Tin droplet target generation method and system
Chinese semiconductor thread II
- Thread starter vincent
- Start date
An extreme ultraviolet multilayer film and its preparation method and application
A device for detecting performance of metal-containing extreme ultraviolet photoresist
Extreme ultraviolet lithography mask protective film detection device
Extreme ultraviolet lithography mask protective film detection device
A vortex optical diagnostic device for a free electron laser device
Another domestic SiC company achieved a breakthrough in 12-inch equipment.
Jiangsu Tianjing Intelligent Equipment Co., Ltd. (hereinafter referred to as "Tianjin Intelligent") has achieved a major technological breakthrough in the field of 12-inch silicon carbide (SiC) cutting equipment and officially launched the TJ320 ultra-high-speed multi-wire cutting machine.
It is reported that the TJ320 model integrates the independently developed ultra-high-speed servo tension control system and diamond wire circulation cutting technology, with an online running speed of up to 3,000 meters per minute, and a cutting efficiency that is 300% higher than that of traditional equipment. The tension control accuracy during the cutting process is greatly improved, which greatly improves the processing stability. It also supports 4-12 inch wafer compatibility, with an annual production capacity of 200,000 pieces per unit, which can meet the silicon carbide electric drive needs of 500 new energy vehicles.
Zhang Yao, general manager of Tianjing Intelligent, revealed at the press conference that through cooperation and verification with institutions such as the Chinese Academy of Sciences and the School of Physics and Electronic Engineering of Jiangsu Normal University, the equipment yield has been improved to more than 98%, and a 1,000-hour continuous cutting stability test has been completed, and the technical reliability has been authoritatively recognized.
In terms of equipment cost and price, Tianjing TJ320 reduces the cost to 1/10 to 1/20 of the industry average through modular design and localization of core components. It is worth mentioning that the equipment has received orders from customers in Europe and Southeast Asia, and it is expected that the global market share will exceed 30% in 2026. At present, the annual production capacity of Tianjing Intelligent Huai'an Production Base has reached 880 units, and the second phase of the project will be put into production in 2026.
The national standard in the field of integrated circuits led by CETC Chip was officially implemented
Recently, the national standard "Semiconductor Integrated Circuit-RF Transmitter/Receiver Test Method" jointly formulated by Southwest Design, a subsidiary of CETC Chip, was officially implemented.
This standard specifies the basic principles and test procedures for the electrical characteristics test methods of semiconductor integrated circuit RF transmitters and receivers. It is applicable to single-frequency conversion RF transmitters/receivers with receiving, transmitting, and integrated transmitting and receiving functions, marking a new step for the company in the standardization construction in the field of RF testing.
In the next step, EDEC Chip will keep up with the development trend of integrated circuits and industry pain points, continue to strengthen the research, compilation, implementation and promotion of relevant national standards, and contribute to the design standardization in the field of integrated circuits.
This standard specifies the basic principles and test procedures for the electrical characteristics test methods of semiconductor integrated circuit RF transmitters and receivers. It is applicable to single-frequency conversion RF transmitters/receivers with receiving, transmitting, and integrated transmitting and receiving functions, marking a new step for the company in the standardization construction in the field of RF testing.
In the next step, EDEC Chip will keep up with the development trend of integrated circuits and industry pain points, continue to strengthen the research, compilation, implementation and promotion of relevant national standards, and contribute to the design standardization in the field of integrated circuits.
With a total investment of over 1.1 billion, Zhihui Xinhui's "Digital Light Source Chip Advanced Packaging and Testing Base Project" settled in Lingang
It is reported that recently, Shanghai Zhihui Xinhui Microelectronics Co., Ltd. invested in the construction of the "Digital Light Source Chip Advanced Packaging and Testing Base Project" in the Shuyuan Industrial Zone of the Lingang New Area in Shanghai. It is mainly engaged in the production of digital car light modules. The total investment in the project exceeds 1.1 billion yuan.
It is understood that the project will be constructed in phases, and the civil construction will be completed in the first phase. The first phase plans to produce 1.2 million sets of digital car light modules per year; the second phase will increase production capacity by adding some bottleneck equipment and extending the equipment working hours. It plans to produce 1.8 million sets of digital car light modules per year. After the completion of this project, the annual production of digital car light modules will reach 3 million sets/year.
According to information, Shanghai Zhihui Xinhui Microelectronics Co., Ltd. was established in 2024 and is located in the Lingang New Area. The company was established with a capital of 30 million yuan from Shanghai Jinghe Optoelectronics and holds 100% of the shares.
Jingchi Electromechanical successfully developed a 12-inch silicon carbide crystal growth equipment using the resistance method
Recently, Zhejiang enterprise Jingchi Electromechanical Technology Co., Ltd. (hereinafter referred to as "Jingchi Electromechanical") officially announced that they have made new progress in 12-inch silicon carbide crystal growth technology and successfully developed a 12-inch silicon carbide crystal growth equipment using the resistance method. It is reported that the ingot has a perfect shape, and the surface micro-convexity is precisely controlled within 2.4mm. It has successfully broken through the technical barriers of multi-size growth on the same furnace, and achieved the same equipment. It can not only stably mass-produce eight-inch silicon carbide single crystals, but also has the ability to grow twelve-inch silicon carbide single crystals.
It is reported that Jingchi Electromechanical's equipment uses the resistive physical vapor transport (PVT) method to grow silicon carbide ingots. Through innovative structure and thermal field design, combined with advanced process control theory and automated control methods, it achieves uniform radial temperature and a wide range of precisely adjustable axial temperature gradients. This enables the equipment to accurately control process parameters during crystal growth and achieve highly intelligent operation. More importantly, the equipment can seamlessly "switch with one click" to produce 8-inch and 12-inch silicon carbide single crystals.
Compared with traditional 6-inch and 8-inch substrates, the 12-inch silicon carbide substrate material significantly expands the area on a single wafer that can be used for chip manufacturing. Under the same production conditions, this not only increases chip output, but also significantly reduces the unit chip manufacturing cost. The ingots grown by this equipment have perfect morphology, and the surface micro-convexity is precisely controlled within 2.4 mm. In addition, the furnace process of this equipment is stable, the operation method is simple, and it can be put into production quickly. The entire process flow is fully automated and controlled, making it suitable for industrial applications.
It is reported that Jingchi Electromechanical's equipment uses the resistive physical vapor transport (PVT) method to grow silicon carbide ingots. Through innovative structure and thermal field design, combined with advanced process control theory and automated control methods, it achieves uniform radial temperature and a wide range of precisely adjustable axial temperature gradients. This enables the equipment to accurately control process parameters during crystal growth and achieve highly intelligent operation. More importantly, the equipment can seamlessly "switch with one click" to produce 8-inch and 12-inch silicon carbide single crystals.
Compared with traditional 6-inch and 8-inch substrates, the 12-inch silicon carbide substrate material significantly expands the area on a single wafer that can be used for chip manufacturing. Under the same production conditions, this not only increases chip output, but also significantly reduces the unit chip manufacturing cost. The ingots grown by this equipment have perfect morphology, and the surface micro-convexity is precisely controlled within 2.4 mm. In addition, the furnace process of this equipment is stable, the operation method is simple, and it can be put into production quickly. The entire process flow is fully automated and controlled, making it suitable for industrial applications.
Maolai Optics’ precision optical components have been used in domestic lithography machines and related testing equipment.
Maolai Optics CEO Fan Yi disclosed at today's earnings briefing that in 2024, the company's downstream customer demand in the semiconductor field continued to rise, and some of the company's semiconductor products successfully crossed the R&D sample stage and entered mass production .
It is worth mentioning that Maolai Optics’ precision optical components have been used in domestic lithography machines and related testing equipment.
Regarding the latest progress of the current lithography machine-related R&D projects, Fan Yi said in response to questions from the reporter of the Science and Technology Innovation Board Daily, "So far, the company's lithography front-end defect optical measurement technology project has completed the process improvement and verification of the lithography machine UV detection system prototype. We are trying to conduct small-batch prototype trial production this year ."
This RF chip manufacturer completed a B+ round of financing of over 100 million yuan!
Recently, the intelligent communication positioning circle learned that Wuhan Guangju Microelectronics Co., Ltd. (hereinafter referred to as Wuhan Guangju) successfully completed its B+ round of financing. This round of financing was jointly invested by Wuhan Fangu, Hubei Railway Development Fund and other well-known industrial capital and investment institutions, with a total financing amount of 189 million yuan.