Chinese semiconductor thread II

[tokenanalyst]

MZSEMI launched Overlay Metrology Bonding tools for Advance 3D Packaging and 3DNAND.
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OVLScan A Series Bonding registration accuracy measurement equipment.​

Product Introduction Based on the functions of OVLScan, the OVLScan A series products integrate self-developed infrared optical imaging modules. For graphics on substrate materials or film media that cannot be penetrated and imaged by visible light, infrared imaging is used for image acquisition and algorithm processing to calculate the deviation value of registration

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[tokenanalyst]

. EUV simplifies lots of steps, and the more steps the slower more expensive and less accurate the production process. Its benefits are not exclusive to just one node.

No necessary, that was the promise, the reality is a bit more complicated than that. The supply chain for EUV is more costly than for Immersion lithography, there is an issue with pattern resolution due induced electrons in the PR. Double patterning in EUV is as expensive as SAQP with immersion lithography.

There is a reason why ASML is going directly for HighNA just a few years of introducing LowNA EUV and why may be that China is going the same route, hopefully managing to reduce costs.

 

[tokenanalyst]

New breakthrough in domestic equipment! Yiwen Technology announced that the first 12-inch CCP SPC 12D etching machine was successfully delivered to Chengdu BYD Semiconductor​

Yiwen Technology, a domestic semiconductor equipment manufacturer, announced that after strict completion of research and development, debugging and preliminary process verification, Yiwen Technology's SPC 12D etching equipment was officially delivered to BYD Semiconductor. The moment the equipment transport vehicle drove into the Chengdu factory, it marked that the collaborative layout of the two parties in the automotive semiconductor industry chain has entered a new stage of equipment-level localization.



BYD Semiconductor, as a leading enterprise in the domestic semiconductor industry, has taken a leading position in many fields with its technological innovation and product advantages. BYD Semiconductor's products are widely used in many fields such as automobiles and industrial control, providing solid technical support for the development of new energy vehicles and other industries.

In 2022, Yiwen Technology and BYD reached a strategic cooperation to comprehensively lay out the automotive semiconductor industry chain. Yiwen Technology's achievements in high-proportion localization of core components and its industrial collaboration with BYD have injected new impetus into the comprehensive layout of the automotive semiconductor industry chain and jointly promoted the progress of domestic semiconductor equipment.

The equipment delivered this time is the Seric Plasma SPC 12D etching equipment self-developed by Yiwen Technology, which is mainly suitable for IC, power devices, silicon-based micro-displays, micro-nano optical devices, advanced packaging and other fields.

This equipment is equipped with a standard 6-sided self-developed automatic vacuum platform, and a software control system developed based on the Windows platform, and a 12-inch SPC 12D capacitively coupled plasma etcher suitable for silicon substrates.

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[latenlazy]

No necessary, that was the promise, the reality is a bit more complicated than that. The supply chain for EUV is more costly than for Immersion lithography, there is an issue with pattern resolution due induced electrons in the PR. Double patterning in EUV is as expensive as SAQP with immersion lithography.

There is a reason why ASML is going directly for HighNA just a few years of introducing LowNA EUV and why may be that China is going the same route, hopefully managing to reduce costs.

While I am fully aware of the complications with EUV, even at 7nm there are almost certainly still some steps where you can get throughout gain and cost reduction not depending on multipatterning. Tolerance statistics is one key part of the hard math in the equation.

 

[tokenanalyst]

While I am fully aware of the complications with EUV, even at 7nm there are almost certainly still some steps where you can get throughout gain and cost reduction not depending on multipatterning. Tolerance statistics is one key part of the hard math in the equation.

I Think that for 7nm with EUV you need double patterning because the issues with stochastic defects. And given the low productivity of current EUV machines compared with DUVi machines that put the costs closer to Immersion Lithography Quadruple Patterning.

What I had been reading in the research literature is that the benefits of EUV over other techniques don't begin to be realized until you reach the most advanced nodes, 5nm and below. Multi-patterning with LowNA EUV is a hassle according to some sources and HighNA's costs are really high. There are other aspects that are being worked on to increase resolution, such as improvements in Atomic Layer Deposition, highly selective etching, self-correcting pattern resolution techniques like DSA and advanced packaging.

I think the "issues" that people say SMIC used to have with their 7nm process node was more due to their adjustment in their manufacturing process to US export controls than in their SAQP technique with their immersion lithography tools. 5nm is a real possibility with immersion and with more or less decent yields.