Chinese semiconductor thread II

tokenanalyst

Brigadier
Registered Member

Kaishitong Ion Implantation Matrix​

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Kaishitong leads the industrialization of domestic integrated circuit ion implanters. The company has developed and mass-produced a series of products such as low-energy, large-beam ion implanters and high-energy ion implanters, filling the domestic gap. It is at the forefront of domestic production in terms of equipment installed capacity, performance and stability, and has achieved full coverage of various chip processes such as logic, storage, power, CIS image sensors, etc.

At this year's SEMICON China exhibition, Kaishitong brought a full range of integrated circuit ion implanter product matrix. Through long-term technical research and mass production applications, Kaishitong ion implanters have been continuously upgraded and iterated in key technologies such as ion source, optical system, wafer transmission, particle contamination control, and software automation. Key performance indicators have been continuously improved, and have been widely recognized by wafer fab customers.

In terms of technological breakthroughs, Kaisitong has previously achieved the industrialization of domestic ultra-low temperature ion implantation machines, breaking the foreign technology monopoly. Recently, the company has successfully obtained the verification and acceptance of the new model CIS ion implantation machine, achieving an important breakthrough in the domestic CIS ion implantation machine and promoting the domestic ion implantation machine technology research and development and industrialization to a new level.

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sunnymaxi

Major
Registered Member
With the advent of Sicarrier , is it safe to say applied material, lam research and KLA tencor can say good bye to China forever?
SiCarrier revealed all missing pieces of entire domestic supply chain and mentioned 28nm-5nm nodes.

alongside other top domestic players and SiCarrier are going to dominate Mainland market, looks like American SME manufacturer fate has been sealed.
 

latenlazy

Brigadier
SSMB-EUV ?
How does this apply to chip production?

A trillion times brighter than the sun: Beijing builds most powerful X-ray light source​

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China is finalizing construction on what will be the world’s brightest X-ray light source. Located about 30 miles (50 km) north of Beijing, the High Energy Photon Source (HEPS) is expected to begin operations later this year. This advanced facility will power research across materials science, biomedicine, and physics.

HEPS is designed to generate beams that are a trillion times brighter in terms of photon density than the surface of the sun. Its precision and focus will surpass similar facilities in Europe, Asia, and the U.S., according to the Chinese Academy of Sciences’ Institute of High Energy Physics, which leads the project.

“Once HEPS reaches its designed brightness, it will be capable of revealing the microscopic world in unprecedented detail,” said Pan Weimin, project director at the institute. “It offers a powerful tool to manipulate matter and observe its entire life cycle.”

The X-ray facility has started light commissioning, a crucial phase for testing and fine-tuning the system with real photon beams. This step ensures the machine is ready for trial operations.
This is not the SSMB facility. There are lots of different synchrotrons. So far they’re all for research purposes.
 

tokenanalyst

Brigadier
Registered Member
This must be the first self-described ALE (Atomic Layer Etching) tool in China

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Yanwei (Jiangsu) Semiconductor Technology Co., Ltd. (Yanwei Semiconductor for short), headquartered in Wuxi, has a multinational R&D team that brings together the world's top talents in the field of thin film deposition equipment. The core members are led by more than 10 overseas doctors, five of whom have been selected for the national talent program. The company focuses on high-end ALD, PECVD and special epitaxial equipment technologies, and produces products with independent intellectual property rights and international competitiveness, covering core technologies such as tALD, PEALD, SI EPI, SiC EPI, PECVD, etc. The products are widely used in high-end integrated circuits, power devices, RF components and advanced packaging fields. Yanwei Semiconductor has created a service system covering the entire life cycle of equipment, from process debugging, technical training to 24-hour rapid response, relying on a precision parts management system and a stable supply chain to ensure the efficient operation of customer production lines.​
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interestedseal

Junior Member
Registered Member
This must be the first self-described ALE (Atomic Layer Etching) tool in China

View attachment 149113


Yanwei (Jiangsu) Semiconductor Technology Co., Ltd. (Yanwei Semiconductor for short), headquartered in Wuxi, has a multinational R&D team that brings together the world's top talents in the field of thin film deposition equipment. The core members are led by more than 10 overseas doctors, five of whom have been selected for the national talent program. The company focuses on high-end ALD, PECVD and special epitaxial equipment technologies, and produces products with independent intellectual property rights and international competitiveness, covering core technologies such as tALD, PEALD, SI EPI, SiC EPI, PECVD, etc. The products are widely used in high-end integrated circuits, power devices, RF components and advanced packaging fields. Yanwei Semiconductor has created a service system covering the entire life cycle of equipment, from process debugging, technical training to 24-hour rapid response, relying on a precision parts management system and a stable supply chain to ensure the efficient operation of customer production lines.​
View attachment 149114

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SiCarrier’s first etch tool (Wuyishan 1) is plasma ALE
 

gotodistance

New Member
Registered Member
Hyundai Motor Securities in Korea has just dropped several shocking pieces of news.

Review of Japanese and Taiwanese companies

Chinese Foundry Companies Entering the Market with 6 New Companies in addition to the Existing 3 / SMIC's 5mm Products to be Produced by Huawei, Sicarrier

Mass production through collaboration

5nm products are likely to be installed in Huawei's new inference chip, Ascend 910C/This product may also be installed in HBM2e, etc.

CXMT succeeded in developing the 15nm process and started mass production of LPDDRS products, etc. CXMT prepares for mass production of HBM3e in 2027

YMTC plans to enter the DRAM market through mass production of LPDDR5 products in 2026

A new DRAM company other than CXMT is expected to emerge in China

Deepseek, self-driving cars, robotics, and foldable smartphones are all being completed at a level that far exceeds market expectations, and the growth of Chinese semiconductor companies is also exceeding market expectations. In particular, Chinese foundry companies have all built 12-inch fabs with a monthly capacity of 10K-60K due to the difficulty in securing 8-inch equipment amid the continuous establishment of new companies. Since products that would be made on an 8-inch scale are being made on a 12-inch scale, they are being supplied at a 20-30% discount compared to Taiwanese and Korean industries. In the case of Korean and Taiwanese 8-inch foundry companies, even if they turn a profit due to low depreciation expenses, it seems inevitable that they will incur an EBITDA deficit in the near future. In addition, SMIC is mass-producing 7nm products on the N+2 process using DUV, and recently it is making 5mm products through a +3 plant. Of course, since they are making 5mm with DUV, not EUV, the defect rate is high, and the eastern part has a negative effect on price competitiveness, but they are offsetting this with government subsidies, so China's move cannot be taken lightly. It appears that 5mm products are being produced through collaboration with equipment companies called SMIC, Huawei Hisilicon, and Sicamer.

SMIC's 7nm Capa is estimated at 10K per month, and Som Capa at 5K per month. The amount of semiconductors supplied is also limited due to low cost. The main products are understood to be Kirin 90005 supplied to Huawei smartphones and Ascend 910B, an inference semiconductor. In particular, Ascend 910B was used as DeepSeek's inference service chip. Meanwhile, it seems that it will be applied to the 5m Ascend 910C, which is currently being ramped up. There are rumors that Ascend 910C will be equipped with HBM2. This is because it is difficult to secure HBM3 due to US sanctions.

However, since Chinese DRAM companies are developing HBM3 and HBM2, it seems that Chinese HBM will be mounted on the Hanwei Ascend Series within the next 2-3 years. Currently, Chinese DRAM companies are rapidly encroaching on the market centered on LPDDR4 by CXMT. It is estimated that 85% of CXMT's production is LPDDR4, and Korean DRAM companies are rapidly leaving the LP DDR4 market. CXMT is currently known to have succeeded in developing a 15cm process and is producing LPDDR5 (16Gb) and PC DDR5 (16Gb) products, and is planning to mass produce HBM3 in 2026 and HBM3 in 2027. Of course, even if CXMT mass-produces HBM, the possibility of Chinese HBM being mounted on AI Servers, where information security issues are important, is slim. In addition, due to US sanctions, Korean companies are unable to directly supply HBM3 to China. Given that Chinese companies are indirectly supplying HBM to NVIDIA H20, the impact of Chinese companies’ mass production on Korean companies is expected to be minimal. Meanwhile, during our visit to Taiwan Supply Chain, we were able to confirm companies in China that are preparing to enter the DRAM market for the first time. For example, YMTC, which succeeded in mass producing 294 layers in the 3D NAND market through its unique technology called Xtacking, is preparing to enter the DRAM market. YMTC is understood to be planning to mass produce LPDDR5 products in 2006. In particular, although XMC, a subsidiary of YMTC, is a foundry company, it is likely that YMTC will enter the HBM market in the future as it has good TSV technology.

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