
Snce Xiaomi announced the manufacture of cars, it has deployed a number of companies related to the automotive industry chain through investment and shareholding. In addition to Rong Pai Semiconductor, Harbin Industrial Intelligence also said recently that its subsidiary Tianjin Fuzhen has cooperated with Xiaomi Auto. Tie Liu, an auto parts supplier, recently revealed that the company is actively conducting preliminary technical exchanges with new car-making forces such as Xiaomi...Recently, Rong Pai Semiconductor (Shanghai) Co., Ltd. has undergone industrial and commercial changes, adding a number of shareholders such as Hubei Xiaomi Changjiang Industrial Fund Partnership (Limited Partnership), and the shareholding ratio of Hubei Xiaomi Changjiang Industrial Fund Partnership has increased to 3.5% . At the same time, the company's registered capital increased from RMB 15.2535 million to RMB 16.0563 million.
According to the company's information, Rong Pai Semiconductor (Shanghai) Co., Ltd. was founded in 2017, focusing on the research and development and design of high-performance analog integrated circuit products, focusing on digital isolators, drivers, isolation amplifiers and other product series, which are widely used in industrial control. , new energy vehicles, digital power, smart appliances and other fields, is committed to establishing a safe connection between the physical world and the digital world.
At present, the company's listed products include digital isolator π1xxx & π2xxx series products. Intelligent voltage divider technology (iDivider technology) is a digital isolator technology invented by Rongpai Semiconductor. It applies the principle of capacitive voltage divider and directly transmits the voltage signal from one side of the capacitor to the other side without requiring RF signals and modulation and demodulation. , carry forward the advantages of other isolation technologies (such as opto-coupler technology of opto-coupler, icoupler technology, OOK technology, etc.), and also optimize the shortcomings of other isolation technologies to the greatest extent. It is a more essential and more concise isolation signal transmission technology , The intelligent voltage divider (iDivider) technology circuit is greatly simplified, the power consumption is lower, the speed is faster, the anti-interference ability is enhanced, and the noise is lower.
According to the company's data, Hubei Xiaomi Changjiang Industrial Fund Partnership has invested in 105 companies, and 83 of them exist. Among them, landing on the Science and Technology Innovation Board include:
1. Jiangsu Diao Microelectronics, holding 5.63%;
2. VeriSilicon Microelectronics, holding 5.48%;
3. Zhuhai Guanyu Battery, holding 3.7%;
4. Hengxuan Technology, holding 3.49%;
5. Shenzhen Biyi Microelectronics, holding 3.26%;
6. Guangzhou Fangbang Electronics, holding 2.5% of the shares;
7. Fengdao Technology, holding 1.52% of the shares.
Listed on A-shares are:
1. Yidong Electronics, holding 2.25% of the shares;
2. Shenzhen Lihexing Co., Ltd. holds 2.78% of the shares.
For a long time, most of Xiaomi Group's investment business has been focusing on its main business and future development direction, carrying out technological improvement and industrial chain layout, such as artificial intelligence, Internet of Things, automobiles and semiconductors.
According to business card statistics, Xiaomi has made a total of 521 investments, involving a total of 17 fields. Among them, the top three fields of investment are manufacturing, hardware and cultural media, respectively, with 94, 76 and 59 investment events, accounting for about 18%, 15% and 11%.
Since Xiaomi announced the manufacture of cars, it has deployed a number of companies related to the automotive industry chain through investment and shareholding. According to statistics from China National Financial Securities, as early as the end of September 2021, Xiaomi has invested in as many as 62 companies in the smart car field, including 17 companies in smart driving, 13 companies in smart electric, and 6 companies in smart cockpits. There are 22 companies with new investment in 2021. In addition to investment in automotive intelligence, power batteries and lidars are also the focus of Xiaomi's investment.
In addition to Rong Pai Semiconductor, Harbin Industrial Intelligence also said recently that its subsidiary Tianjin Fuzhen has cooperated with Xiaomi Auto. Tianjin Fuzhen focuses on the field of automobile body equipment manufacturing and has 20 years of industry experience.
The new release of the MES test solution in the Fab-lite mode of Yangsoft
In the semiconductor industry, Foundry, Fabless, and IDM have been used for decades, and now a new semiconductor business model, Fab-lite, has emerged. The Fab-lite model evolved from IDM to provide low-cost solutions for industries that require semiconductor manufacturing but face capacity constraints. It is a strategy for companies to reduce investment risks. In addition, there is another kind that Fabless has started to build its own Fab (wafer factory, packaging factory, test factory, etc.) to develop into a Fab-lite model.
Aiming at this new industrial development model, Shangyang Software has developed an M ES solution applied to the test factory in Fab -lite mode . The market is officially released .
The features of the solution include test incoming data integration, planning and marking reservation equipment, CP Mapping management, test BIN yield card control, test fixture and key spare parts management, OCAP and SPC management and control, and test implementation under non-EAP solutions Data file analysis and simple test program management, etc., meet the test needs of different Fab-lite factories.
At present, Yangyang Software has completed the development and implementation of MES projects for several Fab-lite factories, providing customers with advanced management systems for back-end testing, and improving the testing efficiency of wafers and finished products.
About Rising Software
Shangyang Software provides CIM intelligent manufacturing overall solutions with independent intellectual property rights for high-tech manufacturing industries such as semiconductor, photovoltaic and LED. The solutions include MES, SPC, EAP, RMS, APC, FDC, MDM and other products, services and technologies. Consulting, the plan covers substrate materials, wafer manufacturing and packaging and testing in the semiconductor industry, components, cells, and thin film manufacturing in the photovoltaic industry, as well as front-end and back-end manufacturing in the LED industry.
The software products of Yangyang Software adopt a new generation of IT open technology platform (Java Spring Boot framework), which are widely used in semiconductor 4 to 12 inch semiconductor factories. The product is mature and reliable, and has obtained the certification of the authoritative organization: the American Society of Software Engineering (SEI) SW-CMM3 certification.
The MES of Shangyang Software has been able to support the production capacity of more than 200,000 pieces/month for the 6-inch line and 100,000 pieces/month for the 8-inch line, making it the first 8-inch mass production line using domestic MES in China. Recently, the MES applied to the 12-inch mass production line is also in the verification and development stage.
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