Chinese semiconductor industry
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Naura and piotech had equipment for metal interconnect.
In term of deposition (ALD, PECVD, PVD, ect) there are some companies doing equipment for 28nm or less.
And there is a new kid in the block doing epitaxy for 3dNand.
Also you are confusing scale with capability, even if they have the capability they still need to scale up, they need to meet the demand and that is archived with production investment and collaborating between fab and suppliers to create a positive feedback loop, i think why is one the reasons why people choose AMAT and KLA, they have the production scale to meet the demand. Even if SMEE scanner can match ASML 2050i in the first try, if they can only make one or two a year then fabs are not going to wait. That is why subsystem providers like U-Precision and Guowang Optical and are making plan to scale up production IF they see that will be demand.
Looks like they are looking for ways to minimize the damage caused by the debris of the Tin Plasma.
EUV lithography machine material detection device and test method
CN 113933454 A - 2021
Institute of Microelectronics of CAS
The invention belongs to the technical field of extreme ultraviolet lithography machines, and in particular relates to an extreme ultraviolet lithography machine material detection device, a hydrogen-induced outgassing test method and a hydrogen damage performance test method. The EUV lithography machine material detection device in the present invention includes a vacuum container, an evacuation assembly, a hydrogen supply assembly, a discharge assembly and a detection assembly. The evacuation assembly is communicated with the vacuum container, the hydrogen supply assembly is communicated with the vacuum container, and the discharge assembly It includes a radio frequency generator, a first electrode and a second electrode. The first electrode and the second electrode are located in the vacuum container and are oppositely arranged. The detection component is communicated with the interior of the vacuum container. The detection component is used to detect the vacuum pressure of the vacuum container and the vacuum container. The parameters of the plasma generated in the vacuum vessel, the composition of the gas in the vacuum container and the partial pressure of each gas. By using the EUV lithography material detection device in the technical solution, the structure is simple, and it is convenient for disassembly and measurement.
manqiangrexue
Brigadier
Well, you called someone else a romantic and yourself a realist, which is a veiled insult saying that what you are saying is in touch with reality whereas his opinion is just a romantic dreaming. What's actually happening is that your analysis is coming from your personal experience in a limited field and you are listing specific reasons and your application of those reasons as best your skills allow and he's countering with big data, which is that whenever X is challenged, he defeats the challenge, therefore, it is reasonable to surmise that the pattern will repeat. From the standpoint of a layman, this is the most self-reliant analysis that is untainted by the biased interpretation of others. There's no reason to say that he's a romantic and you're a realist because his observations are every bit as real as yours; his scope is just larger while yours more specific.
Hey look. Why attack him. He has his opinions. Not everyone agrees with him but I for one appreciate additional expertise.
Just a reminder that Chinese semiconductor companies need to secure the supply chain of their production lines and expand production-R&D of parts, subsystems, services, materials, equipment, and software. I have a feeling that short of an economic miracle in the US, the more "moderate" Democrats won't be in power for too long and it looks like the more ideological Republicans are willing give the finger to the allies and go it alone with this. Unless American companies like AMAT, KLA, and LAM start offshoring today, they won't be able to get through this.
AMAT, LAM and KLA have way more competitors than ASML.
There's Naura, AMEC, TEL, Hitachi.
But the problem is they have a lot of production scale, more than any of the others company in the industry, if this companies disappear from the market they will left a huge supply void that will take sometime to fill up as others companies scramble to increase their production capacity and R&D to meet the demand, so is better to act sooner rather than later.
But lets be clear, once the void is fill up, the U.S. will have a lot of trouble in selling even a single screw in China again.
That's why they should try hard to not get sanctioned in the next couple of years. As long as Russia is the news, it's a reprieve for China. The moment they have most of what they need, it won't be a big deal if sanctions go full board.
Also, we are so far from 2024 that I wouldn't be too concerned about who is the next president yet.
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