The official Great Wall of China announced that the company's Zhengzhou Railway Transport Information Technology Research Institute, based on the experience and development base of semiconductor laser invisible wafer cutting equipment, introduced a new technology that fully supports cutting ultra-thin wafers. Fully automatic 12 inch laser grooving equipment .
in addition to conventional laser grooving, it also supports 5nm DBG process, ultra-thin wafer full cutting function below 120 microns, IGBT fab-related processes and TAIKO ultra-thin ring cutting and other Other high-precision processes finish the process.
The Great Wall of China official claims that the device's modular design can support lasers of different pulse widths (nanosecond, picosecond, femtosecond). The self-developed optical system can continuously adjust the width and length of the spot. With high-precision motion control platform and other technologies, it is combined with laser stealth cutting equipment to solve the problems of laser stealth cutting equipment on surface materials, thickness , crystal orientation and resistivity. Limit, which helps control product breakage rate and improves chip yield.