Chinese semiconductor thread II

[tokenanalyst]

Equipment solutions of Shanxi CETC SiC industry chain​

Horizontal SiC Chemical Vapor Deposition Furnace

MTS is used as the precursor raw material, which is brought into the mixing tank by bubbling or evaporation, and Ar and H2 are used as mixed gases to perform CVD coating on the surface of graphite or SiC substrate. A full set of solutions of equipment + process + service can be provided. The thickness of the coated product reaches 100±10μm; the purity is ≤1ppm; the silicon-carbon ratio is 1:1, and all the indicators of the coating meet the semiconductor requirements.



Vertical SiC Chemical Vapor Deposition Furnace

MTS is used as the precursor raw material, which is brought into the mixing tank by bubbling or evaporation, and Ar and H2 are used as mixed gases to perform CVD coating on the surface of graphite or SiC substrate. A full set of solutions of equipment + process + service can be provided. The thickness of the coated product reaches 100±10μm; the purity is ≤1ppm; the silicon-carbon ratio is 1:1, and all the indicators of the coating meet the semiconductor requirements.


TaC vapor deposition furnace
Using TaCl5 and CH4 mixed gas as precursor raw materials, Ar and H2 as mixed gas, CVD coating is performed on the surface of graphite substrate. A full set of solutions of equipment + process + service can be provided. The thickness of the coated product reaches 40±5μm; purity: ≤5ppm; tantalum-carbon ratio: 1:1, and all coating indicators meet the needs of semiconductor, aerospace thermal protection, medical equipment and other industries.



Pyrolytic graphite vapor deposition furnace

Using CH4 as the precursor raw material, Ar and H2 as the mixed gas, CVD coating is performed on the surface of the graphite substrate. A full set of solutions of equipment + process + service can be provided. The thickness of the coated product reaches 60±5μm; purity: ≤1ppm; thermal conductivity: 376W/m·K (a) 2.0W/m·K (c). All indicators of the coating meet the requirements of semiconductors, rocket throat linings, OLED industry evaporation vessels,

Vertical high temperature purification furnace

It is mainly used for the purification and directional element removal of carbon-based materials such as graphite, insulation felt, and graphite powder. It adopts resistive heating, and achieves 2400-degree high-temperature heating through infrared thermometer and temperature control module. It can achieve high-purity treatment of carbon-based materials with purification process. The equipment has good purification effect, high degree of automation, and reliable and stable performance.

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[tokenanalyst]

Kangxinwei completed the B round of financing of tens of millions of yuan​

Recently, Hefei Kangxinwei completed a B round of financing of tens of millions of yuan, and the investor in this round was Junsheng Investment. Kangxinwei completed the A and A+ rounds of financing in 2022-2023, totaling 322 million yuan, and introduced strategic investors such as CITIC New Future, Xicheng Zhiyuan, Science City Venture Capital, Guoyuan, CITIC Construction Investment, Zhuoyuan Asia, and Huaan Jiaye.

According to information, Kangxinwei was established in 2018 and is headquartered in the Economic and Technological Development Zone of Hefei City, Anhui Province. It is a domestic manufacturer of embedded storage master chips and storage modules.
Kangxinwei's business scope covers the research and development, production and sales of storage master control chips and storage modules. Its current main products are eMMC embedded storage master control chips and modules.

Kangxinwei takes storage master control technology as its core and provides one-stop solutions and OEM/ODM solutions. In addition to consumer-grade products, the company's self-developed aftermarket automotive-grade storage and industrial-grade storage are also vigorously expanding customers. The company's self-developed UFS storage will also be gradually launched into the market.

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[tokenanalyst]

 

[tokenanalyst]

Enhancing the PMMA Photoresist Film via Ozone Treatment and Vapor Phase Infiltration​

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Abstract​

Achieving photoresists that combine low film thickness and high etch resistance while maintaining high resolution presents a challenging contradiction. Doping a poly(methyl methacrylate) (PMMA) film with metal oxide was demonstrated to provide better etch performance, but the line roughness was significantly scarified. Herein, we report an efficient PMMA surface treatment followed by vapor phase infiltration (VPI) for greatly improved deposition of hafnium oxide (HfOx). By treating PMMA with ozone and infiltrating it with tetrakis(dimethylamino)hafnium (TDMAH), a hybrid photoresist achieving 30 nm half-pitch (HP) resolution under extreme ultraviolet lithography (EUVL) (74 mJ/cm2) with enhanced etch resistance (>120% improvement) and reduced line edge roughness (LER < 10 nm) was realized. This approach provides a viable solution for next-generation lithography by enabling thinner resists without compromising plasma etch resistance, which is critical for advanced semiconductor manufacturing.​

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[tokenanalyst]

Changchuan Technology established a joint venture with Changyue Technology to promote the localization of high-end packaging and testing equipment​

Changchuan Technology issued an announcement on May 6, announcing that it will jointly invest with professional investment institutions to establish Hangzhou Changyue Technology Co., Ltd., which is committed to the localization of high-end packaging and testing equipment.

According to the announcement, the registered capital of the joint venture is RMB 100 million, of which Changchuan Technology subscribed RMB 50 million, accounting for 50% of the registered capital. The partners include Shanghai Semiconductor Equipment Materials Phase II Private Equity Investment Fund Partnership (Limited Partnership) and Hangzhou Benjian Xinlian Equity Investment Partnership (Limited Partnership).

Hangzhou Changyue Technology Co., Ltd. will mainly engage in the localization of high-end packaging and testing equipment and related research and development, production, sales and after-sales service. Changchuan Technology said that the investment aims to promote the technological progress and localization of domestic integrated circuit equipment, while enriching the company's equipment product line and improving its overall core competitiveness and profitability.

This move reflects Changchuan Technology's strategic layout of continuing to deepen its presence in the field of integrated circuit equipment. With the growing demand for independent control of the domestic semiconductor industry chain, the localization of high-end packaging and testing equipment has become an important direction for the development of the industry. By cooperating with professional investment institutions, Changchuan Technology is expected to integrate more resources and accelerate the research and development and industrialization of high-end packaging and testing equipment.

Industry analysts believe that semiconductor packaging and testing equipment is a key link in integrated circuit manufacturing, and its localization level directly affects the integrity and security of my country's semiconductor industry chain. The joint venture established by Changchuan Technology will help fill some gaps in the field of high-end packaging and testing equipment in China and promote the extension of the integrated circuit industry chain to high-end links.

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So the consolidation begins.

 

[olalavn]

Shenzhen Xinkailai Industrial Machinery Co., Ltd. has recently announced an invention patent called "Process Chamber and Semiconductor Equipment"!

 

[tokenanalyst]

Inertial attitude sensor manufacturer Beiwei Sensing completed tens of millions of yuan in B+ round financing

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Recently, Beiwei Sensing, a manufacturer of inertial sensor modules, device products and overall solutions, completed a B+ round of financing of tens of millions of yuan.
Official data shows that Beiwei Sensing is a national high-tech enterprise focusing on the research and development, manufacturing and sales of inertial attitude sensors. It has more than 100 related intellectual property rights. It is the Wuxi Inertial Sensing Engineering Technology Research Center and has subsidiaries in Beijing, Chengdu, Shaoxing and other places.
Beiwei Sensing focuses on inertial sensor modules and upstream devices, and independently develops Beidou integrated navigation system, inertial measurement, heading reference system, fiber optic gyroscope, electronic compass, tilt sensor and other intelligent sensor products, which can fully meet the needs of various inertial attitude measurement and high-precision navigation and positioning. The company continues to innovate in the fields of multi-sensor fusion algorithms and hardware design packaging, serving more than 5,000 customers in the fields of intelligent equipment, autonomous driving, Internet of Things, etc.

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[tokenanalyst]

Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, has made progress in high-precision MEMS fast-reflecting mirrors for satellite laser communications​

The National Key Laboratory of Sensor Technology of the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, has made important progress in the development of high-performance MEMS fast steering mirrors with integrated angle sensors. The prepared MEMS fast steering mirror has a large mirror size, a small package volume, and good linearity, angular resolution, response speed, repeated positioning accuracy, and dynamic deformation of the mirror. At the same time, it integrates a high-sensitivity angle sensor, which can achieve more precise closed-loop control of the laser beam and has great application potential in laser satellite communications. Recently, the relevant results were published in the first-zone academic journal "Microsystems & Nanoengineering" in the field of microsystem technology under the title "A high-performance 10 mm diameter MEMS fast steering mirror with integrated piezoresistive angle sensors for laser inter-satellite links". The first author of the paper is doctoral student Xue Wenli, and the corresponding authors are researcher Wu Zhenyu and assistant researcher Wang Lihao.

Research Background:
Fast mirrors play an important role in satellite laser communications, such as pointing, capturing and tracking light beams. In order to meet the needs of high-precision beam control in laser intersatellite links, fast mirrors need to have a series of extreme performance indicators such as high pointing accuracy, high working bandwidth and high optical quality. In view of the large size, high power consumption and hysteresis of traditional mechanical fast mirrors, as well as the small mirror surface (3-6 mm), low bandwidth (<1 kHz) and no integrated angle sensor of the original MEMS fast mirrors, the research team has designed and developed a series of high-precision and high-reliability MEMS fast mirrors suitable for the demanding needs of aerospace in the past five years.

Research highlights:
In this work, the research team developed a 10 mm large-aperture piezoelectric-driven MEMS fast mirror (Figure 1) to solve the problems of small mirror size and insufficient dynamic bandwidth of existing products. The design uses double-layer heterogeneous integration technology to achieve higher fill factor and resonant frequency. The wafer-level bonding process is used to achieve high uniformity of the fast mirror. The device has high linearity (99.95%), ultra-high angular resolution (0.3 μrad), fast step response (0.41 ms) and high repeatability.

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