Chinese semiconductor thread II
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UltraRISC Technology has released the UR-DP1000, a high-performance desktop-class RISC-V CPU.
UltraRISC, a domestic high-performance RISC-V CPU company, announced yesterday the launch of the high-performance desktop multi-core processor UR-DP1000. This processor is based on 12nm process, has a TDP power consumption of 30W , and uses FCBGA1155 35mm×35mm package.
UR-DP1000 is based on the UR-CP100 self-developed processor core . UR-CP100 adopts a 64-bit out-of-order 4-issue superscalar microarchitecture, supports the RV64GCBHX extended instruction set and RVH 1.0 virtualization extension, and has 64KB L1I, 64KB L1D and 512KB L2 cache.
The UR-CP100 core frequency is 2.0~2.3GHz. In the SPEC CPU 2006 benchmark test, the single-core integer performance reaches 10.4 points per GHz frequency and the floating-point performance reaches 12.0 points per GHz frequency .
At the processor level, the UR-DP1000 contains 2 quad-core clusters, a total of 8 UR-CP100s , each cluster contains 4MB L3 cache, and the CPU as a whole shares 16MB LLC last-level cache.
In terms of external expansion, UR-DP1000 supports dual-channel DDR4 memory , ECC error correction, and a maximum content capacity of 128GB; it can be expanded to a total of 24 PCIe 4.0 channels (link combination is ×16 + ×4 + ×4).
UltraRISC, a domestic high-performance RISC-V CPU company, announced yesterday the launch of the high-performance desktop multi-core processor UR-DP1000. This processor is based on 12nm process, has a TDP power consumption of 30W , and uses FCBGA1155 35mm×35mm package.
UR-DP1000 is based on the UR-CP100 self-developed processor core . UR-CP100 adopts a 64-bit out-of-order 4-issue superscalar microarchitecture, supports the RV64GCBHX extended instruction set and RVH 1.0 virtualization extension, and has 64KB L1I, 64KB L1D and 512KB L2 cache.
The UR-CP100 core frequency is 2.0~2.3GHz. In the SPEC CPU 2006 benchmark test, the single-core integer performance reaches 10.4 points per GHz frequency and the floating-point performance reaches 12.0 points per GHz frequency .
At the processor level, the UR-DP1000 contains 2 quad-core clusters, a total of 8 UR-CP100s , each cluster contains 4MB L3 cache, and the CPU as a whole shares 16MB LLC last-level cache.
In terms of external expansion, UR-DP1000 supports dual-channel DDR4 memory , ECC error correction, and a maximum content capacity of 128GB; it can be expanded to a total of 24 PCIe 4.0 channels (link combination is ×16 + ×4 + ×4).
AMEC: Over 5,000 etching equipment reactors shipped worldwide
On March 12, Advanced Micro-Semiconductor Equipment (Shanghai) Co., Ltd. (hereinafter referred to as "AMEC") announced that the total number of plasma etching equipment reactors shipped worldwide has exceeded 5,000. This includes four types of equipment: CCP high-energy plasma etcher, ICP low-energy plasma etcher, single-reactor reactor and dual-reactor reactor. Plasma etcher is the most critical and largest micro-processing equipment in the market besides photolithography. Due to the smaller and smaller micro-devices and the wavelength limitation of photolithography machines, as well as the development of micro-devices from two-dimensional to three-dimensional, etcher is the fastest growing market for semiconductor equipment in the past decade. This important milestone marks that AMEC continues to be widely recognized by customers and the market in the field of plasma etching equipment, and also demonstrates that the company has entered the international forefront in the field of plasma etching.
AMEC is committed to providing leading processing equipment and process technology solutions to global integrated circuit and LED chip manufacturers. AMEC has developed two categories of CCP high-energy plasma and ICP low-energy plasma etching, including more than a dozen subdivided etching equipment that can cover most etching applications. AMEC's plasma etching equipment has been widely used by domestic and international first-tier customers, from 65 nanometers to 5 nanometers and many etching applications with more advanced processes. In the past decade, AMEC has focused on developing a variety of conductor and semiconductor chemical thin film equipment, such as MOCVD, LPCVD, ALD and EPI equipment.
In the past 20 years, AMEC's etching equipment has accumulated a large amount of chip production line mass production data and customer verification data, which can cover the vast majority of etching applications, including various high-end applications. AMEC's plasma etching equipment continues to expand its market share, and the company's shipments of CCP high-energy plasma etching equipment and ICP low-energy plasma etching equipment have maintained rapid growth in recent years. The cumulative online installed capacity of CCP equipment has increased by more than 37% annually in the past four years, and has exceeded 4,000 reaction tables; the cumulative online installed capacity of ICP equipment has increased by more than 100% annually in the past four years, and has exceeded 1,000 reaction tables. As of the end of February 2025, the company has accumulated more than 5,400 reaction tables in more than 130 production lines at home and abroad, fully realizing mass production and large-scale repetitive sales.
On March 12, Advanced Micro-Semiconductor Equipment (Shanghai) Co., Ltd. (hereinafter referred to as "AMEC") announced that the total number of plasma etching equipment reactors shipped worldwide has exceeded 5,000. This includes four types of equipment: CCP high-energy plasma etcher, ICP low-energy plasma etcher, single-reactor reactor and dual-reactor reactor. Plasma etcher is the most critical and largest micro-processing equipment in the market besides photolithography. Due to the smaller and smaller micro-devices and the wavelength limitation of photolithography machines, as well as the development of micro-devices from two-dimensional to three-dimensional, etcher is the fastest growing market for semiconductor equipment in the past decade. This important milestone marks that AMEC continues to be widely recognized by customers and the market in the field of plasma etching equipment, and also demonstrates that the company has entered the international forefront in the field of plasma etching.
AMEC is committed to providing leading processing equipment and process technology solutions to global integrated circuit and LED chip manufacturers. AMEC has developed two categories of CCP high-energy plasma and ICP low-energy plasma etching, including more than a dozen subdivided etching equipment that can cover most etching applications. AMEC's plasma etching equipment has been widely used by domestic and international first-tier customers, from 65 nanometers to 5 nanometers and many etching applications with more advanced processes. In the past decade, AMEC has focused on developing a variety of conductor and semiconductor chemical thin film equipment, such as MOCVD, LPCVD, ALD and EPI equipment.
In the past 20 years, AMEC's etching equipment has accumulated a large amount of chip production line mass production data and customer verification data, which can cover the vast majority of etching applications, including various high-end applications. AMEC's plasma etching equipment continues to expand its market share, and the company's shipments of CCP high-energy plasma etching equipment and ICP low-energy plasma etching equipment have maintained rapid growth in recent years. The cumulative online installed capacity of CCP equipment has increased by more than 37% annually in the past four years, and has exceeded 4,000 reaction tables; the cumulative online installed capacity of ICP equipment has increased by more than 100% annually in the past four years, and has exceeded 1,000 reaction tables. As of the end of February 2025, the company has accumulated more than 5,400 reaction tables in more than 130 production lines at home and abroad, fully realizing mass production and large-scale repetitive sales.
Shengding Plasma degumming technology enables glass through-hole process
TGV glass substrate is a high-end electronic packaging material that achieves three-dimensional interconnection by making micron-level through holes (Via) on the glass substrate and filling it with conductive materials. It is used for high-density electronic packaging (such as 3D chip stacking and RF devices). It achieves vertical conductive interconnection in glass through precision technology and has become a key technology carrier in 5G communications, advanced semiconductor packaging and other fields.
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Shanghai Institute of Optics and Fine Mechanics: "From Picoseconds to Attoseconds" Achieving Attosecond-Level Time Jitter Synchronization of Picosecond Lasers
Recently, the State Key Laboratory of High Field Laser Physics of the Shanghai Institute of Optics and Fine Mechanics has achieved attosecond synchronization of picosecond laser pulses based on a self-built time synchronization system. Attosecond science is an important branch of ultrafast optics and laser science. Its core goal is to detect and manipulate ultrafast phenomena such as electron motion, providing a new perspective for understanding the basic laws of the material world. For example, in chemical reactions, the breaking and recombination of molecular bonds are determined by the ultrafast motion of electrons, and the attosecond time scale makes it possible to directly observe and manipulate these processes. Attoseconds (10-18 seconds) are currently the shortest unit that humans can accurately manipulate on a time scale, and the realization of this ultra-high precision time control is inseparable from the support of laser time synchronization technology. Since picosecond (10-12 seconds) laser pulses are an important basic light source for many attosecond science experiments, how to correct the time jitter of picosecond lasers to the attosecond level is the basis for ensuring that attosecond science plays a role.
Recently, the State Key Laboratory of High Field Laser Physics of the Shanghai Institute of Optics and Fine Mechanics has achieved attosecond synchronization of picosecond laser pulses based on a self-built time synchronization system. Attosecond science is an important branch of ultrafast optics and laser science. Its core goal is to detect and manipulate ultrafast phenomena such as electron motion, providing a new perspective for understanding the basic laws of the material world. For example, in chemical reactions, the breaking and recombination of molecular bonds are determined by the ultrafast motion of electrons, and the attosecond time scale makes it possible to directly observe and manipulate these processes. Attoseconds (10-18 seconds) are currently the shortest unit that humans can accurately manipulate on a time scale, and the realization of this ultra-high precision time control is inseparable from the support of laser time synchronization technology. Since picosecond (10-12 seconds) laser pulses are an important basic light source for many attosecond science experiments, how to correct the time jitter of picosecond lasers to the attosecond level is the basis for ensuring that attosecond science plays a role.
Domestic EDA project settled in Optics Valley
AllCore Intelligent Manufacturing Technology Co., Ltd. (hereinafter referred to as "AllCore Intelligent Manufacturing") signed a contract with the East Lake High-tech Zone to carry out the construction of a domestically manufactured EDA project in Optics Valley.
A chip contains billions of transistors. EDA (electronic design automation) automates design, verification, optimization, and manufacturing through a software tool chain, thereby improving efficiency, reducing costs, and ensuring product reliability. It is like a chef's spatula, a basic tool for chip design. With the acceleration of localization of chip manufacturing, domestic integrated circuit companies are increasingly in urgent need of localization of chip design software.
Founded in 2019, All-Core Intelligent Manufacturing is a leading domestic EDA company. It has applied for 182 related patents and has domestic computational lithography platforms, design and manufacturing collaborative optimization platforms, intelligent manufacturing platforms, and full-process process device simulation design platforms, serving Wuhan integrated circuit companies.
The signed project is located in Wuhan Future Science and Technology City, and will carry out domestic manufacturing EDA research and development, application and technical support, etc., to promote the development of the integrated circuit industry in Optics Valley.
A chip contains billions of transistors. EDA (electronic design automation) automates design, verification, optimization, and manufacturing through a software tool chain, thereby improving efficiency, reducing costs, and ensuring product reliability. It is like a chef's spatula, a basic tool for chip design. With the acceleration of localization of chip manufacturing, domestic integrated circuit companies are increasingly in urgent need of localization of chip design software.
Founded in 2019, All-Core Intelligent Manufacturing is a leading domestic EDA company. It has applied for 182 related patents and has domestic computational lithography platforms, design and manufacturing collaborative optimization platforms, intelligent manufacturing platforms, and full-process process device simulation design platforms, serving Wuhan integrated circuit companies.
The signed project is located in Wuhan Future Science and Technology City, and will carry out domestic manufacturing EDA research and development, application and technical support, etc., to promote the development of the integrated circuit industry in Optics Valley.
This isn't meant for lithography though, is it?