Chinese semiconductor thread II

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New breakthrough in semiconductor testing equipment: Angke releases V9000 series fully automatic aging tester


Semiconductor testing equipment is a key link in chip manufacturing. It provides solid technical support for chip quality control and performance optimization throughout the entire life cycle of chips from design to application. According to data from SEMI (Semiconductor Industry Association), sales of semiconductor testing equipment are expected to grow by 7.4% in 2024 to US$6.7 billion. The growth of this market is then expected to accelerate in 2025, with sales of testing equipment surging by 30.3%.

Angke Technology has keenly perceived the market demand in the field of semiconductor testing, and quickly launched a strategic layout to comprehensively innovate and upgrade test equipment. Fu Guo pointed out that Angke Technology has continuously improved the layout of the test equipment industry chain in recent years, and its products cover all chip testing links from CP (wafer testing), FT (finished product testing after packaging), SLT (system-level testing) to Burn-in (aging testing), helping to promote the localization of chip testing equipment.
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At this exhibition, Fu Guo specifically mentioned the industry's first fully automatic aging tester (ABI-Automatic Burn-In) V9000 series products released by Angke Technology. He said that the V9000 series test sorting machine launched by Angke Technology can be used for Burn-In reliability testing of products such as power modules with high reliability requirements, AI large model training chips SoC, GPU, CPU, and automotive-grade intelligent driving SoC. It can also be used for system-level testing (System Level Testing, SLT) of various SoCs, large-capacity storage chips (eMMC, UFS, LPDDR, etc.), RF chips and modules.

According to Fu Guo, the V9000 series revolutionized the Burn-In test "all-online" solution, which included the entire Burn-In test process into the automatic control process, avoiding the unrecorded, untraceable and potential ESD risks caused by manual intervention. At the same time, Onco's original TempJIT TM high-power aging test temperature control technology can support a single DUT power of up to 1500W, which is more than 1.5 times the maximum power support capacity of current traditional aging test equipment.


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Star Technology completed nearly 300 million yuan in financing, setting a new record for annual single financing in the domestic semiconductor equipment field​


According to Pudong Science and Technology Innovation Group, Guangdong Star Technology Equipment Co., Ltd. ("Star Technology") recently announced the completion of nearly 300 million yuan in Series A financing, led by Pudong Science and Technology Innovation Group and Haiwang Capital. After this round of financing, Star Technology's registered capital increased from 197 million yuan to 294 million yuan, an increase of 49%, setting a new record for annual single financing in the domestic semiconductor equipment field.

In this round of financing, Star Technology will focus on three major directions: technological breakthroughs, capacity expansion and ecosystem construction. The first is to develop 2.5D/3D packaging and testing equipment to break through nano-level precision control technology. The second is to plan to achieve mass production and delivery of key equipment in 2025. The third is to join hands with Tencent Cloud to build an industrial Internet platform to connect 500+ semiconductor industry chain companies.

It is reported that Starry Sky Technology has launched a series of world-leading equipment such as large chip packaging lithography machines and silicon wafer/chip high-precision bonding machines, and its products have been recognized by many domestic leading customers. In 2025, Starry Sky Technology will focus on core key technologies, continue to maintain high-intensity product research and development investment, promote more breakthroughs in domestic substitution of high-end equipment manufacturing, and contribute to the modern industrial system.
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Shaoguang Core Material Photomask Substrate Manufacturing Base Project Started​

The groundbreaking ceremony for the high-precision semiconductor and high-generation FPD photomask substrate manufacturing base project of Shaoguang Core Materials, an investment company of Changcai Zhixin Fund under Changtou Holding Group, was held.

Changsha Shaoguang Core Material Technology Co., Ltd. is the first company in China to achieve a breakthrough in semiconductor quartz photomask substrate technology. It currently has the capacity to mass-produce photomask substrates at a 90-nanometer process node, and is the only company in China to achieve mass production in this field. Photomask substrates are one of the key materials for the manufacture of semiconductor chips and flat panel display panels, and directly determine the accuracy and performance of chips and display devices. The "High-precision Semiconductor Photomask Substrates and High-Generation FPD Photomask Substrates Manufacturing Base Project" invested in this project is committed to the research and development and localization of photomask substrates for high-end semiconductor and display industries. It will overcome the technical difficulties in the manufacture of chips at process nodes below 28 nanometers and photomask substrates for 6/8.6-generation flat panel display panels, and realize the localization of high-end photomask substrate materials.

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GaTe Semiconductor has obtained a patent for a HVPE large-size GaN wafer gallium boat reactor that can increase the growth size of GaN wafers​


Information from the National Intellectual Property Administration shows that GaTe Semiconductor Technology (Tongling) Co., Ltd. has obtained a patent called "A HVPE large-size gallium nitride wafer gallium boat reactor", with authorization announcement number CN 222684835 U and application date of March 2024.
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The patent abstract shows that the utility model discloses a HVPE large-size gallium nitride wafer gallium boat reactor, including: a gallium boat; a gallium reaction chamber; a main air inlet pipe; a secondary air inlet; a gas flow port, the gas flow port is opened in the multi-layer reaction chamber except the bottom layer of the reaction chamber; a gallium reaction outlet, the gallium reaction outlet is opened at the bottom of the gallium reaction chamber; a mixing chamber, the mixing chamber is arranged inside the gallium boat and located at the bottom of the gallium reaction chamber; a main reaction outlet, the main reaction outlet is opened in the bottom central area of the mixing chamber; a secondary reaction outlet, the secondary reaction outlet is opened in the bottom edge area of the mixing chamber; a main air outlet pipe, one end of the main air outlet pipe is connected to the bottom of the mixing chamber to separate the main reaction outlet and the secondary reaction outlet, and the other end is connected to the bottom center of the gallium boat; a secondary air outlet pipe. The beneficial effect of the utility model is that the gases discharged from the main and secondary air outlet pipes can be evenly deposited on the substrate surface, which can increase the growth size of gallium nitride wafers.

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How does this apply to chip production?

A trillion times brighter than the sun: Beijing builds most powerful X-ray light source​

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China is finalizing construction on what will be the world’s brightest X-ray light source. Located about 30 miles (50 km) north of Beijing, the High Energy Photon Source (HEPS) is expected to begin operations later this year. This advanced facility will power research across materials science, biomedicine, and physics.

HEPS is designed to generate beams that are a trillion times brighter in terms of photon density than the surface of the sun. Its precision and focus will surpass similar facilities in Europe, Asia, and the U.S., according to the Chinese Academy of Sciences’ Institute of High Energy Physics, which leads the project.

“Once HEPS reaches its designed brightness, it will be capable of revealing the microscopic world in unprecedented detail,” said Pan Weimin, project director at the institute. “It offers a powerful tool to manipulate matter and observe its entire life cycle.”

The X-ray facility has started light commissioning, a crucial phase for testing and fine-tuning the system with real photon beams. This step ensures the machine is ready for trial operations.
 

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3D Heterogeneous Integration of Silicon Nitride and Aluminum Nitride on Sapphire toward Ultra-wideband Photonics Integrated Circuits.​

Abstract​

Extending two-dimensional photonic integrated circuits (PICs) to three-dimensional (3D) configurations promises great potential for scaling up integration, enhancing functionality, and improving performance of PICs. Silicon-based 3D PICs have made substantial progress due to CMOS compatibility. However, the narrow bandgap of silicon (1.1 eV) limits their use in short-wavelength applications, such as chemical and biological sensing, underwater optical communications, and optical atomic clocks. In this work, we developed a 3D photonics platform by heterogeneously integrating silicon nitride (SiN) and aluminum nitride (AlN) PICs on sapphire (Al2O3). The broadband transparency of these materials allow our platform to operate over a multi-octave wavelength ranging from ultraviolet to infrared. Leveraging this platform, we demonstrated efficient optical nonlinearity in an AlN microcavity, low-loss and tunable SiN waveguide-based optical components, and optical linking between AlN and SiN PICs layers in the visible and near-infrared spectrum, hinting at potential applications in integrated quantum systems. Our work presents an ultra-wideband 3D PICs platform, providing new opportunities for broadband and short-wavelength applications of PICs.

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Domestic automotive chips break through: Tsinghua Tongxin THA6×HighTec reconstructs the development paradigm of automotive electronics​


Tinghua Unigroup and HighTec jointly announced that HighTec's automotive-grade compiler has completed full adaptation of Tsinghua Unigroup's THA6 Gen2 series products. This cooperation not only achieves full-stack support from instruction set optimization to functional safety, but also deeply integrates domestic high-end automotive chips with world-class development tools, providing a more efficient and secure development environment for global automotive electronics developers.

In the current upsurge of the automotive electronics industry's transformation to software-defined vehicles (SDV), the collaborative innovation of chips and development tools is particularly important. A complete development tool chain is a core component of the chip ecosystem, which directly affects the market competitiveness and application scope of chip products.

HighTec: Industry leader in automotive-grade compilers​

As a world-renowned automotive-grade compiler supplier, HighTec's core products enjoy a high reputation in the industry for their excellent code optimization capabilities and comprehensive support for multi-core architectures. HighTec compilers are widely used in the development of automotive electronic core controllers and have been recognized by major global automakers and Tier 1 suppliers.

The core advantages of HighTec compiler include:
  • Advanced technical architecture : Based on GCC and LLVM technology, it supports multiple programming languages (C/C++, Rust) and rich core architectures (Tricore, Arm, RISC-V, GTM/MCS, etc.)​
  • Deep optimization capability : Multi-level optimization for automotive-grade MCUs to maximize chip performance and improve code execution efficiency​
  • High-level safety certification : meets ISO 26262 ASIL D standard to ensure the accuracy and stability of compilation results​
  • Perfect ecological cooperation : Establish close cooperation with mainstream AUTOSAR and debugger suppliers​

Tsinghua Tongxin THA6 Gen2: A technological breakthrough in domestic automotive chips​

The Tsinghua Tongxin THA6 Gen2 series represents a major technological breakthrough in domestic automotive chips and is the first ASIL D-level MCU in China to use the Arm Cortex-R52+ core. This series of products fully matches the world's first-class level in terms of real-time performance, security and reliability, and is suitable for key application scenarios such as automotive power, chassis, body and intelligent driving.

Technical features of the THA6 Gen2 series include:
  • High-performance real-time control : 400MHz high-frequency CPU, using Armv8 architecture instruction set, integrating the latest GTM 4.1 module, supporting high-precision PWM output​
  • Comprehensive security assurance : Passed ISO 26262 ASIL D process and product dual certification, ISO/SAE 21434 cybersecurity certification, built-in HSM security module​
  • Strict automotive quality : meets AEC-Q100 Grade 1 reliability standards, and all production plants are IATF 16949 certified​

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The Shenzhen government include lithography in their R&D plans.​

Notice of Shenzhen Science and Technology Innovation Bureau on soliciting candidate topics for Shenzhen Key Industry R&D Plan in 2025 (first batch)​

In order to create the best scientific and technological innovation ecology and talent development environment, promote the city's industrial scientific and technological innovation, and enhance the city's systematic scientific and technological research capabilities, our bureau will organize and implement the Shenzhen Key Industry R&D Plan for 2025. We are now soliciting candidate topics from our city's enterprises, universities, research institutions, medical and health institutions, etc. The collected topics will serve as a reference for the compilation of the Shenzhen Key Industry R&D Plan Guide for 2025.

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Shenyang promotes 74 integrated circuit equipment industry projects this year​


Since March, Shenyang's integrated circuit equipment industry has made frequent moves, with a number of major projects started and completed one after another, attracting close attention from the industry. It was learned from the Shenyang Development and Reform Commission that the city will coordinate the promotion of 74 key projects in the field of integrated circuit equipment this year, laying a solid foundation for the high-quality development of the industry, by focusing on the important nodes of extending, supplementing and strengthening the supply chain, and focusing on the important links of planning and reserve, signing and landing, starting construction, and completing and putting into production.

Semiconductor quartz components play a vital role in the integrated circuit equipment industry. With the continuous advancement of integrated circuit manufacturing technology, the demand for high-purity quartz components continues to grow. On March 25, the world-renowned technology company Heraeus Group completed and put into production the Heraeus Quartz Shenyang New Factory, the largest semiconductor project in China. The new factory mainly produces high-purity and ultra-high-purity synthetic quartz series products for semiconductors, and has set up an innovation center to meet customers' latest needs for high-end products.

"Investing in Shenyang is a key layout for us, and we will continue to increase investment in this project in the future." Frank Stitz, member of the board of directors and chief operating officer of Heraeus Group, said that with the completion of the new factory as a starting point, Heraeus will continue to focus on the industrialization of semiconductor devices and integrated circuits, build an advanced manufacturing base and innovation highland, and drive the development of a full-ecological semiconductor industrial park including semiconductor research and development, industrialization, and supporting raw and auxiliary materials and consumables.

For the development of the integrated circuit equipment industry in Shenyang and even Liaoning, the new factory's new voyage is undoubtedly an important positive, and it is of far-reaching significance for expanding the scale of the industry and enhancing the resilience of the industrial chain. According to the relevant person in charge of the Shenyang Development and Reform Commission, after years of planning and layout, Shenyang has established an integrated circuit equipment industry cluster featuring complete machines and components, and has achieved a number of major landmark achievements. Leading companies such as Tuojing Technology, Xinyuan Microelectronics, Fuchuang Precision, Shenyang Keyi, Heyan Technology, and Siasun Semiconductor continue to grow. Last year, the output value of Shenyang's integrated circuit industry increased by more than 45%.

Based on the overall layout of the city's integrated circuit industry of "one main and two wings", the Shenyang Municipal Development and Reform Commission has gone all out to implement the chain extension, chain supplement and chain strengthening project, with project construction as the support, to accelerate the promotion of industrial development to a higher level. As the core area, the "Northern Core Valley" in Hunan focuses on thin film deposition and other equipment and vacuum manipulators and other parts industries; the Shenbei Industrial Area focuses on forming distinctive advantages in the fields of back-end scratching and grinding equipment, MCU (microprocessor) design and parts; the Tiexi Industrial Area gathers internationally renowned companies such as Hanko and Heraeus, and has become an important domestic semiconductor quartz parts industry area. With leading enterprises as the driving force and releasing the advantages of core products, Shenyang strives to attract key enterprises and supporting projects from Beijing, Shenzhen, Suzhou, Kunshan and other places to settle in. At present, 74 key projects have been included in the annual promotion plan, with an estimated total investment of 38.2 billion yuan.

At the beginning of this month, the Shenyang Xinyuan Micro High-end Wafer Processing Equipment Industrialization Innovation Road Project with a total investment of 1 billion yuan started construction. The project mainly develops and produces front-end and back-end coating and developing equipment. After completion, it will effectively promote the domestic photolithography process coating and developing equipment to increase market share.

On March 17, the construction of the 2 billion yuan Tuojing Technology High-end Semiconductor Equipment Industrialization Base project was started. Lv Guangquan, chairman of Tuojing Technology Co., Ltd., said: "We feel Liaoning's emphasis on strategic emerging industries, so we are determined to expand investment in Shenyang. After the base is completed, the production capacity can be increased by 4 times, which can better meet the needs of domestic integrated circuit companies for high-end thin film equipment."


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