Chinese semiconductor thread II

tphuang

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The new Kirin 9020 is 140.5 mm2 -> 422 dies/wafer

Assuming a yield of 85% it means about 3.5M phones per 10K wafers, i.e. 40M phones/year, with 10K wpm of dedicated capacity.

We don't know current SMIC capacity at 7nm, it could be anything between 15K and 25K wpm or even 30Kwpm in the most optimistic case, but Kirin is only one of the many chips that SMIC has to fab at 7nm. With TSMC banned for advanced nodes, currently SMIC 7nm is a capacity bottleneck. Situation will improve when SMEE litho machines reach 7nm. The other Chinese SME players should be more or less already there.
SMIC already has all the ASML lithography machines it needs for 70k wpm. The question is other tools
Rumours circulating on domestic social media...

View attachment 146896
I've had to resize your photo because it is huge. Please do this in the future or I'm going to have to ban you from this thread.

Also for this news, I just saw this as a social media posting, i wouldn't get too excited yet.
 

tokenanalyst

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Zhejiang and Garen Semi progress in Gallium Oxide ingot, wafer and equipment.​


Professor of Zhejiang University and chairman of Hangzhou Gallium Semiconductor Co., Ltd., delivered a keynote speech on "Progress in Large-Size High-Quality Gallium Oxide Single Crystal Materials" at the "Sub-Forum 2: Gallium Nitride and Other Power Semiconductor Technologies and Applications". He shared the latest progress in gallium oxide single crystal growth technology, Czochralski, casting and VB single crystal growth research and development. The report pointed out that there are many methods for growing gallium oxide crystals, and casting and VB methods have shown great potential for large-scale industrialization in terms of size, cost, quality and many other aspects.

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The casting method and other technologies developed by its team have successfully achieved the growth of large-size (6-inch) gallium oxide crystals with multiple crystal orientations and different doping, which can meet various epitaxy and device requirements. According to estimates, after mass production of its existing technology, the cost of 6-inch substrates can be reduced to less than 2,000 yuan, and further cost reduction will be completed within 2 to 3 years, providing the industry with high-quality, low-cost substrates. High-quality, low-cost substrates can assist peers in overcoming some key problems, such as defect behavior, p-type doping, and large-area, high-current devices. The industrialization process of gallium oxide will gradually accelerate, and the combination of substrates, epitaxy, devices, and applications should be closer to achieve transcendence.

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