Chinese semiconductor thread II

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Peking University Yang Xuelin and Shen Bo's team made important progress in the study of atomic-level dislocation climbing dynamics in GaN epitaxial materials​


The team led by Yang Xuelin and Shen Bo from the Institute of Condensed Matter Physics and Materials Physics, School of Physics, Peking University, the Center for Wide Bandgap Semiconductors, the State Key Laboratory of Artificial Microstructures and Mesoscopic Physics, and the Center for Nano-Optoelectronics Frontier Sciences have made important progress in the study of the atomic-scale climbing dynamics of dislocations in GaN epitaxial films . The relevant results were published online in Physical Review Letters on February 5, 2025 under the title " Atomistic Understanding of Dislocation Climb in Nitride Semiconductors: Role of Asymmetric Jogs".

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tonyget said:
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Affected by the new ban, another batch of Chinese IC design companies have their shipments suspended by TSMC

Recently, TSMC issued a formal notice to a large number of IC design companies in mainland China: from January 31, 2025, if the relevant products of 16/14 nanometers and below are not packaged in the "approved OSAT" in the BIS whitelist, and TSMC has not received a copy of the certification signature from the packaging factory, the shipment of these products will be suspended.

Jiwei.com verified with several affected mainland IC design companies, and many company executives said the news was true. Many companies said that it is indeed necessary to transfer the chips within the regulations to the approved packaging factory in the United States for packaging. For those companies that already have an account with the packaging factory, the impact is relatively small; while those companies without an account face the dilemma of seriously affecting the delivery time.

In addition, a person familiar with the matter revealed that some mainland IC design companies were also required to outsource all the tape-out, production, packaging and testing of some sensitive orders, and IC design companies cannot intervene in the entire production process. This series of requirements undoubtedly brought huge challenges to mainland IC design companies.
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This will put ton of pressure towards SMIC and others to built capacity which in turn will put ton of pressure towards Chinese equipment and materials suppliers to get better, especially SMEE, which in turn will put ton of pressure China semiconductor research institutions to accelerate development which in turn will put ton of pressure towards the government for more funding.
 
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