Chinese semiconductor thread II

H

huemens

Junior Member
Registered Member

Huawei confirms Ascend 950DT AI chip to debut in August​

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During the Huawei Cloud 2026 INSPIRE Creators Event, the Vice President of the company – Chen Lin, revealed that the Ascend 950DT AI chip will launch on its Cloud ecosystem in August.
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“The new generation of Ascend chips – Ascend 950DT will be officially launched on Huawei Cloud in August. Compared with the previous generation chip, the 950DT will greatly improve vector computing power, video memory bandwidth, and natively support low-precision formats like FP8.”
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T

tokenanalyst

Lieutenant General
Registered Member

ChipVision releases the world's smallest 0.13-inch LCoS chip​


On June 4th, Nanjing Chipvision announced the Tianmu 80, the industry's smallest LCoS silicon-based microdisplay chip. With a display size of only 0.13 inches (about the size of a grain of rice), this chip has broken the global record for the smallest microdisplay hardware.
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The chip has a resolution of 640×480 and a pixel size of only 4.0×4.0μm. It adopts reflective LCoS single-chip full-color display technology and supports high-speed serial interfaces such as MIPI and LVDS.
Leveraging the ultra-high pixel density brought by the 4.0μm pixel specification, this chip can eliminate the screen-door effect in displays, providing key technical support for lightweight consumer display terminals.
Meanwhile, this chip achieves a high aperture ratio within a single pixel of 4μm, overcoming the core challenges of light efficiency, brightness, and contrast.​


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