Re: The End of the Carrier Age?
thats passive cooling, not sufficient for chips reach 90c and generate alot heat. current microchip thats powerful enough to process large data in real time require active cooling(air flow or liquid flow through heatsink that connect to chips heatspread). its the flow of liquid or air that transfer the heat more efficiently. if you put a cold iron block on your hand, you notice the surface contact your hand is warmer compare to the top of iron block.
also in a compact system all pcb board are stack against each other(with gap between PCB board less than an inch), similar to Backplane design but more compact. its not possible to fit a sizeble heatsink or put a cold pack directly on top of the chip. best way to cool it is using some fan, blow air into the gap between each pcbs or seal the system and spray cool it with non-conductive liquid(done in airplane and UAV such as globalhawk, haven't heard done in a live warhead travel at extreme speed, also require reservior and pump)
anyway any liquid cooling system in an missile/warhead is not ideal, too many potential issues.
ok i'm outta here, its thanksgiving, i have to do my black friday shopping. happy thanksgiving everyone
Nope. A conductor such as a copper pipe contacting both electronics and liquid is sufficed to transfer the heat efficiently. The reason why your computer's CPU needs a heat sink is because the chip's surface area is too small for the heat to be transferred to air effectively. The mechanism for cooling your PC is different than how satellites/warheads cool their electronics. Stop making invalid comparison.
No need to move the liquid. Once activated, instant cold pack is naturally cold. The temperature difference between the liquid and the electronics would cause heat to move away from electronics and into the liquid. This occurs because of . This is Thermal Dynamics 101.
The liquid doesn't need to be moved around, hence no pump or plumbing is required.
thats passive cooling, not sufficient for chips reach 90c and generate alot heat. current microchip thats powerful enough to process large data in real time require active cooling(air flow or liquid flow through heatsink that connect to chips heatspread). its the flow of liquid or air that transfer the heat more efficiently. if you put a cold iron block on your hand, you notice the surface contact your hand is warmer compare to the top of iron block.
also in a compact system all pcb board are stack against each other(with gap between PCB board less than an inch), similar to Backplane design but more compact. its not possible to fit a sizeble heatsink or put a cold pack directly on top of the chip. best way to cool it is using some fan, blow air into the gap between each pcbs or seal the system and spray cool it with non-conductive liquid(done in airplane and UAV such as globalhawk, haven't heard done in a live warhead travel at extreme speed, also require reservior and pump)
anyway any liquid cooling system in an missile/warhead is not ideal, too many potential issues.
ok i'm outta here, its thanksgiving, i have to do my black friday shopping. happy thanksgiving everyone
Last edited: