Chinese semiconductor thread II

[sunnymaxi]

Maybe is overall in the semiconductor industry. With all the new fabs and expansion in materials, equipment and components.

that is definitely more than 500k if we consider direct or indirect jobs created by semi industry in last few years.. from tools expansion to materials and fabs. also record revenue to SME companies in 2024.. everyone is expanding the production.

but no. its not possible for Litho industry alone to create 500k jobs. i think it maybe a tying error.. could be in thousands range direct jobs in Litho industry if we talk about supply chain expansion as well. SMEE alone now has 4 digits(0000) people.

 

[LanceD23]

that is definitely more than 500k if we consider direct or indirect jobs created by semi industry in last few years.. from tools expansion to materials and fabs. also record revenue to SME companies in 2024.. everyone is expanding the production.

but no. its not possible for Litho industry alone to create 500k jobs. i think it maybe a tying error.. could be in thousands range direct jobs in Litho industry if we talk about supply chain expansion as well. SMEE alone now has 4 digits(0000) people.

Assuming both DUV and EUV suppliers and entire industry. Isn't each ASML litho has 100K+ components?

 

[GulfLander]

Assuming both DUV and EUV suppliers and entire industry. Isn't each ASML litho has 100K+ components?

Maybe some parts can be sourced from already existing companies?

 

[LanceD23]

Maybe some parts can be sourced from already existing companies?

EUV and DUV has totally different technology and components.

 

[sunnymaxi]

Assuming both DUV and EUV suppliers and entire industry. Isn't each ASML litho has 100K+ components?

that's true single EUV machine have 100,000 parts as per ASML's own statement but majority are non-critical parts and can be sourced from existing companies..

i m here counting critical components like light source , optics/mirrors , interferometer , wafer stage supply chain.. but there is one more thing, you can also find 2nd stage supply chain.. for example, for DUV lens you need multiple suppliers include that specific machine tool for optical precision. that machine tool itself has many critical parts. so you can go this extend to measure number of indirect jobs created by Lithography industry..

Entire Chinese Litho supply chain taking shape from multiple suppliers of components to critical machine tools for precision. this is creating thousands of new jobs and knowledge base.

 

[tphuang]

that is definitely more than 500k if we consider direct or indirect jobs created by semi industry in last few years.. from tools expansion to materials and fabs. also record revenue to SME companies in 2024.. everyone is expanding the production.

but no. its not possible for Litho industry alone to create 500k jobs. i think it maybe a tying error.. could be in thousands range direct jobs in Litho industry if we talk about supply chain expansion as well. SMEE alone now has 4 digits(0000) people.

I don't think we really need to debate this rumor much longer.

Some of the points seem plausible and others sound quite implausible.

We start sounding ridiculous when we try to justify some of those implausible ones.

 

[pbd456]

take it with a grain of salt. no idea how reliable it is . Here is what i am hearing

1)YMTC chopped off the order for 30 ASML systems and turned to domestic system.
2)SMIC 28nm expansion utilization of domestic equipments reached 92%
3)JiaSin ArF photoresist yield rate is 85% and has orders coming from Samsung too
4)domestic Photoresist market share increased from 3% to 41%
5)SMEE has an outstanding order 68 systems.
6)The EUV integration site is at Lingang, already in testing stage, first EUV rolls out third quarter 2025.
7)domestic Lithography equipment has created 500K jobs.
8)Ren Zhengfei reportedly promised president Xi in the recent meeting that China will have at least 70% self sufficiency in chips by 2028.
Huawei has made breakthrough in EUV mirrors.

What can asml sell to ytmc currently? 1970i?
What does ytmc need in lithography to make chips?

 

[OptimusLion]

Xi'an Unichip Microelectronics achieves breakthrough in chip packaging technology; patented clamping components help the development of smart devices

Xi'an Unicore Microelectronics Technology Co., Ltd. officially announced that it had obtained a patent called "A Compression Component for Chip Packaging", and the authorization announcement number of the patent is CN222530385U. The successful development of this technology marks a major breakthrough in the field of chip packaging and demonstrates the increasingly important position of Xi'an Unicore Microelectronics in the smart device industry chain. The application time of this patent is April 2024. After strict intellectual property review, Xi'an Unicore Microelectronics has now obtained legal technical protection, which not only verifies its R&D strength, but also lays the foundation for the market application of subsequent products.

 

[OptimusLion]

Jitong Technology applies for a patent to improve the resolution of lithography machines, significantly improving the resolution of lithography machines

JiTong Technology (Guangzhou) Co., Ltd. applied for a patent entitled "Improvement 4: A method for improving the resolution of a lithography machine", publication number CN119356036A, and application date July 2024.


The patent abstract shows that an improved method of 4 for improving the resolution of a lithography machine is provided. The present invention places an optical storage unit between the objective lens and the wafer. During exposure, the signal light passes through the lens system and is temporarily stored in the optical storage unit in the form of atomic spin waves. The energy of the light is converted into the energy of the atoms in the medium of the optical storage unit. The stored optical information is then released in the original direction and can be regarded as an ideal point light source. This point light source propagates in the original direction. Since the propagation path is not limited by the lens aperture, the effective aperture becomes larger, the corresponding Airy disk becomes smaller, and the minimum resolvable size is reduced. When this point light source reaches the wafer, the width of the Airy disk becomes narrower, and the resolution of the lithography machine is greatly improved. The benefit is that the aperture requirements for the lithography machine can be reduced. In order to achieve the same resolution requirements, the lens imaging system can adopt a small aperture, which invisibly reduces the difficulty and cost of manufacturing.

 

[OptimusLion]

Xinde Semiconductor's new patents are innovative and promote the process of chip miniaturization


Jiangsu Xinde Semiconductor Technology Co., Ltd. successfully applied for a patent called "A chip stacking packaging structure" through the State Intellectual Property Office. This new technology marks a major progress in chip miniaturization and will have a profound impact on the future development of electronic devices. The patent announcement number is CN222530417U and the application date is March 2024. The launch of this technology will help improve the application performance of mainstream chips in various electronic devices.

The patent abstract shows that the utility model discloses a chip stacking packaging structure, including a substrate, a main chip is flipped on the front of the substrate , a filler is filled between the main chip and the substrate, a solder ball 1 is planted on the pad 1 of the substrate around the main chip, a plastic sealing layer is provided on the front of the substrate, the plastic sealing layer covers the solder ball 1 and the main chip, but the top of the main chip and the solder ball 1 are exposed, a high-bandwidth memory chip is flipped on the top of the main chip, the top of the solder ball 1 is welded to the solder pad 2 of the high-bandwidth memory chip, and a groove is provided on the plastic sealing layer located on one side of the high-bandwidth memory chip, and a solder ball 2 is planted on the back of the substrate. The utility model flips the main chip such as the CPU/GPU on the substrate, and then realizes vertical short-distance interconnection between the substrate surface planting ball and the high-bandwidth memory chip through the stacking packaging technology. The packaging structure is smaller in size, and the subsequent assembly occupies less space, realizing chip miniaturization, and the electrical signal connection path is greatly shortened, achieving low latency in signal transmission.