Another article on this. It uses solid state transformers. Very interesting. Fully domestic AIDC supply chain.
Chinese semiconductor thread II
- Thread starter vincent
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Another article on this. It uses solid state transformers. Very interesting. Fully domestic AIDC supply chain.
Heyan Technology leads the semiconductor packaging equipment industry with technological innovation.
Heyan Technology has solidified its position as a leader in the semiconductor packaging equipment industry by strategically launching three groundbreaking new products at SEMICON CHINA 2026. These innovations—the DS9262 fully automatic 12-inch dicing machine, the RMT series wafer casting machine, and the LRC series laser circumferential slicing machine—address critical pain points in high-end manufacturing processes like "dicing" and "peeling." By achieving key performance indicators that reach international advanced levels, these products not only fill domestic technological gaps but also effectively break the long-standing monopoly of foreign manufacturers in specialized fields.
The strategic release of these machines aligns with the industry's shift from 2D to 3D packaging and the explosive growth of AI computing power and HBM storage. According to company leadership, market demands now prioritize extreme precision, cleanliness, and automation over traditional capabilities. The new DS9262 dicing machine exemplifies this by offering a cutting precision improved to one micrometer per step with a cumulative error of only two micrometers, achieved through structural upgrades like single-piece casting and modular software architectures that enhance stability and reduce production downtime.
Beyond the DS9262, the RMT series introduces a world-first single-station double casting technology designed to replace inefficient manual processes in advanced packaging films. This innovation significantly reduces labor risks while improving efficiency for delicate tasks such as HBM and SiC wafer processing through features like vacuum lamination and adaptable positioning modules. Complementing this is the LRC series, which marks China's first mass-produced laser ring cutting equipment; it solves persistent issues of burrs and wire drawing associated with abrasive wheels by using thermal melting methods to handle thick-back gold products without damage or incomplete cuts.
Heyan Technology has leveraged these breakthroughs to execute a comprehensive "cutting-grinding-polishing-peeling" product solution, moving from technology followers to active rule-makers in the market. The company's internal strategy involves optimizing production capacity across its Shenyang and Pinghu factories to ensure timely delivery of high-demand models while pursuing a differentiated global expansion plan targeting Southeast Asia, Japan, Korea, and Europe. This approach supports a vision of establishing overseas service centers to maintain localized support, aiming to significantly increase revenue from international markets within the next three years.
Looking ahead, Heyan Technology aims to become a globally recognized benchmark for semiconductor equipment, playing a pivotal role in the domestic substitution agenda. The new product lineup provides Chinese manufacturers with reliable alternatives that mitigate supply chain risks associated with foreign suppliers while reducing overall production costs. With clear plans for technological iteration and global market penetration, the company is poised to transition from a regional player to a worldwide leader, driving the high-end development of China's semiconductor industry through unwavering innovation and strategic execution.
Leadcore acquires Wufeng Instruments to improve its scientific instrument industry layout.
On March 27, Shanghai Wufeng Scientific Instruments Co., Ltd. officially changed its business registration following an acquisition by LeadCore (600641.SH), a wholly-owned subsidiary known as LeadStar. Through this transaction, LeadStar acquired 100% of the equity in Wufeng, formally establishing its presence in the chromatography-mass spectrometry analysis instrument sector. This strategic move is designed to deepen the company's platform-based development layout and accelerate its pursuit of independent control over high-end scientific instruments, which are critical for modern technological innovation and manufacturing advancements.
The acquisition addresses a significant structural gap in the domestic market where key life science and precision measurement tools currently rely heavily on imports. With domestic penetration rates remaining low despite a massive market potential exceeding 50 billion yuan, there is an urgent need to substitute foreign products with locally developed technologies. The rising demand for high-end instruments in industries such as semiconductor manufacturing presents a strategic "golden window" for these efforts. By integrating Wufeng's expertise into its portfolio, LeadStar aims to leverage dual opportunities of industrial upgrading and domestic substitution to build a robust ecosystem of core components, proprietary algorithms, and system integration capabilities across four major sectors: surface 3D measurement, chromatography, spectroscopy, and mass spectrometry.
Wufeng Instruments brings substantial technical strength, product advantages, and market barriers specifically within the liquid chromatography field, allowing for deep synergy with LeadStar's existing business units. The combined entity is committed to breaking through key technologies ranging from optics and particle beam control to computational data analysis. This consolidation injects strong momentum into LeadStar's platform-oriented strategy, enhancing its R&D capabilities and providing comprehensive support for the large-scale application of domestically produced high-end instruments. Ultimately, this step strengthens China's capacity for independent innovation in critical scientific equipment while capitalizing on the growing industrial needs in advanced manufacturing sectors.
Qinghe Epistar Semiconductor Technology showcases its bonding technology at SEMICON China 2026
Qinghe Epistar Semiconductor Technology (Group) Co., Ltd. is a high-tech Chinese enterprise specializing exclusively in semiconductor bonding and integration. Driven by its unique dual-engine model, it has built a comprehensive industry chain solution that supplies global partners with high-precision, stable, and cost-effective solutions for advanced packaging, MEMS sensors, and wafer-level heterogeneous material integration.
From March 25 to 27, SEMICON China 2026—the world's leading annual event for the semiconductor industry unveiled itself in Shanghai with over 1,500 global exhibitors and nearly 180,000 professional visitors. Amidst this crowded landscape, Qinghe Epistar established a commanding presence in Hall N2. The company's booth rapidly became one of the most anticipated highlights of the fair, drawing a relentless stream of industry professionals. These attendees were not merely observers; they included clients specifically seeking strategic partnerships and technical experts eager to explore cutting-edge bonding applications in advanced packaging, power devices, and heterogeneous integration.
Qinghe Epistar leveraged its position as a pioneer in the bonding field to demonstrate a complete industrial chain solution across three major segments:
Core Bonding Equipment: The company unveiled a robust portfolio of proprietary machinery, including ultra-high vacuum room temperature bonding systems, hybrid bonding equipment, hot-pressing bonders, temporary bonders, and surface treatment units. These tools represent the hardware foundation necessary for complex semiconductor assembly.
Wafer-Level Process Foundry Services: Moving beyond just selling machines, Qinghe Crystal highlighted its unique capability to offer full-cycle foundry services. They possess manufacturing expertise for large-format (4/6/8/12-inch) bonding substrates across diverse material systems, including SiC-SiC, LTOI (Low-Temperature Oxide Insulator), LNOI, SiCOI, SOI, and Si-SiC. This allows customers to outsource critical process steps with high precision.
Turnkey Production Line Solutions: Perhaps the most significant offering was the integration of their own equipment manufacturing experience with mass production contract capabilities. Qinghe Crystal provides a "turnkey" service that guides clients from initial verification through to full-scale mass production. This end-to-end approach has already secured deep cooperation agreements with leading industry players, enabling breakthrough implementations in major projects.
The company is committed into accelerating Localization Post-Moore's Law The exhibition served as a powerful statement on Qinghe Crystal's commitment to the future of the Chinese semiconductor industry. By successfully deploying a complete "equipment + process + composite substrate line" layout, the company is addressing the critical need for domestic localization in high-end bonding technologies, which were historically reliant on imports.
From March 25 to 27, SEMICON China 2026—the world's leading annual event for the semiconductor industry unveiled itself in Shanghai with over 1,500 global exhibitors and nearly 180,000 professional visitors. Amidst this crowded landscape, Qinghe Epistar established a commanding presence in Hall N2. The company's booth rapidly became one of the most anticipated highlights of the fair, drawing a relentless stream of industry professionals. These attendees were not merely observers; they included clients specifically seeking strategic partnerships and technical experts eager to explore cutting-edge bonding applications in advanced packaging, power devices, and heterogeneous integration.
Qinghe Epistar leveraged its position as a pioneer in the bonding field to demonstrate a complete industrial chain solution across three major segments:
Core Bonding Equipment: The company unveiled a robust portfolio of proprietary machinery, including ultra-high vacuum room temperature bonding systems, hybrid bonding equipment, hot-pressing bonders, temporary bonders, and surface treatment units. These tools represent the hardware foundation necessary for complex semiconductor assembly.
Wafer-Level Process Foundry Services: Moving beyond just selling machines, Qinghe Crystal highlighted its unique capability to offer full-cycle foundry services. They possess manufacturing expertise for large-format (4/6/8/12-inch) bonding substrates across diverse material systems, including SiC-SiC, LTOI (Low-Temperature Oxide Insulator), LNOI, SiCOI, SOI, and Si-SiC. This allows customers to outsource critical process steps with high precision.
Turnkey Production Line Solutions: Perhaps the most significant offering was the integration of their own equipment manufacturing experience with mass production contract capabilities. Qinghe Crystal provides a "turnkey" service that guides clients from initial verification through to full-scale mass production. This end-to-end approach has already secured deep cooperation agreements with leading industry players, enabling breakthrough implementations in major projects.
The company is committed into accelerating Localization Post-Moore's Law The exhibition served as a powerful statement on Qinghe Crystal's commitment to the future of the Chinese semiconductor industry. By successfully deploying a complete "equipment + process + composite substrate line" layout, the company is addressing the critical need for domestic localization in high-end bonding technologies, which were historically reliant on imports.
Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences makes its debut at SEMICON China 2026.
SEMICON China 2026 (Shanghai International Semiconductor Exhibition) was held at the Shanghai New International Expo Centre on March 25, 2026, lasting for three days. The Changchun Institute of Optics, Fine Mechanics and Physics (CIOMP) of the Chinese Academy of Sciences (CAS) made its debut at the exhibition, while two other companies from Changchun Optoelectronics Technology Co., Ltd. (CIOMP) participated independently. Li Yaobin, Deputy Director of CIOMP, Sun Shouhong, Deputy Director and Deputy Secretary of the Party Committee, and leaders from the research, management, and support departments of CIOMP attended the exhibition.
At booth 1427 in Hall N1, the Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, focused on the core equipment field of semiconductors. Around the semiconductor materials, processing, coating, and measurement processes, they showcased a number of cutting-edge technological achievements, including high-precision long-range silicon carbide air-floating guides, high-cleanliness and high-stability ion sources, ultra-small magnetorheological polishing wheels, ultra-precision magnetorheological polishing equipment, ultraviolet coating products, wafer/probe cameras, high-precision deep ultraviolet dark-field detection objectives, and the GODAS general-purpose optical design and analysis software. These achievements garnered widespread attention within the industry and became a focal point for professional visitors in specific semiconductor sub-sectors. Numerous experts, scholars, and entrepreneurs from home and abroad came to exchange ideas and discuss their findings, effectively enhancing the institute's industry influence in the semiconductor field. (Everything for Lithography and semiconductor Metrology)
At this exhibition, our institute established communication channels with over a hundred semiconductor equipment manufacturers, wafer foundries, and investment institutions both domestically and internationally, with intended contract amounts exceeding ten million yuan. While rapidly expanding the Changguang brand image, we also precisely targeted key aspects of the domestic substitution of core semiconductor equipment, promoting widespread integration of core technologies and products. This lays a solid foundation for further penetration into the semiconductor industry supply chain and accelerating the self-sufficiency of domestic semiconductor equipment.
SVG OptoElectronics launched the FlexAligner-P500 Nanoimpring lithography
Suzhou Vigor has recently achieved another breakthrough in the commercialization of nanoimprint lithography equipment. Its independently developed roll-to-roll quasi-nanoimprint lithography system, FlexAligner-P500, has completed commercial acceptance and has been successfully delivered to leading companies in the consumer electronics and semiconductor sectors. This equipment specializes in the manufacturing of diffractive waveguides and DOE diffraction gratings. With its robust parameters, including imprint uniformity within ±5% over a 500mm range and residual layer control to 20nm , it achieves large-area, high-fidelity, and high-efficiency production. It can meet the needs of fields such as new displays, bio-detection , and precision semiconductor manufacturing , injecting strong momentum into the substitution of domestically produced high-end equipment.
