AMEC launched four new products simultaneously to accelerate platform development through deep innovation.
On March 25, 2026,
AMEC (Advanced Micro-Fabrication Equipment Inc.) announced the simultaneous launch of four major new products designed to accelerate platform development and advance deep innovation in semiconductor manufacturing. The releases covered critical processes for both silicon-based and compound semiconductors, strengthening AMEC's capabilities in etching equipment, thin-film deposition (MOCVD), and core intelligent components.
The lineup includes:
- Primo Angnova™: Next-generation ICP plasma etcher for advanced logic/memory nodes.
- Primo Domingo™: High-selectivity etcher for 3D architectures like GAA and DRAM.
- Smart RF Match: An intelligent radio frequency matching device featuring proactive prediction capabilities.
- Preciomo Udx® MOCVD: Specialized equipment for mass-producing blue-green Micro LEDs.
These launches aim to support large-scale expansion, reduce production costs, and enhance market competitiveness by addressing challenges in high-aspect-ratio etching, 3D device scaling, RF stability, and optical semiconductor manufacturing.
Primo Angnova™ (Next-Generation ICP Plasma Etcher)
For Advanced logic chips (5nm and below) and advanced memory chips with high aspect ratio requirements.
- Center-Extraction Design Equipped with an industry-leading symmetrical airflow control valve to expand pressure control ranges.
- Advanced Plasma Source Integrates a second-generation LCC RF coil and a DC magnetic field auxiliary coil (MFTR) technology featuring four-segment pulse control for precise ion concentration and energy management. Notably uses ultra-low frequency RF plasma for high ion energy.
- Precision Temperature Control Utilizes the Durga III ESC electrostatic chuck with over 200 independently temperature-controlled zones, combined with a continuous Active Edge Impedance Adjustment (AEIT) design at the wafer edge for excellent on-chip uniformity.
- High Efficiency Configurable Primo C6V3 transfer platform supporting up to 6 main etching chambers and 2 LL Strip removal chambers.
- Solves challenges in accuracy, uniformity, and aspect ratio, enabling customers to increase capacity for sub-5nm nodes while reducing costs.
View attachment 172308
Primo Domingo™ (High-Selectivity Etcher)
Next-generation 3D semiconductor devices, including GAA (Gate-All-Around), 3D NAND, and 3D DRAM.
- Optimized Structure fully symmetrical cavity design with an optimized flow field to ensure high uniformity and repeatability in wafer surface etching.
- Advanced Gas Management unique integrated gas holder design shortens injection distance for faster, precise pulse gas control; uses corrosion-resistant materials for handling reactive gases.
- The Dual-Stage Thermal Control features a dual-cooling/dual-heating wafer pedestal for wide-range precise temperature stability.
- With Flexible Integration Compatible with the mass-produced Primo C6V3 transfer system, allowing flexible combination of main and auxiliary annealing chambers.
- Fills domestic gaps in highly selective etching equipment, providing crucial assurance for manufacturing higher-performance, smaller-sized 3D devices.
View attachment 172309
3. Smart RF Match (Intelligent Radio Frequency Matching Device)
Semiconductor front-end processes (dielectric/Si/Metal etching), advanced packaging, MEMS, and compound semiconductors.
- "Proactive Prediction" Logic that Moves beyond traditional "reactive response" by using EtherCAT networks for real-time RF status transmission between the power supply and matcher. The matcher acts as an active device issuing control commands simultaneously with adjustments.
- The Proprietary Algorithm utilizes independent IP-based intelligent control algorithms that automatically select frequency ranges and matching modes based on plasma conditions.
- Speed & Efficiency That achieves microsecond-level response; switching speeds are over 100 times faster than traditional matchers.
- In high-end logic testing, improved RF signal matching speed by 225% and overall etching efficiency by 15%, leading to higher throughput and more stable process consistency.
View attachment 172310
4. Preciomo Udx® MOCVD (Mass Production Equipment)
Mass production of blue-green Micro LEDs using high-performance gallium nitride wafers.
- Horizontal Dual-Rotation Structure that breaks away from traditional vertical airflow designs; features a novel horizontal dual-rotation reaction chamber with simulated temperature/flow fields for superior uniformity.
- High Throughput, can process up to two chambers simultaneously, handling 18 × 6-inch or 12 × 8-inch wafers per run. Each chamber is independently controllable.
- To Meet Industry Standards Compliance is equipped with EFEM and SMIF systems for fully automated wafer-to-wafer transfer, reducing the number of required epitaxial layers.
- Boasts excellent wavelength uniformity, low defect density, and high output stability, meeting stringent requirements for Micro LED commercialization.
View attachment 172311
