Jingcun Technology received Pre-IPO round of financing to accelerate the localization of storage chips
According to Shangqi Capital, Shenzhen Jingcun Technology Co., Ltd. ("Jingcun Technology") recently announced the completion of its Pre-IPO round of financing. The financing was led by Shangqi Capital, followed by Rongyi Capital, Hefei Construction Investment, Xingzheng Capital, Yishan Investment and other institutions. The specific amount of financing was not disclosed. The funds will be used to further promote the company's technology research and development and market expansion.
Founded in 2016, Jingcun Technology is a national high-tech enterprise integrating design, R&D, testing and sales of storage chips. It owns consumer-grade storage brands and high-end automotive and industrial storage brands. Jingcun's subsidiary Miaocun Technology has flash memory controller chip R&D capabilities and firmware development capabilities, and is a national "specialized, sophisticated and innovative" small giant enterprise. Jingcun has complete storage solution capabilities and has its own brand Rayson. Its products include NAND FLASH controller chips, eMMC, UFS, DDR3/4, LPDDR4/4X, LPDDR5/5X, eMCP, UMCP, SSD, etc., covering consumer-grade, industrial-grade, and automotive-grade storage chips, which are widely used in mobile phones, tablets, notebooks, educational electronics, Android boxes, smart terminals, smart homes, Internet of Things, smart medical care, industrial control equipment, automotive electronics and other market fields.
Shangqi Capital pointed out that Jingcun Technology is one of the few storage module manufacturers in China that can achieve national localization of "wafer + main control + module", and is in an industry-leading position in the field of embedded memory modules and flash memory main control. The company has the independent research and development capabilities of main control chips, which are rare among module manufacturers, and is in a technologically leading position in the field of domestic automotive-grade UFS main control chips. In the future, the company is expected to achieve localization substitution of automotive-grade memory, thereby playing an important role in ensuring supply chain security.