Chinese semiconductor thread II
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Qingting Optoelectronics 2D+3D advanced packaging volume inspection equipment shipped to leading domestic packaging and testing customers
QT successfully shipped the wafer-level 2D+3D mass inspection equipment Spectra-Wafer to a leading domestic packaging and testing customer. This milestone delivery demonstrates QT's deep technical accumulation in the field of advanced packaging, and also marks that the product has been successfully recognized by leading customers.
In the context of the complex and ever-changing global market environment, Qingting Optoelectronics insists on technological innovation as the core driving force and is committed to providing customers with domestic alternative products that are comparable to and surpass imported equipment. The Spectra-Wafer equipment delivered this time integrates high-speed, high-precision 2D+3D systems and AI intelligence and other technical features, representing the first-line level in the industry, and the product performance has established a good reputation among a series of leading customers.
Spectra-Wafer Product Highlights
Based on the self-developed 3D optical system and AI intelligent algorithm, the Spectra series of 2D+3D mass inspection equipment launched by Qingting Optoelectronics fully leverages the synergy advantages of optomechanical, electrical, software and computing, and better provides more advanced inspection equipment and strong technical support for the mass production inspection of WLP and 2.5D/3D mid-bump.
2D Vision System: Equipped with AI2.0 Detection Network
Spectra-Wafer's 2D vision system is equipped with a high-speed, large-surface, low-noise industrial camera and a high-power lighting system to accurately capture tiny defects. At the same time, the application of AI2.0 deep neural network technology has greatly reduced the demand for a large number of defect samples in traditional AI recognition networks, and can be quickly put online and greatly improve the recognition and classification accuracy and efficiency of complex defects.
3D Vision System: High-speed and high-precision 3D measurement
Spectra-Wafer's 3D vision system is equipped with an exclusive self-developed high-speed and high-precision 3D measurement module, which is deeply optimized for 3D imaging of bumping, surpassing the technical indicators of imported equipment of the same model, and providing reliable guarantee for the measurement of key parameters in advanced packaging.
Comprehensive testing capabilities
With full function coverage, it can accurately identify scratches, dirt, bubbles, cracks, measure key parameters such as bump height and bump coplanarity, and provide all-round and high-precision detection support for quality control of advanced packaging processes.
With the end of Moore's Law and the strong rise in demand for computing chips such as GPU and HBM, a new generation of 2.5D/3D advanced packaging technology represented by the COWOS process has emerged. Advanced packaging has entered the era of three-dimensional stacking, and 3D detection of interconnected bumps between wafers is crucial. An abnormal bump may cause the failure of an expensive chipset, and the number of bumps on each wafer often exceeds millions or even tens of millions. The Spectra series of equipment from Qingting Optoelectronics has solved a series of technical problems related to 3D wafer quantity detection, taking a solid step towards domestic substitution of such equipment.
Peking University's pioneered "subverting traditional crystal manufacturing methods"
As the global silicon-based integrated circuit industry enters the "post-Moore era", chip performance improvement faces huge challenges. The team led by Liu Kaihui of Peking University overturned the traditional crystal manufacturing method and pioneered a new paradigm of "lattice mass transfer-interface growth", which for the first time realized the universal preparation of rhombohedral phase 3R-TMDs single crystals with controllable layer number and stacking structure.
The research team fully dissolved the chalcogenide elements into the alloy substrate in the form of single-atom supply. The reactive atoms continuously transferred mass in the metal lattice through the concentration and chemical potential gradient, and epitaxially precipitated a new layer at the interface between the substrate and TMDs. By continuously "lifting" the formation layer, the crystal grows upward like a "bamboo shoot", driven by its own structure, completely subverting the traditional crystal growth model.
This innovative method has three major advantages: ensuring the rapid growth and uniform arrangement of the crystal structure; effectively avoiding the accumulation of defects; and increasing the purity of various two-dimensional materials such as graphite and molybdenum sulfide by 10-100 times, greatly improving the controllability of the crystal structure.
This major achievement, known as a "new paradigm for preparing biologically grown crystals," has laid a solid foundation for the research and development of the next generation of high-performance electronic and photonic chips.
The research team fully dissolved the chalcogenide elements into the alloy substrate in the form of single-atom supply. The reactive atoms continuously transferred mass in the metal lattice through the concentration and chemical potential gradient, and epitaxially precipitated a new layer at the interface between the substrate and TMDs. By continuously "lifting" the formation layer, the crystal grows upward like a "bamboo shoot", driven by its own structure, completely subverting the traditional crystal growth model.
This innovative method has three major advantages: ensuring the rapid growth and uniform arrangement of the crystal structure; effectively avoiding the accumulation of defects; and increasing the purity of various two-dimensional materials such as graphite and molybdenum sulfide by 10-100 times, greatly improving the controllability of the crystal structure.
This major achievement, known as a "new paradigm for preparing biologically grown crystals," has laid a solid foundation for the research and development of the next generation of high-performance electronic and photonic chips.
Total investment of 500 million yuan! Silicon State Semiconductor IC packaging and testing manufacturing project signed
On March 27, a signing ceremony was held for the commissioning of the Silicon State Semiconductor Integrated Circuit Packaging and Testing Manufacturing Project in Huishan Economic Development Zone.
Silicon State Semiconductor, which has been deeply involved in the semiconductor packaging and testing track for ten years, has built a "packaging and testing technology chain" covering the entire process from wafer testing to module assembly. With the "double certification" qualifications of national high-tech enterprises and provincial specialization, relying on import and export qualifications and public service platforms, engineering research centers, and corporate technology centers, with "50+" core technology patents and "200+" corporate service performance, it continues to lead the packaging and testing track and establish a leading position in industry technology.
"Wuxi is one of the gathering places for enterprises in the integrated circuit industry, and Huishan Economic Development Zone has done a lot of work in enterprise services and factor guarantee, which is an important reason for our determination to settle down." Mu Yunfei, chairman of Silicon State Semiconductor, said that the project plans to invest a total of more than 500 million yuan, with a layout of more than 17,000 square meters of R&D and manufacturing bases, and will create a "design verification + process optimization + mass production service" three-in-one packaging and testing innovation platform to form a strong radiation driving effect. At present, the project has completed industrial and commercial registration and team formation, and is scheduled to be put into production this month. After reaching full production, the annual invoiced sales will exceed 500 million yuan, and the annual tax payment will reach 25 million yuan.
Where can I read the review about the Japanese semi?