Chinese semiconductor thread II

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Ruichengxinwei launches MIPI A-PHY IP: building an efficient data transmission network for automotive electronics​


With the rapid advancement of automotive electronics technology, the demand for high-performance, highly reliable data transmission is increasing. From in-vehicle infotainment systems to the coordinated operation of various sensors and advanced driver assistance systems, efficient data connectivity is the key to enabling these complex functions. Ruichengxinwei is committed to providing cutting-edge solutions to the industry. Its recently launched MIPI A-PHY IP will support more diverse and agile "neural networks" for smart car applications.

In today's advanced driver assistance systems, numerous sensors, such as cameras, radars, and lidars, need to quickly and accurately transmit massive amounts of data collected to the intelligent driving computing unit for processing. MIPI A-PHY, with its high bandwidth and low latency, ensures real-time transmission of sensor data, providing a solid foundation for safe driving. For example, in intelligent driving scenarios, image data captured by high-definition cameras can be transmitted at high speed via A-PHY to the onboard computing platform, enabling precise perception and decision-making of the road environment.

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As consumers' demands for in-car entertainment continue to rise, IVI systems must support higher-resolution displays and richer multimedia content. MIPI A-PHY can provide stable, high-speed connectivity for high-resolution infotainment displays, enabling smooth video playback and interactive experiences, enhancing the entertainment experience for drivers and passengers.

Ruichengxinwei has successfully developed MIPI A-PHY IP and, combined with its partners' PCS layer and controller IP, has helped several customers' chip products enter the tape-out verification stage. Through close collaboration with partners and customers, Ruichengxinwei will continue to optimize and improve the layout of MIPI A-PHY IP to better meet the growing needs of the automotive electronics market.

High bandwidth and low latency: Ruichengxinwei's MIPI A-PHY IP meets the A-PHY V1.1 standard and can support downlink data rates of up to 5Gbps (4Gbps for Downlink Gear G2) and uplink data rates of 50M, ensuring the rapid transmission of large amounts of data. At the same time, its extremely low latency characteristics can meet the extremely real-time requirements of application scenarios such as ADAS and autonomous driving, enabling vehicles to respond quickly to various road conditions and driving situations.

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Long-distance transmission capability: The A-PHY standard supports transmission distances up to 15 meters, a feature particularly important in complex automotive wiring environments. Whether the sensor or surround-view camera is mounted on the front, rear, or side of the vehicle, A-PHY ensures a stable data connection without concerns about signal attenuation or transmission stability.
Excellent reliability and anti-interference capabilities: Cars are exposed to a variety of complex electromagnetic environments during operation. Ruichengxinwei's MIPI A-PHY IP has extremely high anti-interference capabilities, maintaining accurate and stable data transmission under strong electromagnetic interference. Its extremely low packet error rate provides reliable communication for safe vehicle operation. The IP also has high ESD resistance, passing the 8kV HBM test.

Support for Multiple Cable Types: Ruichengxinwei's MIPI A-PHY IP is compatible with a variety of cable types, such as shielded twisted pair (STP) and coaxial cable. This feature allows system designers to flexibly select the appropriate cable solution based on different application scenarios and cost budgets, effectively optimizing system costs while ensuring signal performance.

Based on a rich and powerful IP library, Ruichengxinwei has built a complete IP platform to provide partners with complete automotive IP platform solutions for different applications.

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A new choice for astronomical observation: Gpixel GSENSE1517BSI – High sensitivity, native 16-bit output, and three-sided splicing​


GPixel officially launched its new product, the GSENSE1517BSI. This product features a large-pixel design with higher sensitivity, covering soft X-rays, ultraviolet, visible light, and near-infrared. With its native 16-bit output and three-sided splicing structure, it is ideal for astronomical observation.
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Large pixels + high sensitivity, detecting extremely weak signals

The GSENSE1517BSI features a 15 μm x 15 μm pixel size and a resolution of 4116 x 4100 pixels, with a photosensitive area of 61.74 mm x 61.50 mm. The chip utilizes a large 15 μm pixel design and back-illuminated process, significantly improving photon collection capabilities. Its peak quantum efficiency reaches 92% at a wavelength of 450 nm, making it ideal for space situational awareness and weak signal detection of deep-sky objects.

On-chip native 16-bit ADC for higher dynamic range

The GSENSE1517BSI integrates a native 16-bit ADC on-chip, achieving a single-frame dynamic range of 81.5 dB, significantly improving astronomical photometry accuracy. Even when bright objects and faint nebulae coexist in the same field of view, details of both can be clearly preserved. It also supports a 12-bit dual-gain mode, achieving a combined dynamic range of 95.3 dB for the dual-gain image.

Advanced technology + optimized circuit : lower dark current and lowest read noise in its class

Leveraging a more advanced wafer manufacturing process node, the chip significantly reduces circuit and surface defects. When deep-cooled to -70°C, the GSENSE1517BSI achieves a dark current of less than 0.008 e¯/p/s, while also improving yield and significantly enhancing image quality. Combined with a deeply optimized circuit design, the chip achieves a readout noise of just 1.2 e¯ , the lowest among similar products .

Three-sided splicing + anti-glow design, suitable for large field of view astronomical applications

The GSENSE1517BSI utilizes a package combining silicon carbide and alumina ceramics, enabling a three-sided, tileable design. The thermal expansion coefficients of the silicon carbide substrate and the silicon photosensitive surface are highly matched, ensuring the chip's surface remains perfectly flat even when deep-chilled to -70°C. The chip incorporates anti-glowing technology, effectively eliminating image contamination caused by glow at extremely long exposure times. This ensures pristine image quality for deep-sky long-exposure observations, such as galaxy redshift studies and supernova remnant detection.

High-speed readout, balancing detection accuracy and efficiency

The GSENSE1517BSI uses LVDS high-speed readout with a maximum frame rate of 4 fps. While ensuring high resolution and high sensitivity, it meets the dynamic tracking requirements of fast-moving targets and balances observation efficiency and data quality.

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Nanjing University of Science and Technology Optoelectronics' annual production of 400 tons of electronic special gases project announced!​


Nanjing University of Science and Technology Optoelectronics (Nanda Optoelectronics) has officially announced its 400-ton annual production project for high-purity phosphine and 5,000 tons of sodium hypophosphite, marking a major advancement in China’s domestic electronic specialty gases supply chain. Located in Quanjiao County, Anhui Province, the project spans two phases: Phase one constructs Class A and C workshops, storage facilities, utilities, and control systems to produce 200 tons of phosphine and 2,500 tons of sodium hypophosphite annually; Phase two expands capacity using existing infrastructure to reach the full target output. Phosphine—a critical doping and epitaxy gas in semiconductor manufacturing is used for N-type implantation, GaP growth, MOCVD processes, and PSG passivation, with its purity (≥5N) directly influencing chip performance and yield.

As a key player born from China’s "863" Program and "02-Special Project," Nanda Optoelectronics specializes in high-purity electronic materials including precursors, specialty gases, and photoresists. With R&D and production facilities across Suzhou, Ningbo, Quanjiao, Zibo, and Ulanqab—alongside a North American technical arm the company has established an integrated system covering synthesis, purification, analysis, and safe logistics. It holds provincial-level innovation platforms and is recognized as a national "Little Giant" and "Single Champion" enterprise, contributing significantly to China’s goal of achieving self-reliance in semiconductor materials. The project strengthens domestic capabilities in high-end gases, where imports still dominate key areas like photolithography and advanced precursors.

The growth of the Chinese electronic specialty gases market projected at 30 billion yuan by 2025 with a 10% annual CAGR is driven by expanding domestic wafer fabs such as SMIC, Yangtze Memory Technologies, and Huahong. With global demand for advanced memory and logic chips fueling the semiconductor precursor market to $1.7 billion in 2024 and beyond, domestic players like Nanda, Yak Technology, and Zhengfan are gaining traction by offering high-purity, customized solutions. The upcoming AESG2025 Forum in Suzhou will spotlight technological innovation, supply chain security, and industry-university collaboration to accelerate the development of domestically controlled core materials, positioning such projects as pivotal in China’s semiconductor self-reliance journey.

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9月24日,杭州钢铁集团有限公司半山基地管委会发布《混合万卡工程第二批国产千卡智算集群算力设备采购及服务项目》询(比)价采购公告,估算金额17400万元。该项目拟定采购混合万卡工程第二批国产千卡智算集群的128台GPU服务器(含3台热备机)、网络、存储和管理服务器。

This is interesting Hangzhou iron steel group is spending 174m RMB to build mixed 1000 card cluster with 128 GPU servers (8 card per server).

Not idea why iron and steel group needs 1000 GPUs, but they are buying domestic ones at least
 

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This is interesting Hangzhou iron steel group is spending 174m RMB to build mixed 1000 card cluster with 128 GPU servers (8 card per server).

Not idea why iron and steel group needs 1000 GPUs, but they are buying domestic ones at least
Actually a pretty interesting story
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On April 9, State-owned Hangzhou Iron & Steel Group, or Hanggang for short, unveiled Huaguanghong, Zhejiang's first State-owned brand for computing power equipment. The launch marks a key milestone in Hanggang's shift from traditional steelmaking to digital manufacturing.

Since closing its steel operations in 2015 in line with national supply-side reforms, Hanggang has embraced the digital economy. Leveraging its land, infrastructure, and energy resources, it has built a full-stack data ecosystem spanning data centers, management, security, and now, equipment manufacturing.

Huaguanghong's product line includes intelligent computing servers, data switches, and AI model machines, supporting high-performance computing and big data scenarios. With a capacity of 100,000 units per year, the production line adds a crucial hardware link to Hanggang's cloud-based strategy.

This move aligns with China's push for self-reliant tech innovation amid growing global competition. Hanggang's new facility — established with leading industry partners — features top-tier automation and is part of a broader push to become a chain leader in China's emerging Computing Power Valley in Gongshu district
 
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