Chinese semiconductor thread II
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Oriental Crystal Technology Co., Ltd. has secured a major order from a leading domestic memory wafer foundry, ushering in a new era of computational lithography and AI etching.
Recently, Orient Crystal Technology Co., Ltd., leveraging its core technological barriers and continuous innovation breakthroughs in the field of computational lithography, has reached a deep strategic cooperation with a leading domestic memory manufacturer and officially signed a long-term strategic commercial contract worth nearly 200 million yuan. In this cooperation, Orient Crystal Technology will utilize its independently developed PanGen® computational lithography platform and the world's first AI etching model, PanGen vPWQ (Virtual Process Window Qualification), to help the customer accelerate the development and iteration of advanced memory process nodes, jointly injecting strong momentum into the independent innovation and high-quality development of my country's semiconductor industry.
This strategic cooperation not only represents a high recognition of Orient Crystal's technological strength but also demonstrates the company's firm commitment to collaborative innovation and building an industrial ecosystem with its industry chain partners. In the future, both parties will continue to deepen their technological cooperation, focusing on the core needs of advanced memory processes, and jointly overcome key bottlenecks in advanced process development. Orient Crystal will leverage its PanGen® computational lithography platform and PanGen vPWQ as the core to build a more comprehensive process optimization solution system, helping customers seize technological high ground and solidify their core competitiveness in the fierce global competition.
Onkun Semiconductor Major breakthrough in new product! AP8 achieves 10.5nm patternless wafer particle detection capability.
Following the launch and mass production of the AP7XP (12.5nm particle inspection capability) by Onkun Semiconductor in October 2025, Onkun Semiconductor's AP8 wafer particle defect inspection equipment, a core new product at this exhibition, achieves 10.5nm particle inspection capability, fully adapting to the needs of advanced processes. The equipment features a self-developed optical system and AI intelligent classification algorithm, with all core components domestically produced, breaking the foreign technology monopoly and providing domestic customers with an independent, controllable, and highly stable mass production solution. Several customers at the exhibition have already expressed their intention to produce demo samples, helping domestically produced high-end inspection equipment enter the production line verification stage.
Core products upgraded again! Three major series of equipment demonstrate the company's strong technical capabilities across all scenarios.
At this exhibition, Onkun Semiconductor also showcased three core product series: integrated circuit metrology, compound semiconductor metrology, and in-situ monitoring and infrared thermometry, presenting a complete semiconductor metrology solution.
Integrated Circuit Measurement Series
Focusing on the full-scenario inspection needs of 12-inch wafers, we offer a complete solution covering geometry and particle defects. Geometry measurement achieves sub-nanometer high-precision inspection, adapting to special scenarios such as large warpage wafers and bonded wafers, and supports collaborative use with bonding equipment. Particle defect detection covers multiple sensitivity levels, balancing advanced processes and mature technologies, forming a complete product line.
Compound semiconductor and LED lighting measurement series
In the field of wide bandgap semiconductors, Onkun's Eagle series equipment has a wide range of market applications, has achieved full-process testing coverage, and has gained high recognition from the upstream and downstream of the industry chain. It has broken the long-term dominance of foreign equipment in this field and provided support for the independent control of China's compound semiconductor industry.
In-situ monitoring and infrared thermometry series
This product series represents the pinnacle of domestic technology in this field, overcoming technical challenges in high-end models and achieving mass production. Leveraging its advantages in precise measurement, strong anti-interference capabilities, and equipment integration, the products hold a leading market share in China, addressing the reliance on imported temperature measurement modules for high-end epitaxial equipment. They also play a leading role in defining domestic high-end process monitoring standards, providing core support for the independent development of the semiconductor industry chain.
Core products upgraded again! Three major series of equipment demonstrate the company's strong technical capabilities across all scenarios.
At this exhibition, Onkun Semiconductor also showcased three core product series: integrated circuit metrology, compound semiconductor metrology, and in-situ monitoring and infrared thermometry, presenting a complete semiconductor metrology solution.
Integrated Circuit Measurement Series
Focusing on the full-scenario inspection needs of 12-inch wafers, we offer a complete solution covering geometry and particle defects. Geometry measurement achieves sub-nanometer high-precision inspection, adapting to special scenarios such as large warpage wafers and bonded wafers, and supports collaborative use with bonding equipment. Particle defect detection covers multiple sensitivity levels, balancing advanced processes and mature technologies, forming a complete product line.
Compound semiconductor and LED lighting measurement series
In the field of wide bandgap semiconductors, Onkun's Eagle series equipment has a wide range of market applications, has achieved full-process testing coverage, and has gained high recognition from the upstream and downstream of the industry chain. It has broken the long-term dominance of foreign equipment in this field and provided support for the independent control of China's compound semiconductor industry.
In-situ monitoring and infrared thermometry series
This product series represents the pinnacle of domestic technology in this field, overcoming technical challenges in high-end models and achieving mass production. Leveraging its advantages in precise measurement, strong anti-interference capabilities, and equipment integration, the products hold a leading market share in China, addressing the reliance on imported temperature measurement modules for high-end epitaxial equipment. They also play a leading role in defining domestic high-end process monitoring standards, providing core support for the independent development of the semiconductor industry chain.
SMIC establishes a new semiconductor company with a registered capital of nearly 3 billion yuan.
According to business registration information, Shanghai Xinsanwei Semiconductor Co., Ltd.'s business scope covers integrated circuit manufacturing and sales, integrated circuit chip and product manufacturing and sales, as well as import and export of goods and technology, and related technical services and promotion.
The establishment of this new company may be one of the core moves by SMIC to continuously increase its investment in the field of advanced manufacturing and packaging of integrated circuits.
At the end of December 2025, SMIC acquired a 49% stake in SMIC North for RMB 40.6 billion, achieving 100% control of this 12-inch wafer manufacturing base. On the same day, it was disclosed that SMIC South received a capital injection of US$7.778 billion from institutions such as the third phase of the National Integrated Circuit Industry Investment Fund, focusing on the research and development of advanced processes of 14 nanometers and below, further strengthening the company's core manufacturing capabilities and advanced process layout.
On January 29th of this year, SMIC unveiled its Advanced Packaging Research Institute, with Chairman Liu Xunfeng personally in attendance. In his speech, Liu Xunfeng stated that the institute will focus on cutting-edge advanced packaging technologies and common industry challenges, building an integrated "government-industry-academia-research-application" innovation platform to address the core shortcomings of my country's advanced packaging industry.
Based on this, and considering the name and business scope of the newly established company "Xin3D" and its previous strategic layout, this new company may become the core carrier for SMIC to implement advanced packaging and 3D integration technologies, thereby strengthening the company's core competitiveness in the global integrated circuit manufacturing field.
The establishment of this new company may be one of the core moves by SMIC to continuously increase its investment in the field of advanced manufacturing and packaging of integrated circuits.
At the end of December 2025, SMIC acquired a 49% stake in SMIC North for RMB 40.6 billion, achieving 100% control of this 12-inch wafer manufacturing base. On the same day, it was disclosed that SMIC South received a capital injection of US$7.778 billion from institutions such as the third phase of the National Integrated Circuit Industry Investment Fund, focusing on the research and development of advanced processes of 14 nanometers and below, further strengthening the company's core manufacturing capabilities and advanced process layout.
On January 29th of this year, SMIC unveiled its Advanced Packaging Research Institute, with Chairman Liu Xunfeng personally in attendance. In his speech, Liu Xunfeng stated that the institute will focus on cutting-edge advanced packaging technologies and common industry challenges, building an integrated "government-industry-academia-research-application" innovation platform to address the core shortcomings of my country's advanced packaging industry.
Based on this, and considering the name and business scope of the newly established company "Xin3D" and its previous strategic layout, this new company may become the core carrier for SMIC to implement advanced packaging and 3D integration technologies, thereby strengthening the company's core competitiveness in the global integrated circuit manufacturing field.
With a total investment of 1.7 billion yuan, a diamond semiconductor project has been launched in Alashan.
Recently, the diamond fourth-generation semiconductor material project of Zhongzhou (Alashan) Semiconductor Technology Co., Ltd. commenced construction.
It is reported that the Zhongzhou (Alashan) Semiconductor Diamond Fourth Generation Semiconductor Material Project has a planned total investment of 1.7 billion yuan and will be constructed in two phases. It is a "core cornerstone" supporting high-end chips, new energy, and aerospace. After the project is put into operation, it will lay a solid foundation for Alashan to build an important semiconductor new material industry highland in the autonomous region.
According to the person in charge, the project focuses on the research and mass production of large-size single-crystal substrates and high-performance devices, breaking through industrialization bottlenecks and filling the gap in domestic high-end diamond semiconductor supply. Leveraging Inner Mongolia's abundant green electricity and low-cost energy advantages, the project's establishment in Alashan will address the shortcomings in the local advanced materials industry, drive industrial chain agglomeration, facilitate the intelligent manufacturing upgrade of high-end materials, and inject strong "core" momentum into the region's high-quality development.
It is reported that the Zhongzhou (Alashan) Semiconductor Diamond Fourth Generation Semiconductor Material Project has a planned total investment of 1.7 billion yuan and will be constructed in two phases. It is a "core cornerstone" supporting high-end chips, new energy, and aerospace. After the project is put into operation, it will lay a solid foundation for Alashan to build an important semiconductor new material industry highland in the autonomous region.
According to the person in charge, the project focuses on the research and mass production of large-size single-crystal substrates and high-performance devices, breaking through industrialization bottlenecks and filling the gap in domestic high-end diamond semiconductor supply. Leveraging Inner Mongolia's abundant green electricity and low-cost energy advantages, the project's establishment in Alashan will address the shortcomings in the local advanced materials industry, drive industrial chain agglomeration, facilitate the intelligent manufacturing upgrade of high-end materials, and inject strong "core" momentum into the region's high-quality development.
I’m actually surprised Nvidia still holds such a large market share. Thought that they will barely have any market share left in China after US government banned their advanced chips from being sold to China . Guess it’s more of lower value far less advanced chips that are still allowed, so might explain why .
It’s ironic to see that today China is more capitalistic, pro free markets than the US, and China is today actually the major country speaking for free trade and multilateral organizations . lol
Tables have turned. Lol