A laser plasma type extreme ultraviolet lithography light source system
Chinese semiconductor thread II
- Thread starter vincent
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A device and method for reducing stress of extreme ultraviolet multilayer films
UPrecision UltraPrecise bonding. for GPUs, 3D Dram, Cowos, Chiplet and so on
Huazhuo Precision Technology launches a series of high-end equipment to help localize HBM chip manufacturing equipment.
In the era of big models, it is a consensus in the industry that AI chips should be equipped with HBM ( high bandwidth memory chip ) . At a time when the demand for AI computing power is exploding, HBM has become a " performance multiplier " in the fields of AI chips, data centers, and supercomputing with its 3D stacking architecture and ultra-high bandwidth performance . However, HBM's core manufacturing technology has long been monopolized by overseas giants, and high-end equipment is almost entirely dependent on imports.
Beijing Huazhuo Precision Technology Co., Ltd. (hereinafter referred to as " Huazhuo Precision " ) has independently developed a series of high-end equipment for the core links of HBM chip manufacturing, including: hybrid bonding equipment ( UP-UMA ® HB300) , melt bonding equipment ( UP-UMA ® FB300 ) , core-particle bonding equipment (UP-D 2W-HB) , laser stripping equipment (UP-LLR-300) , and laser annealing equipment (UP-DLA-300) , breaking through the " bottleneck " dilemma of domestic HBM chips and injecting hard-core momentum into the independence of China's storage industry.
HBM achieves a bandwidth jump of several TB per second by vertically stacking multiple layers of DRAM chips and interconnecting them with logic chips, but its manufacturing faces multiple technical barriers:
1) Accuracy limit: Chip stacking requires sub-micron or even tens of nanometers alignment, otherwise it will lead to interconnection failure or signal attenuation;
2) Process complexity: Hybrid bonding requires atomic-level fusion of the dielectric layer and the metal layer, and requires extremely high process stability;
3) Process quality limit: DRAM is the basis of HBM . HBM has extremely high requirements for DRAM chip quality and reliability. In particular, the crystal quality of the SNC structure plays a decisive role in the chip yield. The laser annealing process can directly achieve Void Free , greatly improving the yield;
4) Yield and cost challenges: Ultra-thin chip stacking poses challenges to both yield and cost. Chip bonding and laser stripping bring more possibilities for overall process optimization.
5) Large-scale mass production: As the number of HBM3/4 stacking layers increases to more than 12 layers, the yield of traditional thermal compression bonding drops sharply, and hybrid bonding becomes the only technical path.
Interesting, this is a commercial company.
Lithography machine displacement measurement system
Not sure if this is posted yet.
Innoscience is known for its GaN chips. It's also known for getting sued by US based EPC and German based Infineon for patent stuff.
Well today the patent appeal board in the US sided with Innoscience against EPC. This is quite a big deal coz it means the company now has a genuine chance of making it big. Before there was skepticism coz of patents but at least one of those things holding the company back is probably no longer an issue
An immersion head detection device and method for an immersion lithography machine
An illumination system and a photolithography machine
This guys looks like they either refurbish lithography machines or/and are a supplier for domestic immersion machines. Qier Electromechanical is the company that is supplying the immersion head for domestic immersion lithography machines but looks like this guys offer other subsystems.
