Chinese semiconductor industry

50 mm thick 6 inch silicon carbide single crystal growth was successful


Recently, Zhejiang University Hangzhou International Science and Technology Center Advanced Semiconductor Research Institute-Dry Crystal Semiconductor Joint Laboratory and Zhejiang University State Key Laboratory of Silicon Materials, under the funding of Zhejiang Province's "Jianbing Program" and other research and development projects, have successfully grown a thickness of 50. mm 6-inch silicon carbide single crystal (Figure 1), which is the first report in China. This important development means that the cost of silicon carbide substrates is expected to be greatly reduced, and the development of the semiconductor silicon carbide industry may usher in new opportunities for development.


Double the thickness! The high cost of silicon carbide single crystal is expected to be reduced
Silicon carbide (SiC) single crystal, as a wide-bandgap semiconductor material, is crucial to the development of high-voltage, high-frequency, high-temperature, and high-power semiconductor devices. At present, the high cost of silicon carbide single crystal is the main factor restricting the large-scale application and development of various silicon carbide semiconductor devices. In order to reduce the cost of SiC single crystal, it is an effective way to enlarge its diameter and increase its thickness .

At present, the diameter of domestic SiC single crystal has generally reached 6 inches, but its thickness is usually between ~20 - 30 mm , resulting in a relatively limited number of SiC substrate sheets obtained by slicing a SiC ingot.

So how can we increase the thickness? Where is the difficulty? According to the researchers, the main challenge for increasing the thickness of SiC single crystal lies in the increase of the thickness during growth and the change of the thermal field inside the growth chamber caused by the consumption of source powder . In response to the challenges, Zhejiang University Hangzhou International Science and Technology Innovation Center Advanced Semiconductor Research Institute-Dry Crystal Semiconductor Joint Laboratory and Zhejiang University State Key Laboratory of Silicon Materials have designed a new thermal field for silicon carbide single crystal growth equipment and developed new methods for silicon carbide source powder. The technology and the development of a new process for the growth of silicon carbide single crystals have significantly increased the growth rate of silicon carbide single crystals, and successfully grown a 6-inch silicon carbide single crystal with a thickness of 50 mm.

The realization of this thickness, on the one hand, saves the consumption of expensive silicon carbide seed crystals, and on the other hand doubles the number of silicon carbide substrate sheets obtained by slicing one silicon carbide single crystal ingot, so it can greatly reduce the cost of silicon carbide substrates. The cost is expected to effectively promote the development of the semiconductor silicon carbide industry.


The thickness is increased, can the quality be guaranteed? The researchers analyzed the silicon carbide substrate sheet (Fig. 1) obtained by slicing the grown silicon carbide single crystal ingot and found that its crystal form was 4H, and the average width at half maximum of the X-ray diffraction peak of the typical (0004) crystal plane was 18.47 arcseconds, with a total dislocation of 5048/cm -2 (Fig. 2). All the above results show that the crystal quality of SiC single crystal has reached the industry level.

Work together to solve problems
The report of the Zhejiang Provincial Party Congress proposed that to promote the deep integration of the innovation chain and industrial chain, it is necessary to speed up the construction of a modern scientific and technological innovation system and industrial system. How to use the advantageous resources of Zhejiang University Hangzhou International Science and Technology Innovation Center to help solve common technical problems? The Hangzhou International Science and Technology Innovation Center of Zhejiang University has been exploring.



The Hangzhou International Science and Technology Innovation Center of Zhejiang University has been committed to promoting the in-depth integration of industry, academia and research, deepening cooperation with enterprises, linking global innovation resources, carrying out high-level and high-quality results transformation, and jointly building an innovation consortium. At present, the center has established an innovation consortium with more than 10 enterprises, and the Advanced Semiconductor Research Institute of Zhejiang University Hangzhou International Science and Technology Innovation Center-Dry Crystal Semiconductor Joint Laboratory is one of them.

This achievement was jointly completed by Zhejiang University Hangzhou International Science and Technology Center Advanced Semiconductor Research Institute-Dry Crystal Semiconductor Joint Laboratory and Zhejiang University State Key Laboratory of Silicon Materials, which is the embodiment of technological innovation and industrial innovation. Faced with the cost of silicon carbide single crystal, which is highly concerned by the industry, the research team focused on the thickness of silicon carbide single crystal and fully integrated the advantages of Zhejiang University Hangzhou International Science and Technology Center Advanced Semiconductor Research Institute and Zhejiang University State Key Laboratory of Silicon Materials. It has worked together to tackle key problems and achieved phased results, contributing to the development of semiconductor silicon carbide technology.

tokenanalyst said:

50 mm thick 6 inch silicon carbide single crystal growth was successful


Recently, Zhejiang University Hangzhou International Science and Technology Center Advanced Semiconductor Research Institute-Dry Crystal Semiconductor Joint Laboratory and Zhejiang University State Key Laboratory of Silicon Materials, under the funding of Zhejiang Province's "Jianbing Program" and other research and development projects, have successfully grown a thickness of 50. mm 6-inch silicon carbide single crystal (Figure 1), which is the first report in China. This important development means that the cost of silicon carbide substrates is expected to be greatly reduced, and the development of the semiconductor silicon carbide industry may usher in new opportunities for development.

Double the thickness! The high cost of silicon carbide single crystal is expected to be reduced
Silicon carbide (SiC) single crystal, as a wide-bandgap semiconductor material, is crucial to the development of high-voltage, high-frequency, high-temperature, and high-power semiconductor devices. At present, the high cost of silicon carbide single crystal is the main factor restricting the large-scale application and development of various silicon carbide semiconductor devices. In order to reduce the cost of SiC single crystal, it is an effective way to enlarge its diameter and increase its thickness .

At present, the diameter of domestic SiC single crystal has generally reached 6 inches, but its thickness is usually between ~20 - 30 mm , resulting in a relatively limited number of SiC substrate sheets obtained by slicing a SiC ingot.

So how can we increase the thickness? Where is the difficulty? According to the researchers, the main challenge for increasing the thickness of SiC single crystal lies in the increase of the thickness during growth and the change of the thermal field inside the growth chamber caused by the consumption of source powder . In response to the challenges, Zhejiang University Hangzhou International Science and Technology Innovation Center Advanced Semiconductor Research Institute-Dry Crystal Semiconductor Joint Laboratory and Zhejiang University State Key Laboratory of Silicon Materials have designed a new thermal field for silicon carbide single crystal growth equipment and developed new methods for silicon carbide source powder. The technology and the development of a new process for the growth of silicon carbide single crystals have significantly increased the growth rate of silicon carbide single crystals, and successfully grown a 6-inch silicon carbide single crystal with a thickness of 50 mm.

The realization of this thickness, on the one hand, saves the consumption of expensive silicon carbide seed crystals, and on the other hand doubles the number of silicon carbide substrate sheets obtained by slicing one silicon carbide single crystal ingot, so it can greatly reduce the cost of silicon carbide substrates. The cost is expected to effectively promote the development of the semiconductor silicon carbide industry.

The thickness is increased, can the quality be guaranteed? The researchers analyzed the silicon carbide substrate sheet (Fig. 1) obtained by slicing the grown silicon carbide single crystal ingot and found that its crystal form was 4H, and the average width at half maximum of the X-ray diffraction peak of the typical (0004) crystal plane was 18.47 arcseconds, with a total dislocation of 5048/cm -2 (Fig. 2). All the above results show that the crystal quality of SiC single crystal has reached the industry level.

Work together to solve problems
The report of the Zhejiang Provincial Party Congress proposed that to promote the deep integration of the innovation chain and industrial chain, it is necessary to speed up the construction of a modern scientific and technological innovation system and industrial system. How to use the advantageous resources of Zhejiang University Hangzhou International Science and Technology Innovation Center to help solve common technical problems? The Hangzhou International Science and Technology Innovation Center of Zhejiang University has been exploring.

The Hangzhou International Science and Technology Innovation Center of Zhejiang University has been committed to promoting the in-depth integration of industry, academia and research, deepening cooperation with enterprises, linking global innovation resources, carrying out high-level and high-quality results transformation, and jointly building an innovation consortium. At present, the center has established an innovation consortium with more than 10 enterprises, and the Advanced Semiconductor Research Institute of Zhejiang University Hangzhou International Science and Technology Innovation Center-Dry Crystal Semiconductor Joint Laboratory is one of them.

This achievement was jointly completed by Zhejiang University Hangzhou International Science and Technology Center Advanced Semiconductor Research Institute-Dry Crystal Semiconductor Joint Laboratory and Zhejiang University State Key Laboratory of Silicon Materials, which is the embodiment of technological innovation and industrial innovation. Faced with the cost of silicon carbide single crystal, which is highly concerned by the industry, the research team focused on the thickness of silicon carbide single crystal and fully integrated the advantages of Zhejiang University Hangzhou International Science and Technology Center Advanced Semiconductor Research Institute and Zhejiang University State Key Laboratory of Silicon Materials. It has worked together to tackle key problems and achieved phased results, contributing to the development of semiconductor silicon carbide technology.

Please, Log in or Register to view URLs content!

Click to expand...

Dumb question, but will this allow them to make better sic modules for electric vehicles?

tphuang said:

Dumb question, but will this allow them to make better sic modules for electric vehicles?

Click to expand...

Will allow them to make them a bit cheaper.

TSMC's Former General Counsel Richard Thurston on the CHIPSAct : use it as the opportunity to get more involved in the US.

The bidding situation of semiconductor equipment in June: the domestic production rate of equipment continues to increase

2022-07-20
In June 2022, domestic mainstream fabs will publicly bid for 68 devices

10 major IDMs or OEMs in mainland China including YMTC, Huali Integration, Huali Microelectronics, Fujian Jinhua, Huahong Wuxi, Hefei Jinghe, Shanghai Jita, CRRC Times, SMIC Shaoxing, Wuhan Xinxin Enterprises are statistical samples, and the above-mentioned wafer fabs have been sorted out through the China International Bidding Network (for detailed sample selection rules, see the description at the end of this section). In June 2022, 10 mainstream fabs in China have opened bids for a total of 68 process equipment, and a total of 548 process equipment were opened in the first six months.

In terms of fabs, in June 2022, Shanghai Jita will be the main expansion manufacturer, and a total of 52 process equipment will be opened. Different manufacturers have different expansion and bidding rhythms, so the expansion of each manufacturer in different time periods is quite different. The 68 sets of equipment to be opened in June 2022 are mainly from Shanghai Jita (52 sets), Hua Hong Wuxi (11 sets), Fujian Jinhua (3 sets), Huali Integration (1 set), Shanghai Jita and Hua Hong Wuxi Expansion contributed the main increment.

From January to June 2022, Hua Hong Wuxi opened bids for 291 sets of process equipment, contributing major increments. The 548 sets of equipment to be opened from January to June 2022 are mainly from Hua Hong Wuxi (291 sets), Shanghai Jita (210 sets), Times Electric (16 sets), Fujian Jinhua (23 sets), Huali Integration (6 sets) ), Huali Microelectronics (2 units), Hua Hong Wuxi and Shanghai Jita contributed the main increase.

In terms of equipment, dry degumming machines, post-testing and cleaning equipment contributed to the main production increase in June 2022. The equipment layout of the fab is often centered on the lithography machine, and revolves around multiple etching, film deposition, cleaning and other equipment. Due to the different types of equipment procurement corresponding to different bidding batches, the types of process equipment bidding in different periods will also be different. . Among the 68 pieces of equipment to be opened in June 2022, the number of bid openings for different process equipment is arranged from high to low, namely dry-process degumming machines (14 sets), cleaning equipment (13 sets), and post-testing equipment (11 sets) , ion implanter (9 sets), deposition equipment (8 sets), etching equipment (8 sets), front-channel detection equipment (2 sets), furnace tube equipment (2 sets), polishing equipment (1 set).

Furnace tubes, etching and deposition equipment contributed to the main production expansion from January to June 22. Among the 548 sets of equipment opened from January to June 2022, the number of bid openings for different process equipment is ranked from high to low, namely furnace tube equipment (119 sets), deposition equipment (97 sets), etching equipment (82 sets), Front-end testing equipment (64 sets), back-end testing equipment (46 sets), cleaning equipment (33 sets), dry degumming equipment (31 sets), ion implanters (28 sets), polishing equipment (21 sets), coating equipment Glue developing equipment (17 units), lithography machines (10 units).

Equipment domestic production rate: The domestic production rate of equipment such as etching and dry degumming is relatively high

In June 2022, the number of won bids for equipment in mainland China was 44, with a domestic production rate of 64.7%. We calculate the domestic production rate based on the number of successful bids for equipment (including manufacturers with refurbishment business). Due to the difference in the value of different equipment, there is a certain difference with the domestic production rate calculated by the actual market size. In addition, considering that the bidding batches of different fabs and different process equipment are different, the frequency distribution of winning bids by manufacturers in mainland China may not be even, resulting in certain fluctuations in the domestic production rate. In recent years, benefiting from the continuous development of Chinese mainland manufacturers such as North Huachuang, China Micro, Shengmei Semiconductor, Xinyuan Micro, Yitang Semiconductor, Zhichun Technology, Huahai Qingke, etc., in etching, deposition, cleaning, polishing, drying The domestic rate of winning bids for semiconductor equipment in the fields of degumming, furnace tube, gluing and developing is relatively high. Judging from the annual data, the domestic production rate of equipment will reach 27.4% in 2021, a significant increase from 16.8% in 2020. Among the 68 sets of equipment opened by mainstream fabs in June 2022, a total of 44 sets of equipment are from manufacturers in mainland China, accounting for 64.7%; among the 548 sets of equipment opened in bids from January to June 2022, those from mainland China A total of 189 sets of equipment were manufactured by manufacturers, accounting for 34.5%.

In terms of fabs, from January to June 2022, the domestic production rate of Shanghai Jita equipment will exceed 50%. The 548 sets of equipment to be opened from January to June 2022 are mainly from Hua Hong Wuxi (291 sets), Shanghai Jita (210 sets), Times Electric (16 sets), Fujian Jinhua (23 sets), Huali Integration (6 sets) ), Huali Microelectronics (2 units). The wafer fabs that won the most bids for domestic equipment were Shanghai Jita (126 units), Hua Hong Wuxi (45 units), Times Electric (8 units), and Fujian Jinhua (9 units). Among them, Shanghai Jita has a domestic production rate of over 50%, and Hua Hong Wuxi bid opening equipment accounts for a relatively high proportion of foreign equipment, with a domestic production rate of about 15.5%.

By equipment: From January to June in 2022, the domestic production rate of dry degumming, etching and cleaning equipment is relatively high. According to the number of domestic equipment won bids from high to low, the winning bids of domestic manufacturers of different process equipment are as follows: etching equipment (44 units), deposition equipment (29 units), furnace tube equipment (26 units), dry degumming equipment (25 units) sets), front-end testing equipment (11 sets), polishing equipment (9 sets), cleaning equipment (19 sets), ion implanters (7 sets), back-channel testing equipment (12 sets), glue coating and developing equipment (6 sets) ), lithography machine (1 set). Among them, the links with high domestic production rate are mainly dry degumming equipment (81% domestic production rate), etching equipment (54%), polishing equipment (43%), cleaning equipment (58%), and glue developing equipment (35.3%).

escobar said:

TSMC's Former General Counsel Richard Thurston on the CHIPSAct : use it as the opportunity to get more involved in the US.

https://twitter.com/i/web/status/1553072444851687425

Click to expand...

So they are allowing investing in China on nodes China is domestically fully capable, to impede the domestic growth in those nodes, while banning investments in advanced nodes. Now that SMIC is capable of 7nm may be they will lower it to 14nm rather than 28nm. According to that series of tweets, the language about it is kept vague to implement it as they see fit. She says

Thurston told me that that "it is deliberately left wording vaguer than originally was being proposed to allow for more flexibility on how it's applied." He also says he could argue 16nm and 22nm has no difference with 28nm materially. If so, TSMC's 16nm could be safe. (5/11)

Click to expand...

Looks like with the ChipsAct they are also moving ahead with further restriction on equipment sales to China. Bloomberg is reporting that KLA and Lam has already been notified by USG.

US Quietly Tightens Grip on Exports of Chipmaking Gear to China​

• Lam Research and KLA were notified of new China restrictions
• US is trying to contain China’s semiconductor ambitions

The US is tightening restrictions on China’s access to chipmaking gear, according to two major equipment suppliers, underscoring Washington’s accelerating efforts to curb Beijing’s economic ambitions.

Washington had banned the sale of most gear that can fabricate chips of 10 nanometers or better to Chinese leader Semiconductor Manufacturing International Corp. without a license. Now it has expanded that barrier to equipment that can make anything more advanced than 14 nm, Lam Research Corp. Chief Executive Officer Tim Archer told analysts. The moratorium likely extends beyond SMIC and includes other fabrication plants run by contract chipmakers operating in China, including those by Taiwan Semiconductor Manufacturing Co.

“We were recently notified that there was to be a broadening of the restrictions of technology shipments to China for fabs that are operating below 14 nanometers,” Archer said on a conference call on Wednesday. “That’s the change, I think, people have been thinking might be coming and we’re prepared to fully comply. We’re working with the US government.”

In chip manufacturing, production identified by lower numbers of nanometers is more advanced. That means raising the restriction level to 14 nm from 10 would cover a broader range of semiconductor equipment.

The Commerce Department said in a statement it is tightening policies aimed at the People’s Republic of China, without specifying the precise chip geometry.

“The Biden Administration is focused on impairing PRC efforts to manufacture advanced semiconductors to address significant national security risks to the United States,” the agency said.

In the past two weeks or so, all US equipment makers have received letters from Commerce telling them not to supply gear to the Chinese for manufacturing at 14 nm or below, according to people familiar with the matter. The letters are at least partly an effort by the Biden administration to look tough on China, but Commerce had already declined many licenses at 14 nm so the change will have little financial impact, they said.

The new requirements are targeted at foundries -- facilities making logic chips for others -- and exclude memory chips “to the best of our understanding,” Archer said. Lam Research executives said they had incorporated the impact of the US requirements into their outlook for the September quarter, without elaborating.

KLA Corp. CEO Rick Wallace on Thursday also confirmed his company had been notified by the US government of the change in export licensing requirements on China-bound gear for chips more advanced than 14 nm. Wallace said there was no material impact on KLA’s business.

The comments from the two California-based companies mark the first detailed confirmation that the Biden administration is ramping up attempts to contain China. The US is pushing partner countries like the Netherlands and Japan to ban ASML Holding NV and Nikon Corp. from selling to China mainstream technology essential in making a large chunk of the world’s chips, Bloomberg News has reported.

The new rules cover a wider swath of semiconductors across a plethora of industries and possibly impact far more companies than standing restrictions targeted at SMIC. While the new curbs specifically cover equipment capable of making chips more advanced than 14 nm, mature chips could still be affected as about 90% of gear is compatible from one generation to the next. Semiconductor manufacturers can reuse equipment as they migrate to more sophisticated nodes, meaning a ban on one generation could have longer-term ripple effects.

SMIC and TSMC are the two companies with the most advanced logic chipmaking capabilities in China. SMIC’s most sophisticated technology is 14 nm, while TSMC’s best is 16 nm in the country. Those are three generations behind the most cutting-edge technology TSMC owns in Taiwan.

The new rules are likely to impact SMIC, TSMC and any others with the ambition to build capacity for relatively advanced chips in China, as well as gearmakers such as Applied Materials Inc., ASML and Tokyo Electron Ltd. that sell to the world’s largest semiconductor market.

Representatives for TSMC, Tokyo Electron and SMIC didn’t immediately respond to requests for comment. An ASML spokesman said the company has not been notified of the potential new rules. A Nikon spokesperson said its shipments to China are not affected.

huemens said:

Looks like with the ChipsAct they are also moving ahead with further restriction on equipment sales to China. Bloomberg is reporting that KLA and Lam has already been notified by USG.

Please, Log in or Register to view URLs content!

US Quietly Tightens Grip on Exports of Chipmaking Gear to China​

• Lam Research and KLA were notified of new China restrictions
• US is trying to contain China’s semiconductor ambitions

The US is tightening restrictions on China’s access to chipmaking gear, according to two major equipment suppliers, underscoring Washington’s accelerating efforts to curb Beijing’s economic ambitions.

Washington had banned the sale of most gear that can fabricate chips of 10 nanometers or better to Chinese leader Semiconductor Manufacturing International Corp. without a license. Now it has expanded that barrier to equipment that can make anything more advanced than 14 nm, Lam Research Corp. Chief Executive Officer Tim Archer told analysts. The moratorium likely extends beyond SMIC and includes other fabrication plants run by contract chipmakers operating in China, including those by Taiwan Semiconductor Manufacturing Co.

“We were recently notified that there was to be a broadening of the restrictions of technology shipments to China for fabs that are operating below 14 nanometers,” Archer said on a conference call on Wednesday. “That’s the change, I think, people have been thinking might be coming and we’re prepared to fully comply. We’re working with the US government.”

In chip manufacturing, production identified by lower numbers of nanometers is more advanced. That means raising the restriction level to 14 nm from 10 would cover a broader range of semiconductor equipment.

The Commerce Department said in a statement it is tightening policies aimed at the People’s Republic of China, without specifying the precise chip geometry.

“The Biden Administration is focused on impairing PRC efforts to manufacture advanced semiconductors to address significant national security risks to the United States,” the agency said.

In the past two weeks or so, all US equipment makers have received letters from Commerce telling them not to supply gear to the Chinese for manufacturing at 14 nm or below, according to people familiar with the matter. The letters are at least partly an effort by the Biden administration to look tough on China, but Commerce had already declined many licenses at 14 nm so the change will have little financial impact, they said.

The new requirements are targeted at foundries -- facilities making logic chips for others -- and exclude memory chips “to the best of our understanding,” Archer said. Lam Research executives said they had incorporated the impact of the US requirements into their outlook for the September quarter, without elaborating.

KLA Corp. CEO Rick Wallace on Thursday also confirmed his company had been notified by the US government of the change in export licensing requirements on China-bound gear for chips more advanced than 14 nm. Wallace said there was no material impact on KLA’s business.

The comments from the two California-based companies mark the first detailed confirmation that the Biden administration is ramping up attempts to contain China. The US is pushing partner countries like the Netherlands and Japan to ban ASML Holding NV and Nikon Corp. from selling to China mainstream technology essential in making a large chunk of the world’s chips, Bloomberg News has reported.

The new rules cover a wider swath of semiconductors across a plethora of industries and possibly impact far more companies than standing restrictions targeted at SMIC. While the new curbs specifically cover equipment capable of making chips more advanced than 14 nm, mature chips could still be affected as about 90% of gear is compatible from one generation to the next. Semiconductor manufacturers can reuse equipment as they migrate to more sophisticated nodes, meaning a ban on one generation could have longer-term ripple effects.

SMIC and TSMC are the two companies with the most advanced logic chipmaking capabilities in China. SMIC’s most sophisticated technology is 14 nm, while TSMC’s best is 16 nm in the country. Those are three generations behind the most cutting-edge technology TSMC owns in Taiwan.

The new rules are likely to impact SMIC, TSMC and any others with the ambition to build capacity for relatively advanced chips in China, as well as gearmakers such as Applied Materials Inc., ASML and Tokyo Electron Ltd. that sell to the world’s largest semiconductor market.

Representatives for TSMC, Tokyo Electron and SMIC didn’t immediately respond to requests for comment. An ASML spokesman said the company has not been notified of the potential new rules. A Nikon spokesperson said its shipments to China are not affected.

Click to expand...

tokenanalyst said:

Like most things in US politics, none of this makes sense. 10 to 14nm makes little difference to the equipment used, most semiconductor equipment has a wide range of use at multiple nodes, for example AMEC RIE etching equipment is rated at 40nm up to 7nm and the immersion scanners are rated at 45nm all the way up to 5nm and even KLA metrology says their equipment is rated to 1X? What X is equal? x = 4? x=0? x=9? they can make X equal to any number they want.
Like cooking, it's the factory's ability to use their tools that determines the process, of course, better tools like (EUV) are more likely to lead to better and faster results, but it's not always necessary. In my opinion, they are writing the rules as vaguely as possible to satisfy both the semiconductor lobby and national security hawks. If the companies lobby well they will allow sales and if the hawks complain a lot they restrict exports, all using a vague rule.
At the end of the day the Chinese "gradualists" and the Chinese "endophobes" are losing the narrative battle. China needs to move on, increase R&D in this area, even with the state absorbing some or most of the cost. Invest, encourage and redirect companies close to the semiconductor industry to become suppliers. Make an effort to localize as close to 100% of the most mature nodes as possible to create a virtuous circle among local providers. Tell these people that if they are not going to sell their advanced technology, they will not be allowed to monopolize the mature market.​

View attachment 94404
View attachment 94405

Click to expand...

nothing can stop China. these sanctions keep fueling China's rise high tech.

which Chinese firm is domestic alternative of KLA ? i forgot the name. recently that firm did breakthrough in metrology system. very crucial for semiconductor manufacturing..

olalavn​

tokenanalyst​

Sometimes I have to look at those shocking news：



The person in charge of the MIIT was investigated for a reason.

This is a long chain of corrupt relationships.Corrupt bureaucrats responsible for investing in the chip industry seem to have conspired with entrepreneurs to defraud a large amount of money.

According to the video, more corruption cases in the semiconductor industry will be investigated and dealt with in the future.