If the US goes ahead to sanction SMIC and other FABs, this could be the biggest gift to the Chinese Semiconductor Industry.
Lets look at what will happen if this goes ahead:
1) The business of American, Japanese and European Semiconductor Equipment Manufacturers in China will be destroyed overnight. No Chinese FAB would buy foreign equipment which would eventually become unusable and worthless scrap metal.
The Local Equipment manufacturers like Naura, CETC and SMEE would benefit as all the local FABs would order equipment from them. This will allow them to make more profits and reinvest in R&D.
2) This also means that SMIC and other FABs can continue to supply Huawei with Chips till its materials and spare parts run out. This could save Huawei's Handset business and provide the SOCs for its 5G Base Stations.
3) The Government will probably order SMIC to hand over its foreign made equipment from ASML, LAM and KLA TENCOR to local manufacturers for inspection and Reverse Engineering. China could then be producing the latest Semiconductor Equipment within 6 months. Local FABs can then use the SMEE 28nm Litho together with Localised Manufacturing Equipment to rapidly start producing 14nm and 7nm Chips.
4) In the long term, the Government should provide financial support to innovative Semiconductor equipment manufacturers. This will keep Chinas FABs up to date with the latest processes and technologies.
Lets look at what will happen if this goes ahead:
1) The business of American, Japanese and European Semiconductor Equipment Manufacturers in China will be destroyed overnight. No Chinese FAB would buy foreign equipment which would eventually become unusable and worthless scrap metal.
The Local Equipment manufacturers like Naura, CETC and SMEE would benefit as all the local FABs would order equipment from them. This will allow them to make more profits and reinvest in R&D.
2) This also means that SMIC and other FABs can continue to supply Huawei with Chips till its materials and spare parts run out. This could save Huawei's Handset business and provide the SOCs for its 5G Base Stations.
3) The Government will probably order SMIC to hand over its foreign made equipment from ASML, LAM and KLA TENCOR to local manufacturers for inspection and Reverse Engineering. China could then be producing the latest Semiconductor Equipment within 6 months. Local FABs can then use the SMEE 28nm Litho together with Localised Manufacturing Equipment to rapidly start producing 14nm and 7nm Chips.
4) In the long term, the Government should provide financial support to innovative Semiconductor equipment manufacturers. This will keep Chinas FABs up to date with the latest processes and technologies.