Chinese semiconductor thread II
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Zhejiang: Accelerate the construction progress of Fuxin Integrated Circuit Phase I and other projects
On January 14, 2025, at the third session of the 14th People's Congress of Zhejiang Province, Liu Jie, Acting Governor of Zhejiang Province, delivered a government work report. Integrated circuits and chips, as important components of advanced manufacturing and the digital economy, were mentioned many times.
The Government Work Report reviewed the work in 2024 and mentioned:
Accelerate the construction of major "thousands and trillions of yuan" projects, with 1,299 major projects completing investment of 1.4 trillion yuan and an investment completion rate of 129.6%; construction of projects such as the microcavity electronic paper display device and Jingling Reservoir started, and construction of projects such as the Xinlian Integration Phase III was accelerated ; projects such as the Hangzhou-Wenzhou High-speed Railway, the Shanghai-Suzhou-Lake High-speed Railway, and the Jiaxing Star Microelectronics Chip were completed and put into use .
The Government Work Report defines the goals, tasks and key tasks for 2025, and proposes:
- Promote the construction of major projects and further improve investment efficiency.
We will do a good job in planning and promoting the "two-heavy" projects. We will speed up the construction of the "two-heavy" projects that have already started, and iteratively improve the project library that is "implementable in the near future, has long-term reserves, and can be rolled over regularly" to ensure the continuity of the "two-heavy" construction. We will strengthen project service guarantees, make good use of special team attack, supervision services, and centralized start-up mechanisms, and promote the early start of new projects and the formation of more physical workload for projects under construction.
We will thoroughly implement the "Thousands of Projects and Trillion Yuan" project to expand effective investment. We will arrange more than 1,000 major projects and complete annual investment of more than 1 trillion yuan. We will promote the construction of projects such as Wenfu High-speed Railway, Quzhou Pioneer Intelligent, and Dream Robotics, speed up the construction of projects such as Tongsu Jiayong Railway and Fuxin Integrated Circuit Phase I , and ensure the completion and operation of projects such as Taizhou Qingtao Lithium Battery and Lishui Airport.
Strengthen the attraction of industrial projects and enterprise cultivation. Firmly establish the concept that projects are king and enterprises are the key, insist on attracting both domestic and foreign capital, and attracting both state-owned and private capital, support high-quality enterprises to increase capital and expand production, ensure that the growth rate of project investment is faster than the growth rate of GDP, the growth rate of manufacturing investment is faster than the growth rate of overall investment, the proportion of private investment is steadily increasing, the actual use of foreign capital accounts for a basically stable share of the country, and the number of business entities in the province increased by 5%, including a 5% increase in the number of enterprises.
The list of major projects in Shanghai in 2025 was released, and projects such as SMIC, Jetta Semiconductor, and Super Silicon Semiconductor were on the list
The list of major projects in Shanghai in 2025 was announced. The city plans to arrange 186 formal projects in 2025, including 66 science and technology industry projects, and 35 preparatory projects.
Science and technology industry (66 items)
It is planned to complete 10 projects, including Tesla's energy storage super factory and Hehui Optoelectronics' sixth-generation AMOLED production line capacity expansion project.
It is planned to start seven new projects, including Shanghai Superconducting's second-generation high-temperature superconducting tape production and headquarters base, and integrated circuit advanced ceramic components research and development and comprehensive application industrialization projects.
There are 49 projects under construction, including SMIC's 12-inch chip project, SMIC's Lingang 12-inch wafer foundry production line project, Jetta Semiconductor's special process production line project, Ultra Silicon Semiconductor's advanced logic process 300mm silicon wafer fully automatic intelligent production and R&D project, GigaDevice Semiconductor's 12-inch CIS integrated circuit R&D and industrialization project, Sunny Optical's 12-inch transparent substrate wafer AR glasses micro-nano optical product project, Shinsei Semiconductor's 300mm integrated circuit silicon wafer R&D and advanced manufacturing base project, Shanghai Lingang compound semiconductor 4-inch and 6-inch mass production line project, Shanghai Tianyue silicon carbide semiconductor material project, Shanghai Jiangfeng Lingang base electronic special materials industrialization project, Changdian Technology Lingang automotive-grade packaging and testing project, Shanghai Xingfu Electronic Materials Co., Ltd.'s 60,000 tons/year electronic chemicals project, etc.
Science and technology industry (66 items)
It is planned to complete 10 projects, including Tesla's energy storage super factory and Hehui Optoelectronics' sixth-generation AMOLED production line capacity expansion project.
It is planned to start seven new projects, including Shanghai Superconducting's second-generation high-temperature superconducting tape production and headquarters base, and integrated circuit advanced ceramic components research and development and comprehensive application industrialization projects.
There are 49 projects under construction, including SMIC's 12-inch chip project, SMIC's Lingang 12-inch wafer foundry production line project, Jetta Semiconductor's special process production line project, Ultra Silicon Semiconductor's advanced logic process 300mm silicon wafer fully automatic intelligent production and R&D project, GigaDevice Semiconductor's 12-inch CIS integrated circuit R&D and industrialization project, Sunny Optical's 12-inch transparent substrate wafer AR glasses micro-nano optical product project, Shinsei Semiconductor's 300mm integrated circuit silicon wafer R&D and advanced manufacturing base project, Shanghai Lingang compound semiconductor 4-inch and 6-inch mass production line project, Shanghai Tianyue silicon carbide semiconductor material project, Shanghai Jiangfeng Lingang base electronic special materials industrialization project, Changdian Technology Lingang automotive-grade packaging and testing project, Shanghai Xingfu Electronic Materials Co., Ltd.'s 60,000 tons/year electronic chemicals project, etc.
SiSheng Electronics embarks on a new journey in the semiconductor industry and builds a silicon material/silicon component project for etching equipment
hejiang SiSheng Electronics Co., Ltd. (hereinafter referred to as "SiSheng Electronics") has braved the wind and waves and embarked on a new journey. The company recently announced that it will build a new semiconductor polishing workshop and start the construction of silicon materials/silicon components for etching equipment. This strategic layout marks the in-depth expansion of SiSheng Electronics in the semiconductor field.
The project construction covers the foundation and core equipment. The hydropower project is built first to ensure the stable operation of the workshop. The core production line consists of equipment such as polycrystalline ingot furnace and rod-pulling machine, which completes the transformation from raw materials to high-precision silicon parts. The establishment of argon recovery station not only implements the concept of environmental protection, but also reduces costs and improves benefits.
In the global semiconductor market, the field of silicon components and silicon materials has always been the focus of Chinese manufacturers. In recent years, the development speed of Chinese manufacturers in this field has been remarkable, but they are relatively backward in silicon components. However, with the influence of factors such as the Sino-US confrontation, the demand for domestic silicon components from domestic Fab factories is growing, which provides a huge market space for domestic silicon component manufacturers. Sisheng Electronics has keenly captured this market opportunity and actively laid out the field of silicon materials/silicon components for etching equipment through new projects. It is expected to occupy a mainstream position in the domestic market and occupy an important share in the global market in the long run.
Source optimization method employing dynamic polarization aberration model for high-NA EUVL
Abstract
Scanning technology is widely used in current lithography. During scanning, any point on the wafer scanning through the field of view (FOV) is successively affected by varying levels of polarization aberrations (PAs) that depend on the position within the FOV. However, current computational lithography studies for extreme ultraviolet lithography (EUVL) neglect this effect of the “dynamic PA” caused by scanning. Consequently, the optimization results cannot meet the actual imaging requirements, leading to a decline in image quality for the lithographic projection objective, particularly in high numerical aperture (NA) EUVL systems. This paper establishes a dynamic PA model for NA0.55 EUVL and proposes a source optimization method employing this model to increase image quality. The model samples the FOV points in the scanning direction at equal intervals based on the characteristics of the EUVL pulsed lasers. Then, it calculated the images at different sampling points and the iterative exposure of the resist, considering the impact of PA from each sampling point. The optimization strategy of source parameters based on this model is realized. Experimental results demonstrate that this SO method effectively reduces pattern errors by 15.5%–28.2%, and the process window is expanded by 15.0%–22.2%.
2025! Beijing's top 10 semiconductors (project list)
The Beijing Municipal Development and Reform Commission introduced on the evening of the 20th that this year Beijing will focus on promoting 100 major scientific and technological innovation and modern industrial projects, 100 major infrastructure projects and 100 major projects to improve people's livelihood, using major projects to drive the expansion of effective investment, with a total investment of about 1.4 trillion yuan.
According to the relevant person in charge of the Beijing Municipal Development and Reform Commission, this year's key projects are to accelerate the improvement of the integrated circuit innovation ecosystem, optimize and strengthen the new energy vehicle industry, cultivate new growth points in the pharmaceutical and health industry, actively use digital technology and green technology to transform and upgrade traditional industries, and arrange 23 strategic emerging industries;
Build an innovation source and application highland for artificial intelligence, cultivate the first-mover advantage of the humanoid robot industry, consolidate and enhance the "South Arrow and North Star" industrial structure, build an innovative highland for the development of the hydrogen energy industry, proactively layout the 6G industry, and arrange 15 future industry projects such as the Super Intelligent Computing Artificial Intelligence Innovation Demonstration Park.
In Beijing’s 2025 “Three 100s” municipal key project plan, the semiconductor, chip, integrated circuit, and artificial intelligence related projects are as follows:
Semiconductor, chip, integrated circuit related projects
1. DRAM memory technology demonstration line project: a strategic emerging industry project.
2. Nortel Integrated 12-inch integrated circuit production line project: a strategic emerging industry project.
3. BOE's 6th generation new semiconductor display device production line project: a strategic emerging industry project.
4. Optoelectronic chip and device manufacturing base project: a strategic emerging industry project.
5. Shengjisheng High-end Equipment R&D and Manufacturing Base: Semiconductor Equipment Related Projects
6. The third-generation semiconductor silicon carbide substrate industrialization base construction (Phase II) project is located in Daxing District. It is a strategic emerging industry project and will build production plants, power centers and other facilities.
Artificial Intelligence Related Projects
1. Super Intelligent Computing Artificial Intelligence Innovation Demonstration Park: a future industry project.
2. Beijing Jingyizhuang Artificial Intelligence Public Computing Platform Computing Power Cluster and Supporting Facilities Construction Project: a future industry project.
3. Zhongguancun Cuihu Science Park Artificial Intelligence Innovation and Application Industrial Park: a future industry project.
4. Phase I of Zhongguancun (West Beijing) Artificial Intelligence Science and Technology Park: a future industry project.
According to the relevant person in charge of the Beijing Municipal Development and Reform Commission, this year's key projects are to accelerate the improvement of the integrated circuit innovation ecosystem, optimize and strengthen the new energy vehicle industry, cultivate new growth points in the pharmaceutical and health industry, actively use digital technology and green technology to transform and upgrade traditional industries, and arrange 23 strategic emerging industries;
Build an innovation source and application highland for artificial intelligence, cultivate the first-mover advantage of the humanoid robot industry, consolidate and enhance the "South Arrow and North Star" industrial structure, build an innovative highland for the development of the hydrogen energy industry, proactively layout the 6G industry, and arrange 15 future industry projects such as the Super Intelligent Computing Artificial Intelligence Innovation Demonstration Park.
In Beijing’s 2025 “Three 100s” municipal key project plan, the semiconductor, chip, integrated circuit, and artificial intelligence related projects are as follows:
Semiconductor, chip, integrated circuit related projects
1. DRAM memory technology demonstration line project: a strategic emerging industry project.
2. Nortel Integrated 12-inch integrated circuit production line project: a strategic emerging industry project.
3. BOE's 6th generation new semiconductor display device production line project: a strategic emerging industry project.
4. Optoelectronic chip and device manufacturing base project: a strategic emerging industry project.
5. Shengjisheng High-end Equipment R&D and Manufacturing Base: Semiconductor Equipment Related Projects
6. The third-generation semiconductor silicon carbide substrate industrialization base construction (Phase II) project is located in Daxing District. It is a strategic emerging industry project and will build production plants, power centers and other facilities.
Artificial Intelligence Related Projects
1. Super Intelligent Computing Artificial Intelligence Innovation Demonstration Park: a future industry project.
2. Beijing Jingyizhuang Artificial Intelligence Public Computing Platform Computing Power Cluster and Supporting Facilities Construction Project: a future industry project.
3. Zhongguancun Cuihu Science Park Artificial Intelligence Innovation and Application Industrial Park: a future industry project.
4. Phase I of Zhongguancun (West Beijing) Artificial Intelligence Science and Technology Park: a future industry project.
Unisoc's revenue hits record high in 2024, delivering 1.6 billion chips throughout the year
According to Xinhua Finance, Unisoc's sales revenue in 2024 exceeded 14.5 billion yuan, a record high, and achieved the delivery of 1.6 billion chips worldwide. At the same time, Unisoc's smartphone chip market share in the global market reached 13%, marking the improvement of its international competitiveness.
In the field of smartphone chips, Unisoc's 5G chip shipments have achieved rapid growth. At the same time, the shipments of 4G main chips have also exceeded the 100 million mark. The customer structure has been further optimized, and well-known companies such as vivo and Xiaomi have been successfully expanded. It is reported that Unisoc's 5G chip sales will increase by 82% year-on-year in 2024, and large-scale shipments will be achieved in 76 countries, successfully entering international markets such as Japan and India, and successfully applied to first-tier brands such as Motorola.
Chinese Semiconductor Equipment Manufacturers Set New Records
Recently, three leading Chinese semiconductor equipment manufacturers—AMEC (Advanced Micro-Fabrication Equipment Inc.), NAURA Technology Group, and ACM Research—released their latest 2024 financial forecasts and updates on new equipment developments.
From revenue and profit changes to R&D investments, new equipment launches, and capacity expansion, the reports reflect strong demand in the China market and significant progress in the localization of the semiconductor equipment industry.
AMEC: Steady Growth in Etching Business, Breakthroughs in Thin Film Equipment
AMEC forecasts 2024 revenue of RMB 9.065 billion, a year-on-year growth of 44.7%. In Q4 alone, revenue is expected to reach RMB 3.06 billion, up 60% year-on-year. However, net profit for 2024 is estimated at RMB 1.6 billion, representing a 10.6% decline compared to the previous year.
The drop in profit is attributed to a substantial increase in R&D spending, which will total RMB 2.45 billion in 2024—a 94.13% rise from 2023—accounting for 27.03% of total revenue.
In 2025, AMEC plans to significantly ramp up R&D efforts by investing in a new wholly-owned subsidiary, AMEC Semiconductor Equipment (Chengdu) Co., Ltd., located in Chengdu High-tech Zone.
This facility will serve as a R&D and production base as well as the Southwest China headquarters.
The project, with a total investment of approximately RMB 3.05 billion from 2025 to 2030, will focus on the development and production of advanced equipment for high-end logic and memory chips, including chemical vapor deposition (CVD) equipment, atomic layer deposition (ALD) equipment, and other critical tools.
ACM Research: Robust Demand in the China Market Drives Revenue Growth by Over 50%
According to ACM Research’s January 14 announcement, its 2024 revenue is projected to range between RMB 5.6 billion and RMB 5.88 billion, a year-on-year increase of 44.02% to 51.22%.
In the first three quarters of 2024, the company already achieved revenue of RMB 3.977 billion, with a net profit of RMB 758 million. This growth is driven primarily by the recovery of the global semiconductor industry and strong demand in the China market, resulting in a solid backlog of orders. ACM Research also projects 2025 revenue to be between RMB 6.5 billion and RMB 7.1 billion.
ACM Research specializes in semiconductor cleaning and electroplating equipment, vertical furnace systems, and advanced packaging wet process equipment, covering wafer manufacturing and advanced packaging sectors.
NAURA: Expanding Across Multiple Segments, Accelerating Capacity Expansion and Investments
NAURA Technology Group’s 2024 performance forecast projects revenue between RMB 27.6 billion and RMB 31.78 billion, reflecting a year-on-year growth of 25.00% to 43.93%.
Net profit attributable to shareholders is expected to be RMB 5.17 billion to RMB 5.95 billion, an increase of 32.60% to 52.60%. Excluding non-recurring items, net profit is estimated at RMB 5.12 billion to RMB 5.89 billion, representing growth of 42.96% to 64.46%.
This performance growth is primarily attributed to significant achievements in new product development. Key products, such as capacitively coupled plasma (CCP) etching equipment, plasma-enhanced chemical vapor deposition (PECVD) systems, atomic layer deposition (ALD) vertical furnaces, and stacked wafer cleaning systems, have been successfully integrated into customer production lines and achieved large-scale sales.
Additionally, NAURA has successfully developed high-density plasma CVD (HDPCVD), dual-damascene CCP etchers, and high-k dielectric ALD systems, which have been stably mass-produced for multiple clients.