Chinese semiconductor industry

Status
Not open for further replies.

antiterror13

Brigadier
China will flood the market with 7nm, then 5nm and 3nm etc. Japan and the EU have no way of countering the Chinese expansion.

I don't think Japan and the EU is in competition with China in regard to advanced node. Only Taiwan and SK are ahead of everybody else, including the US and China ... but China is the 3rd that can produce 7nm after Taiwan and SK. Even the USA is still unable to produce 7nm even with many EUV machines and huge subsidy from the government

How about the EU? GF is still stuck with 14nm node for long time
How about Japan? .. the most advanced is 65nm or maybe 45nm
How about the UK? I think 180nm is the most advanced see
Please, Log in or Register to view URLs content!
 
Last edited:

ansy1968

Brigadier
Registered Member
I don't think Japan and the EU is in competition with China in regard to advanced node. Only Taiwan and SK are ahead of everybody else, including the US and China ... but China is the 3rd that can produce 7nm after Taiwan and SK. Even the USA is still unable to produce 7nm even with many EUV machines and huge subsidy from the government
Sir he is correct though, he just forget to put the timeline which is 2035.
How about the EU? still stuck with 14nm node for long time
How about Japan? .. the most advanced is 65nm or maybe 45nm
How about the UK? I think 180nm is the most advanced see
Please, Log in or Register to view URLs content!
Sir as the Semiconductor industry devolved from Globalization to Regionalism, will the Collective West investment on leading edge node of 3nm and 2nm bear fruit. I mean Japan and the US plan a JV, EU have such ambition, TSMC and Samsung have been researching and plan to deploy it by 2026, as they compete with each other, where will China stand? I think by that time SMIC will be a generation behind with its 3nm, So who will they sell it too?

Please, Log in or Register to view URLs content!

Please, Log in or Register to view URLs content!




Jul 19, 2021 — The two alliances are intended to accelerate the development of new chip designs and industrial cloud/edge computing technologies, bringing ...

Please, Log in or Register to view URLs content!

Please, Log in or Register to view URLs content!




Please, Log in or Register to view URLs content!

Aug 1, 2022 — TOKYO – A top-level meeting has confirmed earlier reports that the US and Japan will work together to develop leading-edge 2-nanometer (nm) ...
 

olalavn

Senior Member
Registered Member
Bây giờ tôi đã hiểu tại sao Nhật Bản và EU muốn đầu tư vào các nút cạnh hàng đầu như 3nm và 2nm, Lý do Trung Quốc sẽ tràn ngập thị trường với chip cấp thấp giá rẻ, ngành công nghiệp của họ không thể cạnh tranh nên cần phải nâng cấp. NHƯNG NẾU tất cả họ đều tập trung vào lợi thế dẫn đầu thì điều đó có ảnh hưởng đến giá cả khi họ cạnh tranh với nhau trong thị trường ngách này không?

Please, Log in or Register to view URLs content!

Please, Log in or Register to view URLs content!

Please, Log in or Register to view URLs content!


Please, Log in or Register to view URLs content!

10 views2 giờ trước

CC
70-90% of the industry is still using 90-14nm chips... U.S only thinks about high-end technology... huge profits in those low-end chips
 

olalavn

Senior Member
Registered Member
This is big news! There was talk of the US Commerce Dept preventing Zygo Corporation from selling more grating interferometers to China once they realized China was on the verge of breaking beyond 28nm process using domestic core equipment. I'm surprised this is already ready. If it is, it means domestic 7nm DUV process development is probably already happening now. It almost sounds like fake news.
Domestic 7nm DUV will be released late next year.... Hisilicon and SMEE team are working on it
 

tokenanalyst

Brigadier
Registered Member

North Huachuang won the bid for Jiangcheng pilot test and Fulian integrated equipment procurement project, involving 2 etching machines​


According to the information from the micronet and the bidding platform information, on August 23, Hubei Jiangcheng Chip Pilot Test Service Co., Ltd. (hereinafter referred to as "Jiangcheng Pilot Test") electronic equipment procurement project and Fujian Fulian Integrated Circuit Co., Ltd. (hereinafter referred to as "Fulian Integrated Circuit Co., Ltd."). The results of the second batch of inductively coupled plasma etching machine equipment procurement projects in 2022 were announced, and the winning bidders were Beijing North Huachuang Microelectronics Equipment Co., Ltd. (hereinafter referred to as "North Huachuang").

The Jiangcheng pilot project involves a high-density plasma etching machine for the target; the Fulian integration project involves an inductively coupled plasma etching machine for the target, which is mainly used for the GaAs etching process of 6-inch wafers.

According to the official news of NAURA, in the field of etching, in August 2005, NAURA’s first ICP etching machine entered the large production line; in November 2017, NAURA launched its first metal etching machine; in 2022 On August 12, NAURA released the CCP media etching machine, which has been verified and mass-produced in 5 customers. So far, NAURA has achieved full coverage of the etching process. (Proofreading/Zhao Biying)


Please, Log in or Register to view URLs content!
 

tokenanalyst

Brigadier
Registered Member

Shengmei Semiconductor: A total of 500 electroplating cavities have been produced in the ECP equipment series​


1109973721090.29251594044334834.0823.jpg


According to micronet news, on August 22, Shengmei Semiconductor announced that the 500th electroplating chamber of the Electrochemical Plating (ECP) equipment series was released and successfully delivered to customers.

It is reported that Shengmei Shanghai's electroplating technology has passed the production line process evaluation of major semiconductor manufacturers, and is applied to 55nm to 28nm, TSV, high-density fan-out packaging, conventional Pillar, and RDL product production lines. As of December 2021, Shengmei's electroplating equipment sales accounted for 4% of the global integrated circuit electroplating market.

Shengmei Semiconductor focuses on the supply of cleaning equipment. Its products include semiconductor cleaning equipment, front-end semiconductor electroplating equipment and advanced packaging wet process equipment (including back-end electroplating equipment). At present, Shengmei Semiconductor's product orders have reached 67 units, with a total sales of more than 1.2 billion.

Please, Log in or Register to view URLs content!
 

WTAN

Junior Member
Registered Member
Sir welcome back, your presence is sorely missed, well we can say that SMEE has turn the page regarding the SSA800 DUVL and your prediction of a 22nm DUVL being work on had been proven right, so what next aside from EUVL? can you give us what coming next, is the 7nm domestic line be operational by next year?
The 14nm Domestic Line is already undergoing production and we will have to wait for the performance indicators.
The 14nm Domestice Line Equipment can be easily upgraded to produce 7nm Chips.
If all goes well with the 14nm Line, it is very likely we can see a 7nm Domestic line being operational next year.
 
Status
Not open for further replies.
Top