Chinese semiconductor thread II
- Thread starter vincent
- Start date
SSMB will give 10X plus the amount of power that this tool will give, no intensive plasma cleaning infrastructure need it, no hydrogen management, no huge collector mirrors. Just very powerful clean EUV light directly to the illuminator, the reticle, the projections down to the wafer.
If the size is increasing this much for each stage of ASML's machines, you have to wonder how large the Hyper NA ones are going to be.
TankeBlue will soon get into mass production of SiC epitaxy. It has plans to produce 250k wpy of substrate & epitaxy with Shenzhen plant and another 1 million wpy in Xuzhou plant a year from now
More impressively, it has achieves 98.9% and 97.3% yield on its 650 and 1200V epitaxy wafers recently. Not bad.
Apple iPhone sales plunge 24% in China as Huawei resurges, report says
Several rival Chinese smartphone companies also logged drops in their unit sales in the six-week period, but the declines were less pronounced than that of Apple. Oppo’s smartphone shipments dropped 29% year-on-year, while Vivo and Xiaomi logged drops of 15% and 7%, respectively, according to Counterpoint Research.
The best-performing smartphone brands for the first six weeks were Huawei and its spinoff Honor, which branched out of the tech giant in 2020 as a result of U.S. sanctions.
Huawei smartphone unit shipments rose 64% year-over-year in the first six weeks of 2024, according to Counterpoint Research. Shipments of Honor handsets, meanwhile, added 2%
Several rival Chinese smartphone companies also logged drops in their unit sales in the six-week period, but the declines were less pronounced than that of Apple. Oppo’s smartphone shipments dropped 29% year-on-year, while Vivo and Xiaomi logged drops of 15% and 7%, respectively, according to Counterpoint Research.
The best-performing smartphone brands for the first six weeks were Huawei and its spinoff Honor, which branched out of the tech giant in 2020 as a result of U.S. sanctions.
Huawei smartphone unit shipments rose 64% year-over-year in the first six weeks of 2024, according to Counterpoint Research. Shipments of Honor handsets, meanwhile, added 2%
Guangli Micro (Semitronix): Unswervingly develop in the field of integrated circuit yield rate
Guangliwei released the " Announcement on Promoting the "Double Improvement of Quality and Return" Action Plan" on the evening of March 4 . According to the announcement, Guangli Micro is a leading supplier of integrated circuit EDA software and wafer-level electrical test equipment. In the future, the company will continue to focus on its main business and unswervingly develop in the field of integrated circuit yield: guided by customer and market demand, continue to improve the performance of existing products, continue to develop new EDA tools, and further complement the Product matrix and expansion tool chain, expand from manufacturing EDA category to design EDA category; further expand the application scenarios and market share of electrical testing equipment, maintain high-quality coordinated development with software products; focus on data software products Hands-on, complete the entire integrated circuit industry chain, further open up all aspects of integrated circuit design, manufacturing, packaging and other aspects, rely on core data and artificial intelligence technology to better serve the development of the integrated circuit industry; actively expand overseas markets for software and hardware, and enhance the company The international market position will be further expanded and strengthened.
China Ceramics Electronics: The core technical indicators of the ceramic heating plate products developed have reached the international level of similar products and passed user verification.
Recently, Hebei China Ceramics Electronic Technology Co., Ltd. stated in a survey of specific subjects that it has developed alumina and aluminum nitride core materials and supporting metallization systems for precision ceramic parts, and established a complete Precision ceramic parts manufacturing process platform, the core technical indicators of the developed ceramic heating plate products have reached the international level of similar products and passed user verification, realized the research and development and production of key parts, and have been used in key domestic semiconductor equipment in batches. Sales revenue of precision ceramic parts will show a growth trend in 2023.
Precision ceramic components are core components for semiconductor equipment prepared by precision processing of advanced ceramics such as aluminum oxide and aluminum nitride. They have excellent properties such as high strength, corrosion resistance, and high precision. They are used in etching machines and coating and developing machines. , photolithography machines, ion implanters and other key semiconductor equipment.
China Ceramics Electronics lays out the field of precision ceramic parts. Facing the demand for semiconductor equipment parts, it continues to develop ceramic material systems and utilizes mature manufacturing process platforms to realize the R&D and production of technically difficult precision parts such as heating plates and electrostatic chucks to solve Prominent issues in the domestic semiconductor equipment industry and expand product areas.
Cross-layer transmission realized by light-emitting memristor for constructing ultra-deep neural network with transfer learning ability
Abstract
Deep neural networks have revolutionized several domains, including autonomous driving, cancer detection, and drug design, and are the foundation for massive artificial intelligence models. However, hardware neural network reports still mainly focus on shallow networks (2 to 5 layers). Implementing deep neural networks in hardware is challenging due to the layer-by-layer structure, resulting in long training times, signal interference, and low accuracy due to gradient explosion/vanishing. Here, we utilize negative ultraviolet photoconductive light-emitting memristors with intrinsic parallelism and hardware-software co-design to achieve electrical information’s optical cross-layer transmission. We propose a hybrid ultra-deep photoelectric neural network and an ultra-deep super-resolution reconstruction neural network using light-emitting memristors and cross-layer block, expanding the networks to 54 and 135 layers, respectively. Further, two networks enable transfer learning, approaching or surpassing software-designed networks in multi-dataset recognition and high-resolution restoration tasks. These proposed strategies show great potential for high-precision multifunctional hardware neural networks and edge artificial intelligence.
Abstract
Deep neural networks have revolutionized several domains, including autonomous driving, cancer detection, and drug design, and are the foundation for massive artificial intelligence models. However, hardware neural network reports still mainly focus on shallow networks (2 to 5 layers). Implementing deep neural networks in hardware is challenging due to the layer-by-layer structure, resulting in long training times, signal interference, and low accuracy due to gradient explosion/vanishing. Here, we utilize negative ultraviolet photoconductive light-emitting memristors with intrinsic parallelism and hardware-software co-design to achieve electrical information’s optical cross-layer transmission. We propose a hybrid ultra-deep photoelectric neural network and an ultra-deep super-resolution reconstruction neural network using light-emitting memristors and cross-layer block, expanding the networks to 54 and 135 layers, respectively. Further, two networks enable transfer learning, approaching or surpassing software-designed networks in multi-dataset recognition and high-resolution restoration tasks. These proposed strategies show great potential for high-precision multifunctional hardware neural networks and edge artificial intelligence.
Can anyone please upload the full article?