Chinese semiconductor thread II
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ACM Shanghai single wafer high temperature SPM equipment passed verification
ACM Semiconductor Equipment (Shanghai) Co., Ltd. (hereinafter referred to as "ACM Shanghai") a leading supplier of wafer process solutions for semiconductor front-end and advanced packaging applications, today announced that its single-wafer medium/high temperature sulfuric acid peroxide mixture (SPM) equipment has successfully passed high-volume manufacturing verification by a logic chip manufacturer.
ACM Semiconductor Equipment (Shanghai) Co., Ltd. (hereinafter referred to as "ACM Shanghai") a leading supplier of wafer process solutions for semiconductor front-end and advanced packaging applications, today announced that its single-wafer medium/high temperature sulfuric acid peroxide mixture (SPM) equipment has successfully passed high-volume manufacturing verification by a logic chip manufacturer.
Keger Precision Machinery: Jointly applied for the invention patent of "Printing, Inspection and Labeling Machine" with Huawei, which is now in the substantive examination stage
According to the invention patent application information published by the State Intellectual Property Office, there is an invention patent application with application publication number CN119450971A, which shows that Keger Precision Machinery and Huawei jointly applied for an invention patent.
The present invention relates to the field of PCB mounting technology, and specifically discloses a printing, inspection and pasting integrated machine, including: a mainboard conveying device, used to supply the mainboard; a sub-board production line, including a sub-board feeding device for supplying the sub-board, a printing press for printing the sub-board, a printing feed conveying device for conveying the sub-board from the sub-board feeding device to the printing press, a lateral transfer manipulator for transferring the sub-board from the sub-board feeding device to the printing feed conveying device, and a printing discharge conveying device for conveying the sub-board delivered by the printing press to a printing discharge conveying device close to the mainboard conveying device; a mounting mechanism, the mounting mechanism is used to mount the sub-board on the printing discharge conveying device onto the mainboard of the mainboard conveying device. The printing, inspection and pasting integrated machine provided by the present invention can cooperate to solve the problems of low compactness of equipment structure and overly complicated production process in the existing mounting process.
According to the invention patent application information published by the State Intellectual Property Office, there is an invention patent application with application publication number CN119450971A, which shows that Keger Precision Machinery and Huawei jointly applied for an invention patent.
The present invention relates to the field of PCB mounting technology, and specifically discloses a printing, inspection and pasting integrated machine, including: a mainboard conveying device, used to supply the mainboard; a sub-board production line, including a sub-board feeding device for supplying the sub-board, a printing press for printing the sub-board, a printing feed conveying device for conveying the sub-board from the sub-board feeding device to the printing press, a lateral transfer manipulator for transferring the sub-board from the sub-board feeding device to the printing feed conveying device, and a printing discharge conveying device for conveying the sub-board delivered by the printing press to a printing discharge conveying device close to the mainboard conveying device; a mounting mechanism, the mounting mechanism is used to mount the sub-board on the printing discharge conveying device onto the mainboard of the mainboard conveying device. The printing, inspection and pasting integrated machine provided by the present invention can cooperate to solve the problems of low compactness of equipment structure and overly complicated production process in the existing mounting process.
Signed a contract with a top packaging factory, PrecisioNext's mass transfer technology has set off a technological revolution in wafer-level packaging and panel-level packaging
PrecisioNext Intelligence and a top packaging company have reached a strategic cooperation agreement on its mass transfer panel-level packaging equipment (FOPLP) XBonder Pro. This will be the first large-scale application of mass transfer technology in the field of IC packaging, and will set off a technological revolution in the field of wafer-level packaging and panel-level packaging. PrecisioNext is also cooperating with one of the world's leading packaging companies and a world-leading power device company on the application of XBonder Pro in wafer-level packaging.
PrecisioNext Intelligence and a top packaging company have reached a strategic cooperation agreement on its mass transfer panel-level packaging equipment (FOPLP) XBonder Pro. This will be the first large-scale application of mass transfer technology in the field of IC packaging, and will set off a technological revolution in the field of wafer-level packaging and panel-level packaging. PrecisioNext is also cooperating with one of the world's leading packaging companies and a world-leading power device company on the application of XBonder Pro in wafer-level packaging.
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