Chinese semiconductor thread II

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tokenanalyst

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Ami Precision Controls completes Series A financing to accelerate its industrialization layout!​


Recently, Ami Precision Control Technology (Shandong) Co., Ltd. (hereinafter referred to as "Ami Precision Control") completed its Series A financing . This round of financing was jointly participated in by Shenzhen Semiconductor and Integrated Circuit Industry Fund (hereinafter referred to as " Semi Fund "), Matrix Partners China, and Shenzhen Heavy Investment Group, with existing shareholders Shenzhen Capital Group and Yichen Capital continuing their support. This round of financing will help the company accelerate the improvement of its R&D and delivery system, enhance its ability to deliver products on a large scale and improve customer service efficiency, laying a solid foundation for the company's large-scale high-quality development.

Founded by a team of nationally renowned high-level talents, AMI Precision Control possesses a fully independent intellectual property rights system for nanometer-level measurement and motion control technology . It provides ultra-precision measurement and motion servo products and complete solutions for integrated circuit equipment, expanding into optoelectronics and semiconductors, aerospace, and other fields . In the four years since its establishment, the company has developed rapidly, successfully obtaining supplier certifications from major leading integrated circuit equipment manufacturers in China, and is gradually becoming an important supplier of core semiconductor components for advanced processes.

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The company possesses outstanding technical strength in the fields of micro-nano measurement and ultra-precision opto-electro-mechanical systems. Representative products include high-precision nanoscale displacement sensors, a series of nanoscale motion stages, direct-drive high-speed precision workpiece stages/wafer stages, ultra-precision deflection stages, high-performance beam pointing mirrors/fast-reflecting mirrors, high-dynamic optical/laser scanners, and spatial motion adjustment stages such as Hexapods.

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tokenanalyst said:

Ami Precision Controls completes Series A financing to accelerate its industrialization layout!​


Recently, Ami Precision Control Technology (Shandong) Co., Ltd. (hereinafter referred to as "Ami Precision Control") completed its Series A financing . This round of financing was jointly participated in by Shenzhen Semiconductor and Integrated Circuit Industry Fund (hereinafter referred to as " Semi Fund "), Matrix Partners China, and Shenzhen Heavy Investment Group, with existing shareholders Shenzhen Capital Group and Yichen Capital continuing their support. This round of financing will help the company accelerate the improvement of its R&D and delivery system, enhance its ability to deliver products on a large scale and improve customer service efficiency, laying a solid foundation for the company's large-scale high-quality development.

Founded by a team of nationally renowned high-level talents, AMI Precision Control possesses a fully independent intellectual property rights system for nanometer-level measurement and motion control technology . It provides ultra-precision measurement and motion servo products and complete solutions for integrated circuit equipment, expanding into optoelectronics and semiconductors, aerospace, and other fields . In the four years since its establishment, the company has developed rapidly, successfully obtaining supplier certifications from major leading integrated circuit equipment manufacturers in China, and is gradually becoming an important supplier of core semiconductor components for advanced processes.

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The company possesses outstanding technical strength in the fields of micro-nano measurement and ultra-precision opto-electro-mechanical systems. Representative products include high-precision nanoscale displacement sensors, a series of nanoscale motion stages, direct-drive high-speed precision workpiece stages/wafer stages, ultra-precision deflection stages, high-performance beam pointing mirrors/fast-reflecting mirrors, high-dynamic optical/laser scanners, and spatial motion adjustment stages such as Hexapods.

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A patent application for Lithography Alignment and Leveling for Chip Manufacturing.

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Runping Electronics Commences Production of Self-Sufficient CMP Core Materials in Shanghai Lingang​


Shanghai Runping Electronic Materials Co., Ltd. officially launched its new production facility in the Lingang New Area, marking a major milestone in its industrial expansion and entry into large-scale manufacturing.

The Lingang factory project involves a total investment of 400 million yuan. It will produce the entire supply chain for Chemical Mechanical Polishing (CMP) core materials, including polishing pads, 12-inch retaining rings, precision adsorption films, and multi-zone polishing heads. This enables complete self-sufficiency from raw materials to finished products.
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The project aims to break through foreign monopolies in semiconductor materials and support the domestic substitution of high-end chip manufacturing components, specifically for memory chips and high-performance logic processors. Local officials, investors, partners, and customers from groups like Jiangfeng Electronics attended the launch ceremony, emphasizing collaboration to build a trillion-yuan-level integrated circuit industry hub in the region.

Runping is a leading domestic manufacturer specializing in CMP polishing materials for semiconductor manufacturing. Key strengths include: An international team with over 100 patents covering material formulation and process optimization. Fully automated production lines adhering to international standards, certified by major clients. Operating a Shanghai base for mass production while maintaining the Ningbo center for customized R&D development.

This move signifies Runping's shift from a specialized high-tech enterprise to a central player in China's semiconductor material ecosystem.

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Breakthrough in key advanced packaging equipment! Venus 6 officially unveiled.​


CETC Fenghua Co., Ltd., a subsidiary of CETC Equipment, has officially unveiled the Venus 6 series, marking a breakthrough for China's semiconductor packaging industry. This equipment is specifically designed for advanced packaging testing allows multi-channel synchronous quantity testing can be performed on large-size glass substrates (500–900mm) used for Through Glass Vias (TGV) and Redistribution Layers (RDL).
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Solving Critical Industry Challenges Advanced packaging is essential for overcoming the "power, memory, and cost walls" of modern chip design. However, metrology (measurement) equipment has long been a bottleneck. The Venus 6 addresses several specific technical hurdles: Glass substrates are highly transparent, making micro-defects like cracks and bubbles nearly invisible to traditional lenses. The jump from standard wafers to massive panels (up to 900mm) introduces severe warping issues that disrupt focusing and imaging stability. Historically, equipment could only test single structures sequentially, wasting time; the Venus 6 performs integrated metrology on multiple parameters simultaneously within extreme timeframes.

To tackle these issues, the Venus 6 incorporates three core design pillars:

- Unlike older systems that require switching scans to change imaging modes, the Venus 6 integrates four detection modes (reflective/transmittance bright-field, dark-field, and fluorescence) into a single synchronized operation.
- It achieves sub-micron level detection accuracy, capable of identifying subtle structural deviations that previous equipment missed. Its optical system matches international advanced standards for critical dimensional and overlay accuracy.
- The device uses unique vacuum adsorption and an auxiliary edge-pressing structure to actively suppress glass warping during inspection. Combined with real-time autofocus technology and dual-focal-plane synchronous imaging, it drastically reduces processing time per panel.

It breaks decades-long reliance on imported high-end testing equipment, significantly enhancing China's industrial self-reliance and controllability in the semiconductor supply chain. By improving chip yield rates and reducing manufacturing waste, this technology lowers costs for downstream applications. The breakthrough supports the development of AI chips, high-performance computing, 5G/6G communications, new energy vehicles, and autonomous driving systems by ensuring these components utilize reliable, high-performance glass-based substrates.

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GigaDevice, a leading domestic storage manufacturer, reported revenue exceeding 9.2 billion yuan and net profit surging 49.47% year-on-year!​


GigaDevice reported outstanding financial results for 2025, with operating revenue reaching RMB 9.203 billion a 25.12% year-on-year increase while net profit surged by 49.47% to RMB 1.648 billion. This robust performance was driven primarily by the cyclical upswing in the storage industry, which created favorable conditions for both higher product volumes and pricing power. The company's strategic focus on technological iteration allowed it to capitalize on a shifting supply-demand landscape, particularly as major overseas manufacturers exited specific segments, leaving room for domestic players to gain market share through optimized cost structures and rapid innovation.

The revenue growth was distributed across key business verticals with distinct drivers. In memory chips, niche DRAM and SLC NAND Flash benefited significantly from tight global supplies, leading to improved gross margins and volume increases, while NOR Flash saw steady price recoveries. The MCU division achieved a 12.98% revenue increase despite intense competition by expanding its high-quality portfolio in industrial automation, automotive electronics, and humanoid robotics with new high-performance series like the GD32H78D and GDSCN832. Meanwhile, the analog chip sector experienced explosive growth of approximately 460%, fueled by the successful integration of subsidiary Suzhou Saixin, though sensor revenue faced headwinds due to fierce mobile market competition.

Strategically, GigaDevice is accelerating its globalization efforts through the completion of an "A+H" dual listing and the establishment of international headquarters in Singapore alongside a new Tokyo office, marking a pivotal step toward global competitiveness. Looking ahead, the company aims to solidify its diversified product portfolio by seizing opportunities in emerging fields such as artificial intelligence, automotive electronics, and next-generation smart terminals. By leveraging technology innovation and ecosystem collaboration under this expanded global framework, GigaDevice intends to build systematic competitiveness and deliver sustained long-term value to shareholders and customers alike.

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Oriental Crystal Source Showcases Improved Electron Beam Metrology Capabilities​

As chip manufacturing shifts toward three-dimensional architectures (GAA, CFET, 3D NAND/DRAM/HBM), demand for advanced metrology equipment has surged. Orient Crystal showcased breakthroughs across its Electron Beam Metrology and EDA software lines at a recent exhibition.

Orient Crystal demonstrated four major product lines improvements to meet the challenges of high-aspect-ratio structures, thick photoresist, and advanced node requirements:​

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Defect Inspection (EBI SEpA®-i635): Enhanced capacity with improved resolution and detection current. It supports logic chips down to 28nm and key sites in 3D NAND, utilizing ultra-high current pre-charge technology for deep structures.

Critical Dimension Measurement (CD-SEM SEpA®-c505 & c325): The new generation features a self-developed electro-optical system matching international mainstream levels in accuracy and efficiency. It specifically addresses thick photoresist measurement, supporting both 8-inch traditional lines and advanced processes.

Re-inspection (DR-SEM SEpA®-r655): Successfully overcame supply chain restrictions by listing as non-U.S.-Entity-list compatible. Its performance metrics rival industry leaders like POR, moving toward mass production.

High Energy (HV-SEM SEpA®-h755): The first domestic 45kV electron beam system with "see-through" imaging capabilities to penetrate deep into wafers. It offers leading-level support for high-aspect-ratio measurement and overlay inspection.

Recognizing software as the "mother of chips," Orient Crystal's subsidiary PanGen® is leveraging Artificial Intelligence to enhance yield rates across the design-to-manufacturing chain:

PanGen® 6.0 Platform: A complete computational lithography solution for Chinese advanced nodes (14nm+), with capabilities targeting 7nm and 5nm. It launched the world's first commercial Etch model product, integrating AI to solve decade-old accuracy issues in etching simulation.

PanGen Sim® 2.0: A rigorous photolithography simulator that shares infrastructure with its core platform. It boasts a 58% speed increase, 99% reduction in storage usage, and results consistent with global competitors, securing the top spot in China for this category.

Strategic Yield Solutions (DMC, PHD, vPWQ): These AI-integrated tools predict manufacturing risks early to optimize designs. Validated by leading domestic manufacturers, they have proven capable of reducing tape-out iteration cycles from 4–6 down to 2–3, significantly cutting costs and boosting yield.

Orient Crystal is positioning itself as a critical partner in the next generation of semiconductor manufacturing, combining domestically produced high-performance metrology hardware with AI-enhanced EDA software to address the complexities of 3D chip architecture and advanced process nodes.

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Moore Threads signs a massive 660 million yuan deal!​

Recently, Moore Threads, a company listed on the Science and Technology Innovation Board, issued an announcement stating that the company has signed a major sales contract for daily operations with a customer, with a total contract amount of up to 660 million yuan.

According to the announcement, the contract signed this time pertains to the Moore Threads KUAE intelligent computing cluster, one of the company's core products. As a leading full-featured GPU design company in China, Moore Threads focuses on developing high-performance, low-power general-purpose computing chips. The KUAE intelligent computing cluster is a full-stack solution developed by Moore Threads, boasting advantages such as rapid delivery, high performance, and out-of-the-box usability. It can support distributed training of trillion-parameter models, effectively solving the construction and operation management problems of large-scale GPU computing power, and adapting to the high-frequency computing power needs of current fields such as artificial intelligence and cloud computing.

According to publicly available information, the KUAE intelligent computing cluster is a system-level solution that can support clusters of thousands, tens of thousands, or even larger scales. Against the backdrop of continuously growing demand for domestic computing power, the large-scale commercialization of this cluster is expected not only to further solidify Moore's Threads' market position in the field of intelligent computing infrastructure, but also to strengthen its competitive advantage in high-performance training scenarios using domestic GPUs, providing a new practical model for the large-scale deployment of AI computing power in China.​

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