Chinese semiconductor industry

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hvpc

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@hvpc Bro I take the challenge and hope you have the patient...lol It's not the 70% chips produced locally as advertise, which may take a decade to accomplished as China local demand had become even larger each year BUT the estimate percentage of domestic core equipment needed to produced a Chip. Why the 70% and not 100%, well it doesn't include an EUVL machine and its core equipment. As it's discussed here 2025 is the year of its introduction. So that's my conclusion, let's wait after the 14th 5 year plan in 2026 if China did succeeded in making the MIC 2025 a reality.
@ansy1968 , My bad, you answered an incomplete question that I was drafting yesterday. I didn’t mean for it to be in my last post (to ask for the actual paper on laser damage in CaF2 lenses).

but since we are already in this topic, my original question is what is everyone’s interpretation on MIC2025 target, whether the 70% domestic made wafers include those produced by foreign companies in China or is this target only counts domestic company produced wafers. That’s my intended question.
 

ansy1968

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@ansy1968 , My bad, you answered an incomplete question that I was drafting yesterday. I didn’t mean for it to be in my last post (to ask for the actual paper on laser damage in CaF2 lenses).

but since we are already in this topic, my original question is what is everyone’s interpretation on MIC2025 target, whether the 70% domestic made wafers include those produced by foreign companies in China or is this target only counts domestic company produced wafers. That’s my intended question.
@hvpc Bro my take the original gov't goal is either foreign or domestic BUT now with incoming preponderance of local equivalent at least with preference of using domestic equipment. I like to see in the future TSMC using Chinese equipment, Opps!!! they already have with AMEC....lol
 

tokenanalyst

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@tokenanalyst
ok. So …..what is the conclusion? Could you share the entire paper? Thanks.

Abstract​

The laser-induced damage threshold of a calcium fluoride (CaF2) single crystal was obtained by a 193 nm ArF excimer laser. The damage morphology of the crystal was analyzed. The results showed that the surface of CaF2 single crystal broke along the natural cleavage plane under ArF excimer laser irradiation, some fragments fell off, and Newton’s rings were observed on the curved fragments. Laser-induced periodic stripe structures (LIPSS) appeared on the surface layer beneath the fragments that peeled off. The spacing of LIPSS was measured, and the formation mechanism of LIPSS was analyzed based on the interference model.

Normal material research that could have some implications in the development of better lasting optics.

The papers are paywalled.
 

tokenanalyst

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China Micro (AMEC) (688012): 1Q22 etching equipment revenue increased by 105% year-on-year, profitability improved significantly​

Operating income increased by 57.3% year-on-year, and non-net profit increased significantly. In 1Q22, the company achieved revenue of RMB 949 million (YoY 57.3%, QoQ -8.3%), net profit attributable to the parent of RMB 117 million (YoY -14.9%, QoQ -75.0%), and net profit of RMB 186 million (YoY 157.82 billion) %, QoQ 17.0%). The revenue growth was mainly due to the development of the semiconductor equipment market and the competitive advantages of the company's products. The company's main business, especially the etching equipment revenue, achieved a substantial increase; the net profit attributable to the parent decreased compared with the previous period mainly because the non-recurring profit and loss of the current period decreased by approximately 196 million compared with the same period of the previous year. It mainly includes: (1) the government subsidy income included in the current profit and loss in the current period decreased to 40 million yuan from 169 million yuan in the same period of the previous year; (2) the stock prices of SMIC and Tianyue Advanced held by the company were There was a relatively large decline in the current period, resulting in a loss of RMB 101 million related to changes in fair value, an increase of RMB 77 million over the same period of the previous year.

The single-quarter gross profit margin increased by 4.6 pct year-on-year, and the revenue of etching equipment increased by 105.0% year-on-year. The company's 1Q22 gross profit margin was 45.47% (YoY +4.6 pct, QoQ +0.76 pct). Benefiting from the competitive advantages of products and the development of the equipment market, the etching equipment achieved a revenue of 714 million yuan (YoY 105.0%) in a single quarter. The market share of some customers has entered the top three; the number of applications verified by ICP etching machines on the client side is also increasing; as the company's newly signed Mini LED MOCVD equipment scale orders have not yet confirmed revenue in this period, MOCVD equipment Revenue was RMB 42 million, a decrease of approximately 68.6% from the same period last year.

The global semiconductor manufacturing equipment market scale is expected to hit a new high, and the R&D investment intensity has increased to expand categories. SEMI predicts that the global investment in semiconductor wafer manufacturing equipment will reach US$103 billion (YoY 14%) in 2022, exceeding US$100 billion for the first time, and China has also entered the wafer manufacturing expansion cycle. In 2021, the company's R&D investment will be 728 million yuan (YoY 13.8%), accounting for 23.4% of revenue, and the number of R&D personnel will increase by 19.9% to 415. In addition to ensuring the rapid and stable growth of core businesses such as plasma etching equipment and MOCVD equipment, In the field of thin film equipment for integrated circuits, LPCVD equipment and EPI equipment are being developed, and good progress has been made. In addition, the company is planning to develop key equipment such as ALD equipment and ALE equipment.

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tokenanalyst

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1651348116948.png
Interesting paper about the state and needs of Equipment for wide band gap semiconductors in China made by CETC, current state and suggestions for the future. There is some self-interest (they are still a company) but with the current geopolitical climate and the threats from the U.S. hawks, is probably necessary.

Some equipment:

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3-Domestic SiC single crystal growth equipment.

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4-Domestic SiC epitaxial growth furnace engineering prototype
5-Domestic SiC high temperature and high energy ion implanter

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6-Domestic automatic SiC high temperature activation furnace
7-Domestic SiC high temperature oxidation furnace



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hvpc

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Soon, out of the blue, somebody would say that OPPO is related to PLA :rolleyes:
Regardless, the key take away is OPPO and Xiaomi are investing in designing their own chip. The plan is to use tsmc to make the chips.

If OPPO and Xiaomi get the Huawei treatment by the U.S., by that time, hopefully SMIC's process capability would be advanced enough to support.
 
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