Chinese semiconductor industry

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weig2000

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TSMC will have to compete with Oil/Gas industry in increasingly salaries and bonuses continuously.
This Fab will hardly make $5b revenues where Oil/Gas industry can reach $1T cash flow.

I dont see Taiwan here. so i doubt they have that much surplus labor to allocate to this plant. they need top pay more.

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A very quick glance tells you that the two lists are very biased. Judging by the cities on the list and their ranking, this is probably generated by someone in the US.

Just one validation test: Beijing should be near top in both lists. Whether it's based on talent and resource concentration (universities, institutions, R&D personnel, R&D spending) or the results (publications, patents, start-ups, VC fundings). Occasionally, there are some ranking lists generated in the west recognize this, but this one missed quite a bit.

Of course, one can always define your own criteria and manipulate the results to your liking, which means that this kind of lists are rarely useful, and are usually created for marketing or feel-good purpose.
 

tokenanalyst

Brigadier
Registered Member
TSMC will have to compete with Oil/Gas industry in increasingly salaries and bonuses continuously.
This Fab will hardly make $5b revenues where Oil/Gas industry can reach $1T cash flow.

I dont see Taiwan here. so i doubt they have that much surplus labor to allocate to this plant. they need top pay more.

View attachment 82903
But that is talent in general, the person who works in a oil rig is not necessary the person who they need to run a high tech semiconductor fab and more when most of the talents in that area are in East Asia because the U.S don't fab as much as they use to, the only pure-play foundry in the U.S is skywater and is pretty small compared to most pure-play foundries in Asia. So money is not an issue for TSMC but finding people with semiconductor experience who are willing to work like they are accustomed in East Asia with tight schedules, overworking themselves, strict work ethic and doing personal sacrifices, is pretty difficult here in the West.​
 

pmc

Major
Registered Member
it is same population and talent pool. Oil and Gas industry is vast and diversified in locations. chemical and petroleum engineer salaries not much less let alone over time work in the field.
TSMC purchase of ASML machines not that much higher than Samsung that it need to spend so much more on foundry investment. unless 2022 fundamentally changes. Samsung already has experience with foundry labor in Texas so much easier to scale up.

ASML sale breakdown.

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tokenanalyst

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Several EDA new products released

In 2021, a number of EDA companies will release new products.

Core China Chapter ( XEPIC )


Xinhuazhang released four digital verification EDA products with independent intellectual property rights, as well as a smart V verification platform with a unified underlying framework, which not only realizes multi-tool collaboration, reduces the threshold for EDA use, but also improves the overall verification efficiency of the chip.

The FusionVerify Platform consists of five product series including logic simulation, formal verification, intelligent verification, FPGA prototype verification system and hardware emulation system, and three bases including intelligent compilation, intelligent debugging and intelligent verification cockpit . It has a unified debugging system, compilation system, intelligent segmentation technology, rich scene incentive sources, and unified cloud-native software architecture. It can integrate different tool technologies and provide customized comprehensive verification solutions for various designs and different scene requirements. The solution is to solve the compatibility challenges of point tools that are currently facing the industry, as well as the verification efficiency challenges caused by data fragmentation. The Smart V verification platform can effectively improve the verification efficiency and ease of use of the solution, and bring verification benefits that cannot be provided by some tools.

HuaPro - P1 high - performance FPGA prototype verification system, based on FPGA hardware and full-process software with independent intellectual property rights, can help SoC/ASIC chip customers achieve automatic synthesis, segmentation, optimization, wiring and debugging of design prototypes. Automatically realize the intelligent design process, effectively reduce the user's manual input, shorten the chip verification cycle, and provide a new generation of intelligent pre-silicon verification system with large capacity, high performance, automatic realization, debugging and high availability for system verification and software development.

GalaxSim - 1.0 , the leading digital simulator in China, uses a new software framework to provide multi-platform support, supports different processor computing platforms, such as X86, ARM, etc., and has been used in many domestic frameworks based on ARM platforms. Test passed. It can be combined with the general debugger and general coverage database of Xinhuazhang's Qiongjing GalaxPSS intelligent verification system, and the Qiongding emulator can efficiently cooperate with other verification tools and provide a unified data interface. It supports IEEE1800 SystemVerilog syntax, IEEE1364 Verilog syntax, and IEEE1800.2 UVM methodology, and has reached the level of mainstream commercial simulators in terms of semantic analysis, simulation behavior, and timing models.

GalaxPSS is a new generation of intelligent verification system, based on the integration of Accellera PSS standard and advanced verification methodology, for current and future complex verification scenarios, automatically generate scenarios, reduce the experience of engineers manually writing scenarios, and generate more for the chip Efficient test scenarios and test incentives improve the coverage and completeness of verification scenarios. The code generated by PSS is portable, which can ensure that it is suitable for software simulation, hardware simulation, FPGA prototype verification, and even system verification, providing from single-platform verification to multi-platform interactive verification.

GalaxFV is the first scalable formal verification tool based on word-level modeling in the domestic EDA field . Expanding the interface, the model has reached the international advanced level. Equipped with a high-concurrency and high-performance solver, an intelligent scheduling algorithm engine, and a dedicated assertion library, it can make full use of computing power and improve parallel efficiency, while effectively improving ease of use and efficiency, lowering the threshold for formal verification to be applied to the industry. .

Guowei Sierxin ( S2C )


Released the architecture design solution " Genesis Craftsman ", providing a one - stop software and hardware collaborative modeling platform to help designers completely solve the problems that cannot be modeled. Quickly design high-performance, low-power product architectures, speed up time-to-market, and enhance product competitiveness.

Launched a cutting-edge technology innovation product in the field of prototyping: Xinshentong Logic Matrix LX2 . As an industry-leading enterprise-level high-density prototype verification solution, it has excellent performance in the two dimensions of "capacity" and "performance", meeting the verification requirements of cutting-edge 5G, AI, ML, GPU and other applications, accelerating system verification and software development, Reduce time to market.

Semitronix


Guangliwei released DataExp-General, which supports the import of various file types: .csv / .xls / .xlsx / .ad3 / .ad5 / .stdf / .std; it can meet the needs of engineers for fast and flexible analysis, and based on semiconductor data Features, add a unique analysis module, visualize multi-dimensional data, and quickly mine value from massive data.

Hejian Industrial Soft ( UNIVISTA )



Commercial-grade simulator product UniVista Simulator: It adopts advanced compilation and performance enhancement technology to optimize compilation time and running speed, and provides efficient and reliable digital verification simulation for various types of customer designs.

FPGA prototype verification system ( UniVista Advanced Prototyping System ): with high performance, large capacity, diversified IO support, built-in 8938K x 4 logic resources, 6500+ IO resources, typical SoC design running performance can reach 20-50Mhz, and has 144 channels High-speed GTY transceiver, up to 25Gbps, scalable multi-channel DDR memory speed up to 2133Mbps, supports multiple systems cascade, supports up to 20 sets of cascade, supporting runtime real-time control.

Integrated collaborative design ( UniVista Integrator ): It adopts the first system-level network connection checking algorithm to provide efficient graphics rendering and display, with excellent openness, ease of use, flexibility, expansibility, and integration. And support the easy import of design data, which can generate efficient and accurate inspection reports.

One-stop electronic design data management platform ( UniVistaEDMPro ): including RMS (Repository Management System), EDMS (Electronic Design Process Management and Quality Review System), ERC (Electronic Design Check Tool) and PDMCon (PDM/PLM System Integration Solution) and other applications.
 

tokenanalyst

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Registered Member

Several EDA new products released

In 2021, a number of EDA companies will release new products. cont....

Core and Semiconductor (XPEEDIC)

  • The " 3D-IC advanced packaging design analysis process " EDA platform seamlessly integrates the chip and 2.5D/3DIC advanced packaging analysis solution Metis with the existing design process of Synopsys 3DIC Compiler, breaking through the limits of traditional packaging technology and supporting chips at the same time. The interconnection of hundreds of thousands of data channels. It is the industry's first unified platform for 3DIC multi-chip system design analysis, providing customers with a fully integrated, high-performance, and easy-to-use environment that provides services from development, design, verification, signal integrity simulation, power integrity simulation 3DIC full-process solution to final sign-off.
  • High-precision electromagnetic simulation engine FEM3D for arbitrary 3D structures: accurate to terahertz frequency and supports multiple port types. ViaExpert, the product using this simulation engine, can realize fast and accurate high-speed via modeling and optimization, CableExpert can realize fast and accurate cable modeling and optimization, Hermes3D supports various mainstream package types, and supports co-simulation of package and PCB for analysis Electromagnetic coupling effects between various packages and PCBs.
  • Power integrity product Hermes PSI: Using the latest high-precision DC simulation engine, it has a complete PI DC analysis process. In addition, Xinhe also released the 2021 version of the high-speed channel simulation analysis platform ChannelExpert, the Analog/RF/MW system design platform XDS and other tool suites, as well as the LibManager that builds the online management ecosystem of the device library.

PRIMARIUS


  • Released NanoCell, a fast and accurate standard cell library characterization tool. Through the built-in NanoSpice simulator, advanced distributed parallel architecture technology and cell circuit analysis and extraction algorithms are used to accurately and efficiently perform timing, power consumption and noise characteristics of cell circuits. Simulation and extraction provide a friendly and easy-to-use interface to help users shorten the product development cycle.
  • Released the advanced parametric cell library development platform PCellLab, which has built-in development templates with rich and comprehensive functions and a friendly graphical interactive interface. It can automatically generate PCell codes according to the process and design parameters input by users, and supports users to automatically generate PCell codes according to their own process characteristics. Define development templates to help PDK developers complete development work quickly, efficiently, and with high quality.
  • Released NavisPro, a hierarchical SoC design planning solution, which is an early RTL design planning solution for SoC design optimization for power consumption and timing. It can predict and prevent physical implementation problems in the design. The interface network timing estimation across design levels enables designers to Minimize design iterations to shorten time-to-market for SoC designs.
  • And the intelligent advanced device model automatic extraction platform SDEP, dual-engine FastSPICE circuit simulator NanoSpice Pro, and semiconductor parameter test system FS-Pro have been upgraded.

Bionchip (BTD)


The full-featured RF circuit simulator "BTDSim" has a complete SPICE circuit simulation function. BTDSim also has a variety of algorithms and functions specially developed for RF simulation, suitable for core communications including signal amplifiers, mixers, frequency boosters, oscillators, VCOs, AGCs, PLLs, Mux, Demux, timers, CDR design, etc. /RF circuit simulation and design. A full-featured RF circuit simulator that supports mainstream active device models and S-parameter models, while supporting multi-CPU and GPU acceleration. Meet customers' high requirements for high-precision circuit simulation in high-end large-scale RF chip/IP design. The product has now passed key user tests.
 

Hyper

Junior Member
Registered Member
A very quick glance tells you that the two lists are very biased. Judging by the cities on the list and their ranking, this is probably generated by someone in the US.

Just one validation test: Beijing should be near top in both lists. Whether it's based on talent and resource concentration (universities, institutions, R&D personnel, R&D spending) or the results (publications, patents, start-ups, VC fundings). Occasionally, there are some ranking lists generated in the west recognize this, but this one missed quite a bit.

Of course, one can always define your own criteria and manipulate the results to your liking, which means that this kind of lists are rarely useful, and are usually created for marketing or feel-good purpose.
No Beijing continuously loses talent to other cities like Shenzhen bay area and to Shanghai . The mainstay of the city is not innovation but administration. Shenzhen bay area should be top 3.
 

ansy1968

Brigadier
Registered Member
From @Oldschool almost there, the indigenous effort is gaining steam and I think the Samsung flash chip is FAB in Xian China, therefore technically made in China.

Oldschool

Junior Member​

Registered Member
48 minutes agoNew
another good one, almost all the chips are domestic except 1 samsung flash chip. longsys memory chip could be CMXT LPDDR4


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腾讯极光盒子4C内部结构简单,所以拆解也很容易。共分为外壳、主板、散热片加上底壳4个部件组装,盒子各个部件间通过卡扣固定。芯片方面大多都为采用国产方案,选用的是全志科技H313整体解决方案。盒子内出现的国产厂商有全志科技Allwinner、芯之联科技XRadioTech、深圳江波龙旗下FORESEE、深圳芯智汇科技X-Powers、广东美信科技FPE MISUN,仅有闪存芯片采用韩国三星。
 

tokenanalyst

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The first in the country! Xinyuan Semiconductor 28/22nm ReRAM 12-inch pilot line trial production​


According to micronet news, recently, the first 28/22nm ReRAM (resistive variable memory) 12-inch pilot production line in China led by Hangzhou Xinyuan Semiconductor successfully completed the installation and acceptance of self-developed equipment, realizing the integration of the pilot line process. line, and successfully tape-out (trial production).

Xinyuan Semiconductor was established in 2019, focusing on the research and development of new ReRAM memory products and related derivatives. It has grown into a leading enterprise in new memory technology in China, and is also the fastest commercializing company in the world for new memory products. The ReRAM memory developed by the company has the characteristics of high density, low energy consumption, fast read and write speed, and data storage after power-off. "Storage Wall". As the most potential next-generation main memory, ReRAM can be widely used in artificial intelligence, industrial control, consumer electronics, automobiles, Internet of Things, cloud computing and other fields.

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huemens

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The first in the country! Xinyuan Semiconductor 28/22nm ReRAM 12-inch pilot line trial production​


According to micronet news, recently, the first 28/22nm ReRAM (resistive variable memory) 12-inch pilot production line in China led by Hangzhou Xinyuan Semiconductor successfully completed the installation and acceptance of self-developed equipment, realizing the integration of the pilot line process. line, and successfully tape-out (trial production).

Xinyuan Semiconductor was established in 2019, focusing on the research and development of new ReRAM memory products and related derivatives. It has grown into a leading enterprise in new memory technology in China, and is also the fastest commercializing company in the world for new memory products. The ReRAM memory developed by the company has the characteristics of high density, low energy consumption, fast read and write speed, and data storage after power-off. "Storage Wall". As the most potential next-generation main memory, ReRAM can be widely used in artificial intelligence, industrial control, consumer electronics, automobiles, Internet of Things, cloud computing and other fields.

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This is going to compete with Intel's Optane business right? There was a report a couple of weeks ago that Optane was already running at a loss.
 
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