Chinese semiconductor thread II
- Thread starter vincent
- Start date
These rules don't go into effect till next year. Also half of Europe is restricted. Don't know how one can enforce that. And since oracle is against it and ellison is a Trump donor. Expect these rules to last till March. There is a lot to say but these restrictions have turnarounds or they can't be enforced. Let's see if I can make a full paragraph and post in a few days.
Solid State UV/DUV laser manufacturer "Inno-Laser" delivers key Micro LED manufacturing equipment.
Recently, Inno Laser delivered key Micro LED equipment to a new customer. The products delivered this time are laser decrystallineing and laser cutting equipment, which indicates that the company is gaining recognition from more and more partners.
Laser crystallization is a key process in the "stripping-transfer-decrystallization-recrystallization-eutectic" process line. Its role is to use leading laser beam shaping and focusing technology, supplemented by a platform control system, to accurately and efficiently remove defective chips, foreign matter, residual glue, etc., to ensure that the grains are not damaged and no dust is left. It is of great significance to improve the yield and efficiency of mass transfer and repair processes.
Laser cutting can meet the slitting requirements of mask plates, MIP packaging, substrates of various materials and other scenarios in the multi-stage process of the "stripping-transfer-decrystallization-recrystallization-eutectic" process line. It can achieve high-precision and high-efficiency cutting effects, and has the advantages of small thermal impact, small mechanical stress and high surface cleanliness.
Thanks to its deep understanding of Micro LED whole-line technology, the company has targeted the pain points of industrialization and innovatively adopted self-developed solid laser technology, thus continuously making breakthroughs in this business field, and has recently received support from the local "Special Project for Independent Innovation Industry Development". At present, the company has completed the development of key equipment and processes and material verification work covering the "peeling-transfer-decrystallization-recrystallization-eutectic" process line as scheduled, and can undertake customers' proofing needs and accelerate exchanges with multiple partners.
With the world's advanced solid-state UV and deep UV laser and optical system technologies, a deep understanding of the interaction mechanism between light and materials, and completely self-developed product capabilities, the mass transfer process line developed by the company is expected to have significant advantages in performance, cost, and customization. Based on this process line, the company will work closely with its partners to jointly accelerate the industrialization of Micro LED technology.
266nm high frequency DUV Laser.
Gases for Excimer Lasers for DUV lithography.
Yingde Gases’ Excimer Laser Gases Received Another Industrial Approval
Shanghai Jiliang Standard Reference Gases Co., Ltd., a subsidiary of Yingde Gases, recently successfully passed the machine test of argon and fluorine excimer laser gases of Shanghai Integrated Circuit Research & Development Center (herein referred to as ICRD). This is another industrial recognition of Yingde Gases’ excimer laser gases after certified by Coherent in 2023, a further breakthrough for Yingde Gases to support the development of China’s semiconductor industry.
Excimer laser is a type of infrared light with a wide range of applications in heavy industry, medicine, healthcare, and scientific research. Yingde Gases’ excimer laser gases have already been applied widely in these sectors. Possessing a solid technical foundation and robust R&D deployment, Yingde Gases is able to control the gas mixture precisely, thereby satisfying laser excitation criteria. The corporate relied on its advanced process technology and high-stability products to pass the ICRD test, expediting the domestic production of excimer laser gases.
As a forerunner in the campaign to manufacture domestic alternatives to products previously sourced overseas, Yingde Gases strives to innovate and achieve new breakthroughs in advanced manufacturing. Laser gases mixture is a core gas in chip manufacturing. With ICRD’s approval, Yingde Gases’ laser gas mixtures will be able to meet the needs of the domestic semiconductor materials market, offering clients even more options. Going forward, Yingde Gases will continue to expand in the areas of special gases for high-end electronics as well as gas mixtures for laser applications, helping to secure key technologies for domestic production.
Yingde Gases’ Excimer Laser Gases Received Another Industrial Approval
Shanghai Jiliang Standard Reference Gases Co., Ltd., a subsidiary of Yingde Gases, recently successfully passed the machine test of argon and fluorine excimer laser gases of Shanghai Integrated Circuit Research & Development Center (herein referred to as ICRD). This is another industrial recognition of Yingde Gases’ excimer laser gases after certified by Coherent in 2023, a further breakthrough for Yingde Gases to support the development of China’s semiconductor industry.
Excimer laser is a type of infrared light with a wide range of applications in heavy industry, medicine, healthcare, and scientific research. Yingde Gases’ excimer laser gases have already been applied widely in these sectors. Possessing a solid technical foundation and robust R&D deployment, Yingde Gases is able to control the gas mixture precisely, thereby satisfying laser excitation criteria. The corporate relied on its advanced process technology and high-stability products to pass the ICRD test, expediting the domestic production of excimer laser gases.
As a forerunner in the campaign to manufacture domestic alternatives to products previously sourced overseas, Yingde Gases strives to innovate and achieve new breakthroughs in advanced manufacturing. Laser gases mixture is a core gas in chip manufacturing. With ICRD’s approval, Yingde Gases’ laser gas mixtures will be able to meet the needs of the domestic semiconductor materials market, offering clients even more options. Going forward, Yingde Gases will continue to expand in the areas of special gases for high-end electronics as well as gas mixtures for laser applications, helping to secure key technologies for domestic production.
Research on process-induced effect in 14-nm FinFET gate formation and digital unit optimization design
Fudan University
Abstract: The advanced fin-shaped field-effect transistor (FinFET) technology offers higher integration density and stronger channel control capabilities, however, more complex process effects are also introduced which have significant influence on device performance. To address these issues, we complete a design-technology co-optimization (DTCO) focused on FinFET, including both process-induced effect during gate formation and corresponding digital unit optimization design. The 14 nm FinFET complementary metal oxide semiconductor (CMOS) technology is used to illustrate the sensitivity of transistor performance to process-induced effect, specifically the poly pitch effect (PPE) and cut poly effect (CPE). Predictive technology computer aided design (TCAD) simulations have been carried out to evaluate the transistor performance in advance. Based on the results, optimizations in digital unit design is proposed. Fall delay of the digital unit inverter is decreased by 0.7%, and the rise delay is decreased by 2.1%. For multiple selector (MUX2NV), the delay decreases by 4.64% for rise and 3.56% for drop, respectively.
Abstract: The advanced fin-shaped field-effect transistor (FinFET) technology offers higher integration density and stronger channel control capabilities, however, more complex process effects are also introduced which have significant influence on device performance. To address these issues, we complete a design-technology co-optimization (DTCO) focused on FinFET, including both process-induced effect during gate formation and corresponding digital unit optimization design. The 14 nm FinFET complementary metal oxide semiconductor (CMOS) technology is used to illustrate the sensitivity of transistor performance to process-induced effect, specifically the poly pitch effect (PPE) and cut poly effect (CPE). Predictive technology computer aided design (TCAD) simulations have been carried out to evaluate the transistor performance in advance. Based on the results, optimizations in digital unit design is proposed. Fall delay of the digital unit inverter is decreased by 0.7%, and the rise delay is decreased by 2.1%. For multiple selector (MUX2NV), the delay decreases by 4.64% for rise and 3.56% for drop, respectively.
I have a hunch that the rumored foreign buyer of SSA800A duvl is either GF or STMicroelectronics in China.
Tim Breen, GF's Chief Operating Officer, told Yicai Global that the company has no intention of building manufacturing facilities or entering basic licensing agreements in China. Instead, GF plans to partner with local manufacturers to improve production quality. Analysts note that GF is targeting Chinese firms with production capacity but limited advanced technologies, alongside exploring partnerships with OEMs and chip design companies.
STMicroelectronics has also deepened its presence in China. In June 2023, CEO Jean-Marc Chery announced a partnership with Sanan Optoelectronics to expand an 8-inch SiC wafer fab. By November 2024, the company established a new collaboration with Hua Hong Semiconductor, emphasizing the competitive advantage of localized manufacturing.
Other European chipmakers, including Infineon Technologies and NXP Semiconductors, have similarly intensified their investments in "Made in China" initiatives by late 2024.
These strategic pivots reflect the challenges European companies face amid the US-China tech rivalry. Despite geopolitical tensions, Chinese orders remain critical for semiconductor manufacturers. Nvidia CEO Jensen Huang captured this dependency in a Financial Times interview, likening the absence of Chinese clients to " a swimming pool in a new fab but no water to swim in."
Underutilized production capacity continues to burden European firms and may partly explain the stalled STMicroelectronics-GF wafer fab project in France. Industry experts have long cautioned that Europe's limited downstream electronics demand is insufficient to support large-scale capacity expansions envisioned by the European Chips Act.
1 day ago — Industry experts have long cautioned that Europe's limited downstream electronics demand is insufficient to support large-scale capacity ...
China market beckons
In October 2024, GF held its annual technology summit in Shanghai, underscoring its strategic focus on the Chinese market. Mike Cadigan, GF's Chief Corporate and Government Affairs Officer, highlighted China's importance, while Kay Chai Ang, the newly appointed President of Asia-Pacific and Chairman of GF China, introduced plans to expand regional operations.Tim Breen, GF's Chief Operating Officer, told Yicai Global that the company has no intention of building manufacturing facilities or entering basic licensing agreements in China. Instead, GF plans to partner with local manufacturers to improve production quality. Analysts note that GF is targeting Chinese firms with production capacity but limited advanced technologies, alongside exploring partnerships with OEMs and chip design companies.
STMicroelectronics has also deepened its presence in China. In June 2023, CEO Jean-Marc Chery announced a partnership with Sanan Optoelectronics to expand an 8-inch SiC wafer fab. By November 2024, the company established a new collaboration with Hua Hong Semiconductor, emphasizing the competitive advantage of localized manufacturing.
Other European chipmakers, including Infineon Technologies and NXP Semiconductors, have similarly intensified their investments in "Made in China" initiatives by late 2024.
These strategic pivots reflect the challenges European companies face amid the US-China tech rivalry. Despite geopolitical tensions, Chinese orders remain critical for semiconductor manufacturers. Nvidia CEO Jensen Huang captured this dependency in a Financial Times interview, likening the absence of Chinese clients to " a swimming pool in a new fab but no water to swim in."
Underutilized production capacity continues to burden European firms and may partly explain the stalled STMicroelectronics-GF wafer fab project in France. Industry experts have long cautioned that Europe's limited downstream electronics demand is insufficient to support large-scale capacity expansions envisioned by the European Chips Act.
1 day ago — Industry experts have long cautioned that Europe's limited downstream electronics demand is insufficient to support large-scale capacity ...