Chinese semiconductor thread II

tokenanalyst

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Design of high-frequency, high-power density hybrid integrated power supply based on GaN high electron mobility transistors​

Abstract​

Hybrid integrated DC-DC converters are widely used in harsh environments and applications with high-reliability requirements due to their wide operating temperature range and long-term reliability. This paper presents the design of a hybrid integrated DC-DC converter with an input voltage of 28 V and an output of 5 V/20 A, leveraging the excellent high-frequency, low-loss characteristics of gallium nitride (GaN) devices. The design incorporates an active clamp soft-switching topology, hybrid integrated micro-assembly technology, and high-current, low thermal resistance hermetic packaging techniques. The converter operates at a switching frequency of 800 kHz and achieves a peak efficiency of 92%. The paper elaborates in detail on the design methods and technical details of the active clamp power circuit, the control of parasitic parameters and oscillating voltage in the GaN HEMT drive circuit, the optimization of synchronous rectification timing and dead-time, the thick-film hybrid integration process, and heat dissipation design. Through simulations and prototype experiments, it verifies and demonstrates the advantages of GaN HEMTS and hybrid integrated circuits in high power density and high efficiency aspects.​

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OptimusLion

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World's first! Jiufengshan Laboratory has made a new breakthrough in the preparation of nitrogen-polar gallium nitride materials


Recently, the research team of Jiufengshan Laboratory has achieved the world's first preparation of 8-inch silicon-based nitrogen-polar gallium nitride (N-polar GaNOI) high electron mobility materials. This achievement will help system-level chips such as RF front-ends to leapfrog in terms of frequency, efficiency, and integration, and provide strong support for the development of cutting-edge technologies such as next-generation communications, autonomous driving, radar detection, and microwave energy transmission.

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Legume7

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Weibo User Fixed Focus (定焦数码, highly reliable) reports that SMIC N+3 will have a transistor density 125MTr/mm², making it a 5.5 nm node by TSMC standards:
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SMIC's N+3 process is expected to achieve a transistor density of 125MTr/mm², positioning it between TSMC's N6 (6nm) and Samsung's early 5nm technologies.
The iteration sequence of SMIC's manufacturing processes is as follows: N represents the 14nm baseline, N+1 is equivalent to 10nm, N+2 is equivalent to 7nm, and N+3 is equivalent to 5nm.
The expected performance and power consumption are comparable to TSMC's N7P (7nm enhanced version) and N6 (6nm) processes.
 

gotodistance

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Huawei and SiCarrier have embarked on development with the goal of having equipment for all processes, including equipment used in various processes such as semiconductor exposure, deposition, etching, and inspection.

SiCarrier is developing semiconductor equipment that can replace products from top global companies such as Dutch ASML, American Applied Materials, Lam Research, and Japanese Nikon and Canon. It is reported that this includes equipment used in various processes such as semiconductor exposure, deposition, etching, and inspection.

Huawei and SiCarrier have embarked on development with the ultimate goal of having equipment for all processes used in semiconductor manufacturing.

SiCarrier is actively recruiting engineers with experience at overseas semiconductor companies.

original source : nikkei asia
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OptimusLion

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Niuxin DDR5 IP achieves breakthrough progress

Niuxin Semiconductor has relied on its technical accumulation in the field of high-speed interfaces, it has conquered the key technologies of DDR5/LPDDR5 IP. Its self-developed "DDR5 MC + PHY IP" complete solution has been accepted by chip manufacturers, and the measured rate has reached 8400 Mbps. By adapting to domestic DDR5 particles and optimizing the debugging solution, the IP has outstanding performance in robustness and compatibility, providing a new choice for domestic high-end chips.

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OptimusLion

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The world's first mass-produced 1500V high-voltage and high-power SiC chip helps build the world's most powerful super e platform

At the Super e Platform Technology Conference on March 17, the epoch-making Super e Platform was released, launching flash charging batteries, 30,000 rpm motors and a new generation of automotive-grade silicon carbide power chips, and the core three-electric full-dimensional upgrade, coupled with the world's first electric vehicle full-range kilovolt architecture, refreshing many world records. "Super e Platform Technology" is the world's first mass-produced passenger car "full-range kilovolt high-voltage architecture".


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tokenanalyst

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Shanghai Yuwei Semiconductor Jinqiao R&D and Manufacturing Base was launched​


According to official news from Yuwei Semiconductor, product orders have hit new highs over the past six years. Looking ahead, Yuwei Semiconductor will further increase investment in R&D resources, focus on customer needs and industry pain points, accelerate the development of innovative solutions, comprehensively build a product matrix covering the entire process of mask quality management, strive to break through the technical bottlenecks in key links of the domestic semiconductor equipment industry chain, and continue to provide partners with value-added services and performance improvements.

According to official news from Yuwei Semiconductor, the company provides customers with competitive products and technical solutions in the fields of integrated circuit manufacturing, advanced packaging, compound semiconductors, new display, etc. The company focuses on the design and system integration of integrated circuit optical measurement systems, and around the autonomy of integrated circuit equipment, it has formed nine categories of measurement and detection products serving the four major fields of chip manufacturing, mask manufacturing, wafer substrate manufacturing, and substrate manufacturing.

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Pudong New Area held the "Win-win Pudong and Create the Future" conference to promote investment and environment in 2025, sounding the "charge" for the new year's progress in the leading area, and writing a new chapter of Pudong's high-quality development with hard work, achievements and effectiveness. At the meeting, several key industrial projects were signed, including the Yuwei semiconductor equipment development project with a total investment of 800 million yuan .

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