Capcon receives another large-scale purchase order for advanced packaging equipment from ASE Kaohsiung Plant
Capcon (Huafeng Technology) has received another large-scale equipment purchase order from ASE Kaohsiung Plant. This time, the equipment purchased by ASE is the AvantGo2060W wafer-level package placement machine. AvantGo 2060W can be said to be "high light when it comes out", and the device has been favored by ASE as soon as it came out. Up to now, Capcon (Huafeng Technology) advanced packaging equipment has provided production capacity for ASE for many years.
Capcon (Huafeng Technology) wafer level packaging machine AvantGo 2060W supports processes including WLFO, InFO, COWOS, M-seris, eWLB, 2.5D/3D-TSV, it has ultra-high precision multi-bonding heads, and the accuracy can reach +/-5um@3σ, can reach +/-3um@3σ in high-precision mode (single-head working mode); supports up to 70mm chip front and back mounting, Face up/Face down can be switched freely, supports robotic arms (Cassette, Foup), Wafer, Tape Reel, Waffle Tray Feeder. The hourly capacity is 5000-11500pcs, and the UPH is up to 12k (Face up).