Feikai Materials: Material innovation helps AI chips to develop steadily and achieve long-term development.
Feikai Materials will continue to increase investment in product R&D, establish close cooperative relations with universities and research institutions, and jointly carry out cutting-edge technology research. At the same time, he also pointed out that the company will continue to develop packaging materials that can meet low stress, high thermal conductivity, and high reliability.
In addition to follow-up on research and development, a stable supply of production capacity is also crucial. In the semiconductor industry, technological advances and market demand changes are very rapid, and customers have extremely high requirements for material demand and delivery cycle. "This year, we plan to build a new semiconductor material production base 'Suzhou Kaixin' in Suzhou. The construction of this new base will significantly increase the company's semiconductor material production capacity and better support the development of the industry." Lu Chun said that the base is expected to start construction in the first quarter of this year and is scheduled to be put into production by the end of 2026. The new base will add 30,000 tons of annual production capacity, mainly producing ultra-high purity solvents, semiconductor wet process chemicals, and key materials such as photoresists.
In the semiconductor materials industry, collaboration between upstream and downstream industries has always been a key factor in promoting business development. Lu Chun said, "In-depth cooperation with chip design companies and packaging and testing companies can help us grasp market demand in advance, ensure the accuracy of R&D direction, and improve the quality and production efficiency of packaging processes." He also pointed out, "Through close communication with customers, we can ensure that our products accurately match market demand and adjust product strategies and service solutions in a timely manner based on customer feedback. This efficient partnership is the key to our advantage in the fiercely competitive market."
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Products.
Wafer manufacturing:
Feikai Materials provides a variety of high-purity solvents in the field of integrated circuit manufacturing, which can be used in photoresist edge washing, etching and post-cleaning processes for 12-inch wafer manufacturing. In addition, the company provides customized product services and can develop various high-purity reagents according to the different needs of different customers.
Feikai Material's DUV bottom anti-reflection layer material(BARC), with appropriate thickness, can reduce the reflectivity of Al, Cu, W, GaAs and other substrates to less than 1%; it has good gap-filling ability to expand the process window and is suitable for various KrF lithography processes.
Feikai Material KX series G/H/I line universal high-resolution positive photoresist is suitable for various near-ultraviolet high-resolution step-and-scan lithography equipment. Select the appropriate spin coating steps and lithography process, and it can be customized according to customer needs.
Wafer Level Packaging:
Feikai Materials has strong independent innovation and R&D capabilities, and has developed KX5* series, KX1* series, and KX4* series photoresists for IC packaging to meet the different needs of various high-tech manufacturing customers.
In the wafer-level packaging process, Feikai Materials can provide a wide variety of electroplating products, including copper electroplating solution, silver electroplating solution, gold electroplating solution, tin electroplating solution, nickel electroplating solution and supporting materials.
Aiming at the different needs of IC packaging and various high-tech manufacturing customers, Feikai Materials has developed a series of wet process electronic chemicals, mainly including developers, degumming solutions, etching solutions, cleaning solutions, etc. In addition, the company has independent innovative R&D capabilities and can provide customized products according to the different needs of different customers.
In response to the application of temporary bonding processes in current semiconductor manufacturing, Feikai Materials has developed a complete temporary bonding solution that includes bonding glue, photosensitive glue, and cleaning fluid. This solution supports thermal disassembly, mechanical disassembly, and laser disassembly, and the product has excellent stability and safety.
Chip Level Packaging:
Feikai Materials has developed a series of solder ball products for different melting points and different application fields, with ball diameters ranging from 0.05mm to 1.80mm, which are widely used in advanced packaging fields such as BGA, Filp-Chip, CSP, WLCSP, MEMS, etc. The main products include low-temperature solder balls (95-135℃), high-temperature solder balls (186-309℃), Ultra Low Alpha tin alloy microspheres, etc.
Feikai Materials' epoxy molding compound (EMC) is mainly used in the packaging of integrated circuits, power devices, surface mount discrete devices, photovoltaic modules, intelligent power modules IPM, and automotive power modules IPM. Mid-to-high-end packaging epoxy molding compounds are gradually transforming from traditional surface mount IC SOP/SSOP, QFP, QFN products to advanced substrate packaging BGA and MUF. The product has the characteristics of low warpage, low water absorption, and high reliability.
The new solder paste RCP is a solid crystal solder paste developed for the COB&MiP&COG printing process of Mini LED. It has good printability and demolding properties under fine pitch pad size (P0.3 and above), very little residue after reflow soldering, no cleaning required, non-corrosive, and good tin polymerization performance, which can meet the high-precision and high-reliability conductive parameter requirements.
Feikai Material's flux is mainly used in the ball implantation process in advanced packaging processes. The product has good wettability to different wafers or substrates; good cleanability after high-temperature reflow, no residue after water washing; small weight change after heating, less dirt in the reflow furnace; weak corrosion, less voids, high reliability.
