Chinese semiconductor industry

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ansy1968

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Looks like there is a rethink in banning and replacing Huawei Telecom in UK and also in the US, and there is even a twit in social media with local operators sarcastically stating that replacing Huawei is to return to 2G...lol. The replacement cost is 6 times the projected expense and the UK chancellery and the US gov't is hard press to provide the fund as the replacement isn't capable of matching the performance.

Since the US government added Huawei to the entity list, the UK was so outstanding in the US-led plan of killing Huawei. It first announced the termination of cooperation with Huawei in 2020, and then made a "further intensified" decision, planning to completely dismantle Huawei's communication equipment in use in 2027. You must know that Huawei has cooperated with the UK for more than 20 years, which has provided tremendous help to the local communication construction and development. Whether Huawei equipment has security problems as the United States said, I am afraid no one knows better than the UK. After all, a British executive publicly admitted in January that they had placed intelligence officers inside Huawei, concluding that there was no security issue with Huawei's technical equipment. But even so, Britain has not canceled the plan to dismantle Huawei equipment. However, the UK's work to dismantle Huawei's 5G equipment has just begun, and the side effect has appeared. On February 22, the United Kingdom officially announced that the first phase of the local dismantling of Huawei's 5G equipment will be postponed for 6 months. Moreover, the plan to reduce Huawei's 5G network usage ratio to 35%, originally scheduled for January 2023, has been rescheduled to July 2023. Why is that? I am afraid that the UK must regret rejecting Huawei, but it still dare not ask for Huawei back, because its boss has not said yes. OK, let’s get more details about this matter.

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FairAndUnbiased

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Hey @FairAndUnbiased bro,
I hope you know I was just messing with you. ;)

Those in my field needs to know minimum feature size on our customer's chip for trouble shooting purpose or for product positioning, business development. This is true for litho, etch, metrology, inspection guys. I can't share the specifics, but I can tell you the logic portion of that chip, a few layers have resolution that require ArF scanner.

I'm sure if you search hard enough you could find the array and logic minimum resolution for 3D-NAND. I'll look, will share with you if I find something. For DRAM & 3D-NAND, I recall the logic periphery resolution requirement is usually equivalent to just one or two nodes behind the memory array.
Does YMTC outsources the logic portion? It is clearly not fabless but it also may not do everything in house.
 

kaliko

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The Biden administration is looking into claims that Yangtze Memory Technologies Co, a Chinese semiconductor maker, has supplied Huawei with chips, in a potential violation of US export controls.
The report said Huawei was using YMTC chips in its Enjoy 20e phone. The chips were made in February 2021, six months after then-president Donald Trump applied the foreign direct product rule, which bans US and foreign groups from exporting US technology to Huawei.
To determine whether YMTC was violating FDPR, the commerce department would have to conclude it had “knowledge” that its chips were destined for Huawei. This can be complicated for commodity chips that can be sold off the shelf.
 

tokenanalyst

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Progress in research on excimer laser-induced damage to calcium fluoride crystals

  Recently, the excimer laser team of the Anguang Institute of Lasers, Hefei Research Institute, Chinese Academy of Sciences has made new progress in excimer laser-induced damage of calcium fluoride (CaF2 ) crystals. The relevant results were published in Applied Surface Science and other journals.
  CaF2 crystal is an important component in ultraviolet optical system, especially in semiconductor lithography system, CaF2 crystal directly affects the stability and life of the system, so the study of the anti-laser damage ability of CaF2 crystal is used in semiconductor lithography, photoelectric countermeasures and other application areas are of great significance. In view of this, researcher Liang Xu and associate researcher Shao Jingzhen of the team used self-developed 193 nm and 248 nm deep ultraviolet excimer lasers to carry out laser-induced damage research on CaF2 crystals. By analyzing the relationship among the crystal planes, cleavage planes and slip planes of CaF2 crystals, the effects of 248 nm excimer laser on three different crystal planes of CaF2 crystals (111), (110) and (100) are summarized. damage mechanism. At the same time, under the irradiation of 193 nm excimer laser, a laser-induced periodic stripe structure (LIPSS) was formed on the surface of CaF2 crystal , and the formation of this structure has important guiding significance for the laser micro processing of CaF2 crystal surface .
  The above research work has been supported by the research instrument and equipment development project of the Chinese Academy of Sciences, the National Natural Science Foundation of China, the Youth Innovation Promotion Association of the Chinese Academy of Sciences, and the Open Fund of the State Key Laboratory of Pulsed Power Laser Technology.
  Article link:
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W020220225575331899988.jpg


Corresponding relationship between damage morphologies and crystal structures of different crystal planes of CaF2 crystals
  
W020220225575332604319.jpg

Excimer laser - induced periodic structure of CaF2 crystals​
 

hvpc

Junior Member
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Progress in research on excimer laser-induced damage to calcium fluoride crystals

  Recently, the excimer laser team of the Anguang Institute of Lasers, Hefei Research Institute, Chinese Academy of Sciences has made new progress in excimer laser-induced damage of calcium fluoride (CaF2 ) crystals. The relevant results were published in Applied Surface Science and other journals.
  CaF2 crystal is an important component in ultraviolet optical system, especially in semiconductor lithography system, CaF2 crystal directly affects the stability and life of the system, so the study of the anti-laser damage ability of CaF2 crystal is used in semiconductor lithography, photoelectric countermeasures and other application areas are of great significance. In view of this, researcher Liang Xu and associate researcher Shao Jingzhen of the team used self-developed 193 nm and 248 nm deep ultraviolet excimer lasers to carry out laser-induced damage research on CaF2 crystals. By analyzing the relationship among the crystal planes, cleavage planes and slip planes of CaF2 crystals, the effects of 248 nm excimer laser on three different crystal planes of CaF2 crystals (111), (110) and (100) are summarized. damage mechanism. At the same time, under the irradiation of 193 nm excimer laser, a laser-induced periodic stripe structure (LIPSS) was formed on the surface of CaF2 crystal , and the formation of this structure has important guiding significance for the laser micro processing of CaF2 crystal surface .
  The above research work has been supported by the research instrument and equipment development project of the Chinese Academy of Sciences, the National Natural Science Foundation of China, the Youth Innovation Promotion Association of the Chinese Academy of Sciences, and the Open Fund of the State Key Laboratory of Pulsed Power Laser Technology.
  Article link:
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W020220225575331899988.jpg


Corresponding relationship between damage morphologies and crystal structures of different crystal planes of CaF2 crystals
  
W020220225575332604319.jpg

Excimer laser - induced periodic structure of CaF2 crystals​
@tokenanalyst
ok. So …..what is the conclusion? Could you share the entire paper? Thanks.
 

ansy1968

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What’s everyone’s interpretation of the MIC2025

ok. So …..what is the conclusion?
@hvpc Bro I take the challenge and hope you have the patient...lol It's not the 70% chips produced locally as advertise, which may take a decade to accomplished as China local demand had become even larger each year BUT the estimate percentage of domestic core equipment needed to produced a Chip. Why the 70% and not 100%, well it doesn't include an EUVL machine and its core equipment. As it's discussed here 2025 is the year of its introduction. So that's my conclusion, let's wait after the 14th 5 year plan in 2026 if China did succeeded in making the MIC 2025 a reality.
 
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