Chinese semiconductor thread II

[tokenanalyst]

The National Key R&D Project Launch and Implementation Plan Demonstration Meeting led by Ningbo Jingzuan was successfully held​

Focus on national strategic needs and break through the "bottleneck" problem

The project targets the urgent demand for large-size, high-performance diamond materials in cutting-edge fields such as photoelectric detection and heat-resistant functional devices. It focuses on the growth, preparation, processing and demonstration application of large-size single-crystal diamonds, and is committed to breaking the European and American technology monopoly and achieving independent control of key materials. In his report, the project leader, Researcher Wang Yuezhong, pointed out that the team will focus on breaking through core technologies such as seamless splicing, low-stress processing and batch manufacturing of single-crystal diamonds, building a full industrial chain of "material research and development-mass production-application", forming the ability to prepare and demonstrate large-size single-crystal diamonds, and helping my country's aerospace, national defense and other fields to achieve leapfrog development of material technology.

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Shuoke Crystal: 12-inch silicon carbide substrate opens up new boundaries for AR glasses​

Shuoke Crystal will present a full range of silicon carbide substrate products, with a focus on 12-inch high-purity semi-insulating silicon carbide substrates and conductive N-type silicon carbide substrate products. Among them , its 12-inch high-purity semi-insulating substrate will become the core material for the next generation of "AR+AI" smart glasses with its optical performance advantages.

In 2024, Meta and Mood Micro-Nano were the first to introduce silicon carbide-based waveguide lenses into AR glasses. This landmark breakthrough not only promoted the technological upgrade of AR glasses waveguide lenses, but also opened up a new incremental track for silicon carbide substrates. In 2025, the cooperation and application of silicon carbide in the field of AR glasses gradually heated up. Major manufacturers such as XREAL and Thunderbird Innovation also accelerated the technology research and development of silicon carbide and industrial chain cooperation. Silicon carbide waveguides have been established as the core technology path of the AR glasses industry .

Currently, AR glasses optical modules generally use high-refractive glass or resin materials, but they have defects such as high light loss, poor heat resistance, and insufficient mechanical strength, which makes it difficult to meet the stringent requirements of high-end equipment for lightweight, high definition and durability. The three core properties of silicon carbide materials are driving industry change:

● High refractive index (about 2.6): enables more efficient light guidance in AR optical waveguide systems, reduces light loss by 30% compared to glass materials, and supports more compact optical designs;

● High transmittance: SiC material has high transmittance in the visible light and near-infrared bands (400nm-1100nm), which is particularly suitable for AR optical waveguide systems. It can significantly reduce light loss, increase picture brightness, and enhance immersion.

● High thermal conductivity: quickly dissipate heat from electronic components to solve the problems of wearing discomfort and life reduction caused by device heating.

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Guanglinda MicroOLED full-process testing production line officially delivered​

On March 22, Suzhou Guanglinda Electronic Technology Co., Ltd. (hereinafter referred to as "Guanglinda") and Xitai Technology (Meishan) Co., Ltd. (hereinafter referred to as "Xitai Technology") jointly launched the first Micro OLED full-process inspection production line, which was officially delivered. This production line integrates core functions such as CELL, module GAMMA, Demura, and AOI.


The production line is equipped with high-precision optical instruments and intelligent algorithms, which can support micron-level defect recognition and accurately correct product optoelectronic parameters, and is compatible with micro-display detection such as Micro OLED and Micro LED. Its modular design allows customers to quickly customize the detection plan according to process requirements, ensuring seamless connection between equipment and production lines, and finalizing the plan in just 7 days.

With its self-developed optical-mechanical-electrical-computing software system, Guanglinda ensures the controllability of all nodes in the entire process, and has achieved a 98% on-time delivery rate in historical deliveries. To ensure that the equipment is ready for use upon arrival, Guanglinda also conducted a 72-hour rigorous working condition simulation test, and provided 24-hour remote diagnosis and on-site maintenance services to ensure zero interruption of customer production.

According to the data, Xitai Technology focuses on the research and development and production of Micro OLED micro-display screens, has achieved mass production of 8-inch production lines, and is building 12-inch production lines with a planned investment of 6 billion yuan. Guanglinda focuses on the research and development of precision display testing equipment, providing AOI equipment, Gamma correction system and other technologies.​

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GigaDevice's GC7272 has exceeded 100 million units in mass production and won the 8th IC Innovation Award​

On March 22, 2025, the China Integrated Circuit Innovation Alliance officially announced the winners of the 8th "IC Innovation Award". GalaxyCore's independently developed touch display driver integrated chip (TDDI) GC7272 won the "Achievement Industrialization Award" with a shipment scale of over 100 million units and independent technology industrialization results. This award is not only a high recognition of GalaxyCore's technological innovation, but also a strong affirmation of its industrialization results in the DDIC field.

GC7272 is based on TDDI architecture independently developed by GigaDevice and manufactured using 12-inch wafer 55nm process. Its core advantages include:
1. Performance upgrade
It supports 120Hz/240Hz display and touch dual refresh rates, and the touch response speed is 30% faster than the previous generation of products, helping terminal devices achieve silky smooth visual interaction.
2. Energy efficiency optimization
Through the unique low-power circuit design, the power consumption of the whole machine is reduced by 20% compared with the previous generation, significantly extending the battery life of devices such as smartphones.
3. Compatibility breakthrough
It is compatible with both a-Si and IGZO LCD panels, supports flexible configuration of 3-way/4-way power supplies and out-of-order power-on function, and can quickly match the motherboard design solutions of different terminal manufacturers, shortening the product development cycle.
Since its mass production in mid-2023, GC7272 has quickly gained recognition from leading brand customers for its advantages of high cost-effectiveness, high reliability and fast delivery. Its cumulative shipments have exceeded 100 million units, and its market growth rate ranks among the top in the industry, making it the mainstream driving solution for smartphone LCD panels.​

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Shanghai Precision Testing receives additional investment from the National Big Fund, and the semiconductor mass testing track continues to heat up​

Shanghai Jingce Semiconductor received capital investment from the National Big Fund Phase II and other institutions, and the company's registered capital increased from 1.37 billion yuan to 2.07 billion yuan. Recently, Shanghai Jingce Semiconductor Technology Co., Ltd. (hereinafter referred to as "Shanghai Jingce"), a leading domestic semiconductor mass testing equipment company, completed a new round of strategic financing, and the National Integrated Circuit Industry Investment Fund Phase II (hereinafter referred to as "Big Fund Phase II") and other capital officially invested. According to industrial and commercial information, the company's registered capital has risen sharply from 1.37 billion yuan to 2.07 billion yuan. This is the second time that state capital has increased its support after the Big Fund Phase I participated in its A round of financing in 2019, highlighting the strategic value of Shanghai Jingce in the field of semiconductor front-end testing.

Technological breakthroughs win capital favor, accelerating localization process Shanghai Jingce was established in 2018, focusing on the research and development and industrialization of semiconductor front-end measurement and inspection equipment. Its products cover core links such as thin film thickness measurement, key dimension measurement, and electron beam defect detection. Its parent company, Jingce Electronics (300567.SZ), as the leader of domestic display inspection equipment, provides technical collaboration and market resources for Shanghai Jingce. Through independent research and development and international cooperation, Shanghai Jingce has achieved a number of technological breakthroughs, including the mass production and delivery of the first domestic 12-inch optical line width measurement equipment (OCD) and electron beam wafer defect review equipment, and has successfully introduced them into the production lines of leading customers such as SMIC. At present, Shanghai Jingce has established two R&D centers in Shanghai and Wuhan, with R&D personnel accounting for 60%, and has applied for more than 200 patents in total. It has been rated as a national-level "little giant" enterprise with specialization, precision and innovation. The Qingpu Global R&D Headquarters, which was put into use in 2023, further enhanced its technology radiation capability in the Yangtze River Delta integrated circuit industry belt. The investment of the second phase of the Big Fund is the second important financing completed by Shanghai Jingce this year. Since 2024, the second phase of the Big Fund has been active in the field of semiconductor equipment, successively investing in companies such as Angkun Vision, Zhongan Semiconductor, and Zhenbao Technology, covering sub-sectors such as optical testing and precision components, further strengthening the localization layout of the industrial chain.

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Yitong Semiconductor's IPO registration on the Science and Technology Innovation Board has taken effect and plans to raise 3 billion yuan to invest in equipment research and development and manufacturing, etc.​

Yitong Co., Ltd.'s IPO application for the Science and Technology Innovation Board was accepted on June 25, 2021. After two rounds of inquiries, the project passed the review on August 30 of the same year and was submitted for registration on September 17.

According to the prospectus (registration draft) disclosed in September 2021, Eitong Semiconductor is a semiconductor equipment company headquartered in China, with R&D and manufacturing bases in China, the United States and Germany, and operating globally. The company is mainly engaged in the research and development, production and sales of wafer processing equipment required in the integrated circuit manufacturing process, and provides integrated circuit manufacturing equipment and supporting process solutions including dry stripping equipment, rapid thermal processing equipment, and dry etching equipment to global integrated circuit manufacturers.

The company's products have been adopted by many of the world's leading memory chip manufacturers, logic circuit manufacturers and other integrated circuit manufacturers, and its customers cover the world's top ten chip manufacturers and domestic industry-leading chip manufacturers. As of June 30, 2021, the company's cumulative global installed base of products has exceeded 3,800 units and is in a leading position in the world in the corresponding segments. According to Gartner statistics, in 2020, the company's market share of dry degumming equipment and rapid thermal processing equipment ranked first and second in the world, respectively.

E-Tong Semiconductor plans to raise 3 billion yuan in this IPO, which will be invested in E-Tong Semiconductor's integrated circuit equipment R&D and manufacturing service center project, E-Tong Semiconductor's high-end integrated circuit equipment R&D project, and development and technology reserve funds.

Among them, the total investment of Yitong Semiconductor Integrated Circuit Equipment R&D and Manufacturing Service Center project is 963 million yuan, and the project plans to use 800 million yuan of raised funds. After the project is completed, the company's Beijing manufacturing base can achieve a significant increase in the production capacity of dry degumming equipment, rapid thermal treatment equipment and dry etching equipment; and simultaneously add multiple R&D laboratories and training rooms to comprehensively enhance the company's integrated circuit equipment R&D, manufacturing and service capabilities; the construction period is about 18 months.

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SICC 12 inches SiC substrate. Much cheapers SiC products for EVs and other applications.​

 

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Sembcorp Nano successfully landed on the Science and Technology Innovation Board and its stock price surged 202.42% on its first day of listing​

Shengke Nano (Suzhou) Co., Ltd. (hereinafter referred to as "Shengke Nano") successfully landed on the Science and Technology Innovation Board. The company closed at 27.46 yuan per share on its first day of listing, up 202.42%.
It is reported that Shengke Nano intends to publicly issue more than 40.33 million shares, accounting for 10% of the total share capital after issuance, with an issue price of 9.08 yuan per share and an issue price-earnings ratio of 42.64 times. The total amount of funds raised calculated based on the issue price is expected to be 366 million yuan, which is higher than the 297 million yuan planned to be raised when applying for IPO. The funds raised are intended to be used for the construction project of Suzhou's testing and analysis capabilities improvement.

According to public information, Shengke Nano was founded in 2012 and is a well-known semiconductor third-party testing and analysis laboratory in the industry. It provides sample failure analysis, material analysis, reliability analysis and other analytical experiments to customers in the entire semiconductor industry chain. It mainly serves customers' R&D links and is known as the "chip general hospital."

Semiconductor testing and analysis is an indispensable and important part of the semiconductor industry chain. It is deeply integrated with the R&D links of semiconductor companies, which can help semiconductor companies overcome technical difficulties and bottlenecks, accelerate product R&D progress, and improve product performance indicators and yield rates, playing an important role in the development of semiconductor technology and process evolution. Shengke Nano's listing this time can use capital market tools to grow bigger and stronger, which is conducive to accelerating the R&D progress of upstream and downstream companies in the semiconductor industry chain, and creating incremental value for the semiconductor industry chain, and contributing unique value to the "extending, supplementing, and strengthening" of my country's semiconductor industry chain and the independent control of the entire industry chain.

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Ultra Low Expansion Glass. The backbone of EUV optics and other applications.

 

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Domestic commercial ULE Glass.​

Ultra-low expansion glass-ceramic LW1A​

Chengdu Guangming ultra-low expansion fine glass LW1A has a thermal expansion coefficient close to zero in the range of 0~50℃, and has excellent chemical stability and mechanical properties. It is an ideal material for applications such as reflective substrates for large astronomical telescopes, laser gyroscope resonant cavities, optical elements for lithography equipment, and highly mechanical parts.

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