According to the official website, Lepu Technology is committed to the innovative application of advanced laser technology in specialized subdivisions. It has launched more than 30 types of professional laser application equipment in semiconductor wafer manufacturing, packaging and testing, precision electronic manufacturing and other fields, and has more than 50 professional equipment. With independent intellectual property rights, it has developed into my country's first-class semiconductor and precision electronic process equipment manufacturing enterprise.
According to reports, the Laipu Technology National Headquarters and Integrated Circuit Equipment R&D and Manufacturing Base project has a total investment of 1.66 billion yuan, covering an area of 39 acres and a construction area of 65,000 square meters. Construction has started in October 2023 and is expected to be approved by May 2025. The parallel connection will be completed and accepted in parallel, and full production will be reached in May 2026.
The relevant person in charge of Laipu Technology said that the implementation of the project will effectively promote the progress of laser equipment and technology in my country's semiconductor field, and promote process innovation in front-end integrated circuit manufacturing, advanced laser technology application and system integration, and independent controllability and professionalism of core components. It will play a positive role in talent cultivation and other aspects.
From the perspective of ownership structure, the controlling shareholder of Laipu Technology is Dongguan Dongjun Investment Co., Ltd., with a direct shareholding ratio of 26.27%. It is indirectly controlled by serving as the executive partner of Dongguan Puying Management Consulting Partnership (Limited Partnership) The voting right ratio is 4.28%, and it controls a total of 31.05% of all voting shares of the company.