Chinese semiconductor thread II

FairAndUnbiased

Brigadier
Registered Member
I'm very much aware of that Interview. But I think my point is still valid. If you recall, China already domesticated 28nm everything (except for lithography) as early as 2022-2023. But even in late 2024 we were seeing huge revenue surge from AMAT, LAM, TEL towards China. If it was so easy to go from 28nm to say 5nm, why bother giving revenue to your adversary and go through so many hurdles to get the equipments via Singapore etc etc right?
Panic buying, uncertainty and copy exactly.

But see this is why it is much more confusing to know a little, and extrapolate, than admit that there are things that are just unknown.

Simple question: lithography is defined by "xx nm" because the key parameter is exposure line width.

What's the "nm" refer to in etch?

What controls the "nm" in etch?

Is that something part of the etch chamber or elsewhere in the process?
 

tokenanalyst

Brigadier
Registered Member
In 2023 according to Leslie Nostradamus Wu, SMIC by now should be falling apart instead of being the second foundry in the world because the lack of components due the 2022 service restrictions of the US.
I am starting to suspect that a lot of Think Tankers stooges has been relying on the (mis)information services the Leslie provide as a consultant to make their case. This dude could be the "insider" that some of these guys sometimes claims, including somes that you people may know.
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OptimusLion

Junior Member
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ICBC sets up 80 billion yuan science and technology innovation fund to support the development of semiconductor and other industries

Industrial and Commercial Bank of China announced on Wednesday that it will set up a science and technology innovation fund with a scale of 80 billion yuan (about 11.04 billion U.S. dollars) to support the development of the private economy. The fund aims to support "hard technology" such as semiconductors and advanced manufacturing rather than "soft technology" such as Internet services through equity investment.

ICBC Chairman Liao Lin said at a meeting on Wednesday that the bank will fully implement the instructions and translate favorable policies into concrete actions to support private enterprises. The fund is also positioned as "patient capital" that focuses on long-term investment rather than pursuing short-term profits.

Last week, China's National Development and Reform Commission said it would set up a government-backed fund to mobilize 1 trillion yuan of social capital to support technology startups.

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OptimusLion

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Sanan Optoelectronics: Chongqing's 8-inch silicon carbide substrate production capacity currently reaches 500 pieces/week

On March 12, Sanan Optoelectronics stated on the investor interaction platform that the 8-inch silicon carbide substrate production line built by its subsidiary Chongqing Sanan has been put into production, with a current capacity of 500 pieces per week. The production line will be put into operation in September 2024, with a planned annual production capacity of 480,000 pieces. After full production, it will achieve a weekly production capacity of nearly 10,000 pieces, providing supporting support for the joint venture plant STMicroelectronics.

STMicroelectronics is a joint venture established by Sanan Optoelectronics and STMicroelectronics, with a planned total investment of 23 billion yuan. It will build an 8-inch silicon carbide automotive-grade power chip production line with an annual output of 480,000 pieces, and is expected to achieve mass production in the fourth quarter of 2025. Chongqing Sanan and STMicroelectronics are located in the same park in Chongqing High-tech Zone, forming a complete industrial chain from substrate to chip manufacturing. It is the first 8-inch automotive-grade silicon carbide mass production line in China.

Sanan Optoelectronics said that Chongqing Sanan's substrate products have been stably supplied to STMicroelectronics' production line, and as production capacity increases, cost advantages will become more apparent. The company estimates that after the project reaches full production in 2028, it will be able to meet more than 40% of the domestic demand for automotive-grade silicon carbide.

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OptimusLion

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Supporting the China Science and Technology Strategy! The GB national standard "Buried Silicon Epitaxial Wafer" co-edited by GEZE is officially implemented

Recently, the State Administration for Market Regulation and the National Standardization Administration officially released the national standard (GB/T 44334-2024) "Buried Silicon Epitaxial Wafer", which will be officially implemented on March 1, 2025. GEZE Semiconductor participated in the drafting of this national standard and worked with a number of leading semiconductor companies to jointly complete the formulation of the standard.

At present, the domestic semiconductor market is booming, and silicon epitaxial wafers, as an important component of it, are experiencing a growing market demand. However, due to the lack of unified standards, the industry is in chaos, and problems such as confusion of concepts and uneven product quality are common, which seriously hinders the sustained and stable development of the domestic semiconductor industry.

The release of this national standard provides unified technical specifications for the production, testing, analysis and quality evaluation of buried silicon epitaxial wafers. This will not only help regulate the market order and avoid uneven quality due to inconsistent standards, but also effectively improve the overall quality of domestic buried silicon epitaxial wafers and enhance the market competitiveness of products. In today's globalized context, international competition in the semiconductor industry is becoming increasingly fierce. The release of national standards will help my country's semiconductor products to align with international standards and reduce technical barriers in international trade. This will not only help my country's semiconductor products to better enter the international market, but also attract more international partners and enhance my country's position in the global semiconductor industry chain.

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OptimusLion

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A major technological breakthrough: China has successfully developed a new photonic chip

Recently, Researcher Zhang Junwen and Professor Chi Nan from the School of Information Science and Engineering at Fudan University have collaborated with relevant research teams to introduce multi-dimensional multiplexing technology into on-chip optical interconnect architecture through precise design and optimization. This not only significantly improves the data transmission throughput, but also excels in power consumption and latency. It has strong scalability and compatibility, and is suitable for a variety of high-performance computing scenarios.

On this basis, the team designed and developed a silicon photonic integrated high-order mode multiplexer chip, which achieved ultra-large capacity on-chip optical data transmission. Experimental results show that the chip can support a data transmission speed of 38Tb per second, which means that in the future, 4.75 trillion parameters of a large model can be transferred in 1 second, which significantly improves the communication performance and reliability between large model training and computing clusters , and provides strong support for applications such as artificial intelligence, large model training, and GPU accelerated computing.

This technological breakthrough not only provides a new solution for optical interconnection systems in data centers and high-performance computing servers, but also lays a solid technical foundation for artificial intelligence, large-scale parallel computing and large model training. The relevant research results were published in the international journal Nature Communications.

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OptimusLion

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Lianchuang semiconductor laser production base project settled in Wuhan

Recently, the Lianchuang semiconductor packaging accessories and new laser application equipment production base settled in Caidian District, Wuhan. Lianchuang Precision Machinery Co., Ltd. is an enterprise that provides industrial automation solutions for automatic coupling packaging equipment for optical communication modules and assembly and testing production lines for automotive parts. The company plans to invest 300 million yuan in Yuxian Street to build a Lianchuang semiconductor packaging accessories and new laser application equipment production base, mainly arranging water-guided laser cutting, glass laser welding, laser online monitoring equipment and ceramic splitter production and manufacturing automation business production lines. After the project is fully completed and put into production, it is expected to achieve an annual output value of more than 400 million yuan.


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OptimusLion

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Huatian Technology Pangu Semiconductor Advanced Packaging and Testing Project is expected to be partially put into production within this year


According to the "Pukou Release" public account, the Pangu Semiconductor Advanced Packaging and Testing Project, which was invested 3 billion yuan by Huatian Group in Pukou Economic Development Zone, is currently undergoing finalization work and is expected to be partially put into production within the year.

The person in charge of the project said that the project started pile foundation construction in July 2024, and the main structure was capped at the end of October. Currently, more than 80% of the main decoration has been completed. The next step will be equipment debugging. It is expected to be completed by the end of April to early May, and then it will be put into production.

It is reported that the Pangu Semiconductor Advanced Packaging and Testing Project is controlled by Huatian Technology (Jiangsu) Co., Ltd., with a total investment of 3 billion yuan. It will be built in two phases. The first phase will mainly build production plants and related ancillary facilities to promote the development and application of board-level packaging technology. The project will be partially put into production this year. After full production, the annual output value is expected to be no less than 900 million yuan, and the annual economic contribution will be no less than 40 million yuan. The project aims to fill the weak links in the Pukou integrated circuit industry chain and improve the overall industrial development level.

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