Chinese semiconductor thread II

[tokenanalyst]

Shanghai Pengxi Semiconductor completes strategic financing of over 1 billion yuan, focusing on breakthroughs in the localization of CIM systems.​

Recently, Shanghai Pengxi Semiconductor Co., Ltd. (hereinafter referred to as "Pengxi Semiconductor"), a provider of CIM system solutions for semiconductor integrated circuit manufacturing, has successfully completed a strategic financing round of over RMB 1 billion. This round of financing was jointly invested by SMIC Capital, Walden International, Shengyu Investment, Tongchuang Venture Capital, Yuanhe Capital, and Wangsu Science & Technology, demonstrating the high recognition of the company's technological strength and industry prospects by industrial capital and leading institutions.

Founded in 2019, Pengxi Semiconductor is a national high-tech enterprise and a Shanghai "Specialized, Refined, and Innovative" enterprise, specializing in providing highly customized, integrated hardware and software CIM (Computer Integrated Manufacturing) solutions for 12-inch advanced wafer fabs. As one of the few domestic companies with full-chain capabilities in CIM solution design, R&D, implementation, and operation and maintenance, the company's core technologies cover core semiconductor manufacturing aspects such as Manufacturing Execution Systems (MES), Equipment Automation (EAP), yield management, and big data platforms. It is committed to breaking the long-term monopoly of foreign manufacturers in this field and accelerating the process of domestic substitution.

According to official disclosures, the funds raised in this round will be primarily invested in three areas: first, continuously increasing R&D and iteration of the CIM core software, especially in tackling key technologies for advanced manufacturing processes; second, expanding the high-end technology implementation and service team to improve project delivery capabilities; and third, comprehensively expanding market coverage and deepening strategic cooperation with major domestic wafer foundries. The company stated that the financing will further solidify its leading position in the field of semiconductor intelligent manufacturing industrial software, providing crucial support for the independent control and intelligent upgrading of China's chip manufacturing production lines.

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[tphuang]

That doesn't mean anything.

EUV is rarely publicly mentioned and any significant news isn't coming from a guy on X with barely any followers or inside news.

For example, Zephyr is much more active and he says Chinese EUV will be ready in some initial form by 2027 to 2028, complete opposite to the other guy.

I'm not saying he's 100% correct, but there are many different commentators on western social media and none of them are 100% accurate.

Next time you see something like that on X, don't worry about it. The real news is not coming from western media.

Having spoken to zephyr several times on this matter, I can assure you he does not have better info than this thread.

I think people need to relax a little bit and just read all the stuff we post here.

i have read each and every line of this article. this is the repeat of what was already mentioned by SCMP a month ago. they literally copy paste all points when wrote the article plus additional information. old article posted in page 1256 of this thread.. Blitzo sir talked about this as well.

in this new article, they didn't even mention EUV once in context with China's progress except ASML EUV has XXX number of parts. this is the only time when EUV mentioned in this lengthy article.
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but i found something interesting in this article..


the construction and trial operation of a fully domestically produced 7nm production line have been initially completed.

this is exactly what @tphuang sir posted on last page regarding 7nm.. interesting


Breakthroughs have been achieved in EUV laser light source , mobile platforms and optical systems across different organizations. Integrating these systems with national resources is a crucial issue that must be addressed during the 15th Five-Year Plan period.

this information have already disclosed in SCMP old article.

@Tomboy

Just generally speaking, I would not take random people making claims on x too well because they likely dont have the background or context on this stuff.

YMTC and CXMT using all domestic line have been discussed for several months now and reported by digitimes. Not exactly fresh news.

 

[interestedseal]

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One could guesstimate status of DUV and EUV by looking at tool suppliers for major litho components. HCVAC’s latest PVD optics coater update implies aggressive capacity expansion of DUV and EUV optics suppliers like Guowang/Leiwang, CIOMP, SiCarrier. IBD’s ion beam optics coaters are showing the same trend.

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[interestedseal]

Hesai unveiled worlds first SPAD imaging lidar which gives point clouds and RGB colors on the same sensor

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[european_guy]

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One could guesstimate status of DUV and EUV by looking at tool suppliers for major litho components. HCVAC’s latest PVD optics coater update implies aggressive capacity expansion of DUV and EUV optics suppliers like Guowang/Leiwang, CIOMP, SiCarrier. IBD’s ion beam optics coaters are showing the same trend.

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From the above HCVAC (Guangdong Huicheng Vacuum Technology 广东汇成真空)

2026 is expected to be the initial stage of mass production. Specifically, the Guowang/Leiwang system has already notified the company to prepare orders for 5 DUV machines;

Beijing Guowang Optical Technology 国望光学 is the Optical system supplier for immersion lithography DUVi of SMEE

So this seems a real hint that at least 5 DUVi will be shipped this year. Immersion lithography can mean anything from 28nm down to 7nm.

My 2 cents is that 7nm is still maybe too early, last year was probably the DUVi 28nm in production, maybe this year SMEE will push to 14nm in production, and 7nm in 2027. It is not realistic to expect a faster schedule: ASML took many years to jump through 28, 14 and 7nm nodes.

 

[tokenanalyst]

Beijing Guowang Optical Technology 国望光学 is the Optical system supplier for immersion lithography DUVi of SMEE

Yes, they supply the projection lens and the optics
The supplier for immersion hood system is Qier Electromechanical.

 

[tokenanalyst]

Intang Technology acquires MEMS optical switch and OCS manufacturer, using MEMS micromirrors to support the development of Guanglong Technology.​

According to MEMS Consulting, Intang Intelligent Control announced on January 29, 2026, that it plans to acquire 100% equity of Guilin Guanglong Integrated Technology Co., Ltd. (hereinafter referred to as " Guanglong Technology" ) through a combination of share issuance and cash payment, with a transaction price of 700 million yuan. Data shows that Guanglong Technology submitted an IPO application to the Science and Technology Innovation Board in 2021, but voluntarily withdrew it in August 2022.

Guanglong Technology is a supplier of optical chips and optical devices. Its core team comes from the 34th Research Institute of China Electronics Technology Group Corporation, focusing on optical switches and OCS (Optical Path Switching) products. Guanglong Integrated accurately predicted that OCS would become a core trend in all-optical interconnection, and proactively developed and mass-produced optical MEMS devices, aligning with the development needs of supernode plans in computing centers and high-density artificial intelligence (AI) clusters in data centers. Intang Technology previously acquired Pioneer Microtechnology (now known as Intang Microelectronics , possessing nearly 20 years of experience in MEMS micromirror R&D and a 6-inch MEMS wafer manufacturing line. Following this acquisition of Guanglong Technology , Intang Technology's Japanese MEMS wafer manufacturing line can provide production capacity for MEMS micromirror arrays, a core component of its OCS products, resolving Guanglong Technology's previous reliance on external purchases or contract manufacturing, and creating a supply chain advantage for MEMS.
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Currently, Intang Microelectronics' MEMS micromirror diameters cover 4mm, 1mm, 1.6mm, and 8mm, primarily targeting LiDAR and projection display applications. In the future, it will develop MEMS micromirror arrays for OCS (Optical Characteristic Screen) based on the needs of Guanglong Technology. Intang Intelligent Control previously stated in its financial report that its 4mm MEMS micromirror products have secured bulk orders from industrial customers, and it is actively maintaining close contact with customers in robotics, drones, medical devices, and intelligent transportation. The development of other MEMS micromirror product sizes is also progressing steadily according to plan. Intang Microelectronics has built an automated assembly line for its MEMS micromirror project to meet the needs of mass production. The main equipment has been installed and debugged in the factory, and mass production has begun.


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[tokenanalyst]

 

[tokenanalyst]

 

[tokenanalyst]

Shanghai Chuanxin Semiconductor has applied for a patent for EUV photomask and its manufacturing method, which can effectively guarantee the product performance of EUV photomasks.​

According to information from the State Intellectual Property Office, Shanghai Chuanxin Semiconductor Co., Ltd. has applied for a patent entitled "EUV Mask and Manufacturing Method Thereof", with publication number CN121843498A and application date of December 2025.

The patent abstract reveals an EUV mask and its manufacturing method. The method includes the following steps: providing a transparent substrate; depositing alternating molybdenum and silicon layers on one side of the transparent substrate to form a reflective film; depositing a protective layer on the reflective film, the protective layer being formed of ruthenium; performing patterned molybdenum/silicon focused ion beam scanning on the protective layer and the reflective film, causing ruthenium atoms in the protective layer, molybdenum atoms in a portion of the molybdenum layer in the reflective film, and molybdenum ions or silicon ions from the focused ion beam to move to the corresponding silicon layer in the scanned area, forming a patterned absorption layer, the patterned absorption layer being formed of molybdenum silicide containing ruthenium; and depositing a back conductive layer on the other side of the transparent substrate to form an EUV mask. This invention can effectively improve the production efficiency of EUV masks, save on manufacturing costs, and effectively guarantee the product performance of EUV masks. Accordingly, this invention also provides an EUV mask.

According to Tianyancha, Shanghai Chuanxin Semiconductor Co., Ltd., established in 2020 and located in Shanghai, is a company primarily engaged in the manufacturing of computers, communications, and other electronic equipment. The company's registered capital is 93,766,144 RMB. Tianyancha's big data analysis shows that Shanghai Chuanxin Semiconductor Co., Ltd. has invested in two companies, participated in five bidding projects, and has 14 trademark and 129 patent records. In addition, the company holds 17 administrative licenses.

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